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    熱光夾頭 THERMAL OPTICAL CHUCK
    93.
    发明专利
    熱光夾頭 THERMAL OPTICAL CHUCK 失效
    热光夹头 THERMAL OPTICAL CHUCK

    公开(公告)号：TW200540426A

    公开(公告)日：2005-12-16

    申请号：TW094117335

    申请日：2005-05-27

    Applicant: 卡斯凱德微科技公司 CASCADE MICROTECH, INC.

    Inventor： 朗波格 RUMBAUGH, SCOTT

    IPC: G01R

    CPC classification number: G01R1/0458 ,  G01R31/286 ,  G01R31/2891

    Abstract: 利用熱光夾頭提供在測試下可加熱裝置下面之可進出光徑，此夾頭包括透明電阻體，定置在配置於探測站內支持裝置用之透明板上。

    Abstract in simplified Chinese: 利用热光夹头提供在测试下可加热设备下面之可进出光径，此夹头包括透明电阻体，定置在配置于探测站内支持设备用之透明板上。

    PROBE HEAD ASSEMBLIES AND PROBE SYSTEMS FOR TESTING INTEGRATED CIRCUIT DEVICES
    96.
    发明申请
    PROBE HEAD ASSEMBLIES AND PROBE SYSTEMS FOR TESTING INTEGRATED CIRCUIT DEVICES 审中-公开
    用于测试集成电路器件的探头组件和探头系统

    公开(公告)号：WO2017218158A1

    公开(公告)日：2017-12-21

    申请号：PCT/US2017/034485

    申请日：2017-05-25

    Applicant: CASCADE MICROTECH, INC.

    Inventor： SALMON, Jay ,  SWART, Roy, E. ,  LIEW, Brandon

    IPC: G01R1/073 ,  G01R31/02 ,  G01R31/28

    CPC classification number: G01R31/2887 ,  G01R1/07378

    Abstract: Probe head assemblies and probe systems for testing integrated circuit devices are disclosed herein. In one embodiment, the probe head assemblies include a contacting structure and a space transformer assembly, in another embodiment, the probe head assemblies include a contacting structure, a suspension system, a flex cable interface, and a space transformer including a space transformer body and a flex cable assembly. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, and a planarization layer. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, a suspension system, a platen, a printed circuit board, a first plurality of signal conductors configured to convey a first plurality of signals external to the space transformer, and a second plurality of signal conductors configured to convey a second plurality of signals via the space transformer. The probe systems include the probe head assemblies.

    Abstract translation: 这里公开了用于测试集成电路器件的探针头组件和探针系统。 在一个实施例中，探头组件包括接触结构和空间变换器组件。在另一个实施例中，探头组件包括接触结构，悬挂系统，柔性电缆接口以及包括空间变换器主体的空间变换器和 柔性电缆组件。 在另一个实施例中，探头组件包括接触结构，空间变换器和平坦化层。 在另一个实施例中，探针头组件包括接触结构，空间变换器，悬架系统，台板，印刷电路板，第一多个信号导体，第一多个信号导体被配置为将第一多个信号传送到空间变换器的外部，以及 第二多个信号导体，被配置为经由所述空间变换器传送第二多个信号。 探头系统包括探头组件。

    SPACE TRANSFORMERS, PLANARIZATION LAYERS FOR SPACE TRANSFORMERS, METHODS OF FABRICATING SPACE TRANSFORMERS, AND METHODS OF PLANARIZING SPACE TRANSFORMERS
    97.
    发明申请
    SPACE TRANSFORMERS, PLANARIZATION LAYERS FOR SPACE TRANSFORMERS, METHODS OF FABRICATING SPACE TRANSFORMERS, AND METHODS OF PLANARIZING SPACE TRANSFORMERS 审中-公开
    空间变换器，空间变换器的平面化层，制造空间变换器的方法以及平面化空间变换器的方法

    公开(公告)号：WO2017196830A1

    公开(公告)日：2017-11-16

    申请号：PCT/US2017/031730

    申请日：2017-05-09

    Applicant: CASCADE MICROTECH, INC.

    Inventor： SWART, Roy, E. ,  SALMON, Jay ,  LIEW, Brandon

    IPC: H05K3/32 ,  B81B7/00 ,  B81C1/00 ,  G01R1/02 ,  G01R1/04 ,  G01R1/073 ,  G01R31/02

    CPC classification number: H01F27/2804 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2889 ,  H01F41/041 ,  H05K3/368 ,  H05K3/4007 ,  H05K2201/10378

    Abstract: Space transformers, planarization layers for space transformers, methods of fabricating space transformers, and methods of planarizing space transformers are disclosed herein. In one embodiment, the space transformers include a space transformer assembly including a first rigid space transformer layer, a second rigid space transformer layer, and an attachment layer that extends between the first rigid space transformer layer and the second rigid space transformer layer. In another embodiment, the space transformers include a space transformer body and a flex cable assembly. The planarization layer includes an interposer, a resilient dielectric layer, a planarized rigid dielectric layer, a plurality of holes, and an electrically conductive paste extending within the plurality of holes. In one embodiment, the methods include methods of fabricating the space transformer assembly. In another embodiment, the methods include methods of planarizing a space transformer.

    Abstract translation: 本文公开了用于空间变换器的空间变换器，平坦化层，制造空间变换器的方法以及平面化空间变换器的方法。 在一个实施例中，空间变换器包括空间变换器组件，其包括第一刚性空间变换器层，第二刚性空间变换器层以及在第一刚性空间变换器层和第二刚性空间变换器层之间延伸的附接层。 在另一个实施例中，空间变换器包括空间变换器本体和柔性电缆组件。 平坦化层包括内插器，弹性介电层，平坦化刚性介电层，多个孔以及在多个孔内延伸的导电膏。 在一个实施例中，该方法包括制造空间变换器组件的方法。 在另一个实施例中，这些方法包括平坦化空间变换器的方法。

    SHIELDED PROBE SYSTEMS WITH CONTROLLED TESTING ENVIRONMENTS
    98.
    发明申请
    SHIELDED PROBE SYSTEMS WITH CONTROLLED TESTING ENVIRONMENTS 审中-公开
    具有受控测试环境的屏蔽探针系统

    公开(公告)号：WO2017176508A1

    公开(公告)日：2017-10-12

    申请号：PCT/US2017/024580

    申请日：2017-03-28

    Applicant: CASCADE MICROTECH, INC.

    Inventor： TEICH, Michael ,  STOLL, Karsten ,  CLAUSS, Walter Matthias ,  SCHMIEDCHEN, Swen

    IPC: G01R1/18 ,  G01R1/04 ,  G01R31/16 ,  G01R31/26

    CPC classification number: G01R1/18 ,  G01N27/42 ,  G01N31/02 ,  G01R1/06711 ,  G01R1/07378 ,  G01R1/07392 ,  G01R1/44

    Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.

    Abstract translation: 本文公开了屏蔽探针系统。 屏蔽探针系统被配置为测试被测器件（DUT）并且包括限定外壳体积的外壳，具有台表面的平移台，从台表面延伸的衬底支撑堆叠，导电屏蔽结构， 隔离结构和热屏蔽结构。 衬底支撑堆叠包括导电支撑表面和温控卡盘。 导电屏蔽结构限定屏蔽体积。 隔离结构将导电屏蔽结构与外壳和平移台电隔离。 热屏蔽结构在外壳体积内并且至少部分地在外壳和基板支撑叠层之间延伸。

    PROBE SYSTEMS, STORAGE MEDIA, AND METHODS FOR WAFER-LEVEL TESTING OVER EXTENDED TEMPERATURE RANGES
    99.
    发明申请
    PROBE SYSTEMS, STORAGE MEDIA, AND METHODS FOR WAFER-LEVEL TESTING OVER EXTENDED TEMPERATURE RANGES 审中-公开
    探针系统，存储介质以及用于在扩展温度范围内进行晶片级测试的方法

    公开(公告)号：WO2017172917A1

    公开(公告)日：2017-10-05

    申请号：PCT/US2017/024748

    申请日：2017-03-29

    Applicant: CASCADE MICROTECH, INC.

    Inventor： MCMULLEN, Timothy, Allen ,  SHEPLER, Jeffery, Allan ,  VANDER GIESSEN, Clint

    IPC: G01R1/04 ,  G01R1/44 ,  G01R1/073 ,  G01R31/02 ,  G01R31/20

    Abstract: Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges are disclosed herein. The methods are configured to test a plurality of devices under test (DUTs) present on a substrate. The probe systems are programmed to perform the methods. The storage media include computer-readable instructions that direct a probe system to perform the methods.

    Abstract translation: 本文公开了用于在扩展温度范围上进行晶片级测试的探针系统，存储介质和方法。 该方法被配置为测试存在于衬底上的多个待测试器件（DUT）。 探针系统被编程为执行这些方法。 存储介质包括指示探测系统执行这些方法的计算机可读指令。

    PROBE SYSTEM AND METHODS INCLUDING ACTIVE ENVIRONMENTAL CONTROL
    100.
    发明申请
    PROBE SYSTEM AND METHODS INCLUDING ACTIVE ENVIRONMENTAL CONTROL 审中-公开
    探测系统和方法，包括主动环境控制

    公开(公告)号：WO2017151213A1

    公开(公告)日：2017-09-08

    申请号：PCT/US2016/068270

    申请日：2016-12-22

    Applicant: CASCADE MICROTECH, INC.

    Inventor： TEICH, Michael ,  KIESEWETTER, Jorg ,  HACKIUS, UlF ,  ZILL, Frank ,  KREHER, Mirko

    IPC: G01N25/66 ,  G01R31/00 ,  G01R31/28

    CPC classification number: G01R31/2642 ,  G01R31/2862 ,  G01R31/2881 ,  G05B19/41805 ,  G05B2219/45031 ,  G05D22/02 ,  H01L21/67248 ,  H01L22/26

    Abstract: Probe systems and methods including active environmental control are disclosed herein. The methods include placing a substrate, which includes a device under test (DUT), on a support surface of a chuck. The support surface extends within a measurement environment that is at least partially surrounded by a measurement chamber. The methods further include determining a variable associated with a moisture content of the measurement environment and receiving a temperature associated with the measurement environment. The methods also include supplying a purge gas stream to the measurement chamber at a purge gas flow rate and selectively varying the purge gas flow rate such that a dew point temperature of the measurement environment is within a target dew point temperature range. The methods further include providing a test signal to the DUT and receiving a resultant signal from the DUT. The systems include probe systems that perform the methods.

    Abstract translation: 本文公开了包括主动环境控制的探针系统和方法。 该方法包括将包括待测器件（DUT）的衬底放置在卡盘的支撑表面上。 支撑表面在至少部分被测量室包围的测量环境内延伸。 该方法还包括确定与测量环境的含水量相关的变量并接收与测量环境相关的温度。 该方法还包括以吹扫气体流速向测量室供应吹扫气体流，并选择性地改变吹扫气体流速，使得测量环境的露点温度在目标露点温度范围内。 该方法还包括向DUT提供测试信号并接收来自DUT的结果信号。 这些系统包括执行这些方法的探针系统。

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