公开(公告)号：JP5299931B2

公开(公告)日：2013-09-25

申请号：JP2011285855

申请日：2011-12-27

Applicant: 致茂電子股▲分▼有限公司Chroma Ate Inc.

Inventor： 麒任 陳 ,  姜正 范 ,  立勳 陳

IPC: G09F9/00

CPC classification number: G01R31/2849 ,  G01R31/2817 ,  G09G3/006

Abstract: A testing apparatus includes a thermal control chamber including a test room, which temperature is controlled within a testing temperature range; a carrier frame including a direction guiding unit installed securely within the test room and formed with one guiding groove and a carrier rod extending through the guiding groove in the direction guiding unit; and a clamping unit mounted on the carrier rod for clamping a display-panel module securely, wherein, movement of the carrier rod transversely within the guiding groove relative to the direction guiding unit results in disposing the display-panel module to extend along one of several testing directions for undergoing a burn-in test.

公开(公告)号：WO2008057518A3

公开(公告)日：2008-05-15

申请号：PCT/US2007/023336

申请日：2007-11-01

Applicant: CHROMA ATE, INC.

Inventor： TSENG, I-shih

IPC: H05K7/20

Abstract: It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(ρu m d)/μ≥2,500; with p being the fluid density, u m being the free-stream fluid velocity, d being the pipe distance or diameter, μ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

公开(公告)号：WO2008057519A2

公开(公告)日：2008-05-15

申请号：PCT/US2007/023337

申请日：2007-11-01

Applicant: CHROMA ATE, INC.

Inventor： TSENG, I-shih

IPC: H05K7/20

CPC classification number: H01L23/467 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: It s a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(ρu m d)/μ≥2,500; with ρ being the fluid density, u m being the free- stream fluid velocity, d being the pipe distance or diameter, μ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract translation:

这是一种顶部安装表面气流散热器，利用由气隙隔开的上部天花板壁，与产生气流的加热装置（微处理器）的上表面一起工作。 这是一个简单的设备，使用雷诺方程Re =（ρum d）/μ≥2,500以低成本; 其中ρ是流体密度，um是自由流体流速，d是管道距离或直径，μ是流体粘度。 由于气流产生空气湍流，它会导致空气中频繁的热交换。 它也会导致不同空气层内的明显温度变化。 因此，它大大增加了散热的效率。 它只需要输入空气。 操作简单，可以使用更高的发热设备。 因此，它促进了这种顶部安装散热装置在电路板组件安装中的替代使用。

公开(公告)号：WO2008057519A3

公开(公告)日：2008-10-02

申请号：PCT/US2007023337

申请日：2007-11-01

Applicant: CHROMA ATE INC

Inventor： TSENG I-SHIH

IPC: H05K7/20

CPC classification number: H01L23/467 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: It s a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(?u m d)/µ=2,500; with ? being the fluid density, u m being the free- stream fluid velocity, d being the pipe distance or diameter, µ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract translation: 它是一种顶部安装表面气流散热器，利用由气隙隔开的上部顶壁，与加热装置（微处理器）的上表面一起产生气流。 这是一种简单的设备，使用雷诺方程Re =（？u m D d）/μ= 2,500，成本低廉; 与？ 作为流体密度，u> m是自由流体流速，d是管道距离或直径，μ是流体粘度。 由于气流产生空气湍流，导致空气中频繁的热交换。 它也会导致不同层次空气中明显的温度变化。 因此，它大大增加了散热的效率。 它只需要空气的输入。 操作简单，可以使用更高的发热装置。 因此，它可以在电路板组件的安装中促进该顶部安装散热装置的替代使用。

公开(公告)号：WO2008057518A2

公开(公告)日：2008-05-15

申请号：PCT/US2007023336

申请日：2007-11-01

Applicant: CHROMA ATE INC

Inventor： TSENG I-SHIH

IPC: H05K7/20

CPC classification number: H01L23/467 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(?u m d)/µ=2,500; with p being the fluid density, u m being the free-stream fluid velocity, d being the pipe distance or diameter, µ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract translation: 它是一种顶部安装表面气流散热器，利用由气隙隔开的上部顶壁，与加热装置（微处理器）的上表面一起产生气流。 这是一种简单的设备，使用雷诺方程Re =（？u m D d）/μ= 2,500，成本低廉; 其中p是流体密度，u是自由流体流速，d是管道距离或直径，μ是流体粘度。 由于气流产生空气湍流，导致空气中频繁的热交换。 它也会导致不同层次空气中明显的温度变化。 因此，它大大增加了散热的效率。 它只需要空气的输入。 操作简单，可以使用更高的发热装置。 因此，它可以在电路板组件的安装中促进该顶部安装散热装置的替代使用。

公开(公告)号：EP4556870A1

公开(公告)日：2025-05-21

申请号：EP24211319.9

申请日：2024-11-07

Applicant: Chroma ATE Inc.

Inventor： Chiu, I-Chang ,  Chien, Hung-Ta ,  Lin, Yu-Shuan ,  Hsu, Shih-Min ,  Chen, Li-Yang ,  Ou, Tsung-Hsien

IPC: G01J3/46 ,  G01B11/25 ,  G01M11/02 ,  G03B21/26 ,  G01J3/10

Abstract: A system and a method for calibration of optical measurement devices are described. In one embodiment, the optical measurement device (CM) comprises an imaging lens (CL), and the calibration system (1) includes a projection light source (2), a lens module (4), and a projection element (3). The light emitted from the projection light source (2) passes through the projection element (3) and is projected by the lens module (4), and then captured by the imaging lens (CL) of the optical measurement device (CM). The exit pupil (ExP) of the lens module (4) in the calibration system (1) is coincident with the entrance pupil (EnP) of the imaging lens (CL) of the optical measurement device (CM), providing a compact and highly efficient optical calibration mechanism.

公开(公告)号：EP4354187A1

公开(公告)日：2024-04-17

申请号：EP23197237.3

申请日：2023-09-13

Applicant: Chroma ATE Inc.

Inventor： Hsieh, Cheng Chih ,  Wu, Tien Chi ,  Lee, Ming-Long ,  Lin, Yu-Hsuan ,  Lin, Tsung-I ,  Ma, Chien-Hao

IPC: G02B5/04 ,  G01B11/26 ,  G01B11/27

CPC classification number: G02B5/04 ,  G01B11/26 ,  G01B11/27

Abstract: The present invention relates to six-degree-of-freedom error correction method and apparatus. The apparatus comprises a six-axis correction stage, an auto-collimation measurement device, a light splitter, a telecentric image measurement device, and a controller. The six-axis correction stage is used for carrying a device under test; the auto-collimation measurement device is arranged above the six-axis correction stage along a measurement optical axis; the light splitter is arranged on the measurement optical axis and is interposed between the six-axis correction stage and the auto-collimation measurement device; the telecentric image measurement device is arranged on one side of the measurement optical axis and corresponds to the light splitter. The method controls the six-axis correction stage to correct rotation errors in at least two degrees of freedom of the device under test according to a measurement result of the auto-collimation measurement device, and controls the six-axis correction stage to correct translation and yaw errors in at least three degrees of freedom of the device under test according to a measurement result of the telecentric image measurement device by means of the controller.

公开(公告)号：US20250040095A1

公开(公告)日：2025-01-30

申请号：US18660542

申请日：2024-05-10

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Yu-Wei Chuang ,  I-Ching Tsai

IPC: H05K7/20 ,  G01R1/04

Abstract: A phase-change temperature regulating system and an electronic device testing apparatus and method are described. In an embodiment, the system uses a temperature regulating fluid chamber containing a temperature regulating fluid to allow the temperature regulating fluid to cover at least a part of at least one surface of an electronic component. When a temperature of the electronic component reaches a boiling point of the temperature regulating fluid, the temperature regulating fluid becomes steam through a phase change to transfer heat energy outward from the electronic component, and condenses on an inner surface of the fluid chamber to further transfer heat energy of the steam to a temperature-regulating apparatus. The condensed temperature regulating fluid flows back to the temperature regulating fluid, thereby continuously circulating.

公开(公告)号：US12103789B2

公开(公告)日：2024-10-01

申请号：US17816086

申请日：2022-07-29

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming Chen ,  Jui-Hsiung Chen ,  Yi-Sheng Xu

IPC: G01R31/28 ,  B65G47/90 ,  G01N3/04 ,  H01L21/67 ,  H01L21/673 ,  H01L21/683 ,  H05K13/04

CPC classification number: B65G47/905 ,  G01N3/04 ,  G01R31/2867 ,  G01R31/2874 ,  G01R31/2887 ,  G01R31/2893 ,  H01L21/67236 ,  H01L21/67333 ,  H01L21/6838 ,  H05K13/0408

Abstract: The present invention relates to an electronic device pick-and-place system and an electronic device testing apparatus having the same, comprising a plurality of pick-and-place heads, a plurality of negative pressure generators and an air pressure regulating valve. Each pick-and-place head has a pick-and-place port; the plurality of negative pressure generators are communicated with the plurality of pick-and-place ports of the plurality of pick-and-place heads respectively; an inlet end of the air pressure regulating valve is communicated with an air pressure source, and an outlet end of the air pressure regulating valve is communicated with the plurality of negative pressure generators; the air pressure regulating valve can be used to adjust the suction forces of the pick-and-place ports of the pick-and-place heads in a batch. Accordingly, the suction forces and blowing forces of the pick-and-place ports of the pick-and-place heads can be adjusted in a batch.

公开(公告)号：US12093014B2

公开(公告)日：2024-09-17

申请号：US17580705

申请日：2022-01-21

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Wei-Cheng Kuo ,  Chien-Ming Chen ,  Xin-Yi Wu

IPC: G05B19/401 ,  G01B21/04

CPC classification number: G05B19/401 ,  G01B21/042

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.