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    LINEAR POLYAMIC ACID, LINEAR POLYIMIDE AND THERMOSETTING POLYIMIDE
    91.
    发明专利
    LINEAR POLYAMIC ACID, LINEAR POLYIMIDE AND THERMOSETTING POLYIMIDE 失效

    公开(公告)号：JPH0971651A

    公开(公告)日：1997-03-18

    申请号：JP15355896

    申请日：1996-06-14

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OIKAWA HIDEAKI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO ,  OTA MASAHIRO

    IPC: C08K7/02 ,  C08G73/10 ,  C08L79/08

    Abstract: PROBLEM TO BE SOLVED: To obtain a new linear polyamic acid, having a specific recurring unit and capable of providing a thermoplastic polyimide excellent in heat resistance and mechanical characteristics. SOLUTION: This linear polyimide of formula I [P1 is a recurring unit of formula II or III; S1 is a monovalent group of formula IV or V; Y and Z are each a 6-18C monocyclic aromatic group, condensed polycyclic aromatic group or uncondensed polycyclie aromatic group in which an aromatic group is mutually linked through a cross linking member such as a direct bond or carbonyl; Y is a trivalent group; Z is a bivalent group; Q is a substituent group on the aromatic ring of Z, H, a halogen, etc.; (m) and (n) are each mol% of the respective recurring units; (m) is 100-1mol%; (n) is 0-99mol%; there is neither orderliness nor regularity between the recurring units; (l) is the degree of polymerization and 1-100]. Furthermore, the polyimide is preferably obtained by reacting, e.g. 4,4'-bis(3-aminophenoxy)biphenyl as a diamine component with pyromellitic dianhydride as a tetracarboxylic dianhydride in the presence of a molecular terminal blocking agent.

    HEAT-RESISTANT ADHESIVE
    93.
    发明专利
    HEAT-RESISTANT ADHESIVE 失效

    公开(公告)号：JPH08319470A

    公开(公告)日：1996-12-03

    申请号：JP14136496

    申请日：1996-06-04

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  KAWASHIMA SABURO ,  SONOBE YOSHIO ,  OTA MASAHIRO ,  YAMAGUCHI TERUHIRO

    IPC: C09J179/08 ,  C08G73/10

    Abstract: PURPOSE: To obtain a polyimide adhesive which exhibits a strong adhesion and can retain a high adhesive power even at high temps. without detriment to its heat resistance. CONSTITUTION: This heat-resistant adhesive is made from a polymer which has at least two kinds of repeating units and is obtd. by reacting 1,3-bis(3- aminophenoxy)benzene with a mixture of at least two tetracarboxylic acid dianhydrides selected from among ethylenetetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, pyromellitic dianhydride, 3,3',4,4'- benzophenonetetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2,3,3- biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane- dianhydride, 2,2-bis (2,3-dicarboxyphenyl)propane dianhydride, etc.

    FLEXIBLE CIRCUIT SUBSTRATE
    98.
    发明专利
    FLEXIBLE CIRCUIT SUBSTRATE 失效

    公开(公告)号：JPH08231717A

    公开(公告)日：1996-09-10

    申请号：JP3713795

    申请日：1995-02-24

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： IWAMORI AKIRA ,  MIYASHITA TAKEHIRO ,  FUKUDA SHIN ,  ASHIDA YOSHINORI ,  FUKUDA NOBUHIRO ,  TAMAI MASAJI ,  YAMASHITA WATARU ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10 ,  C23C14/20 ,  H05K1/03

    Abstract: PURPOSE: To obtain a flexible circuit substrate material, comprising a thermal oxidation-resistant polyimide film and a metallic thin film, excellent in high- temperature durability in adhesion of the film to the thin film and further flexibility, etc., and useful as semiconductor IC chips, etc. CONSTITUTION: This flexible printed circuit substrate comprises (A) a thermal oxidation-resistant polyimide film, comprising preferably (i) an aromatic diamine and (ii) an aromatic acid dianhydride and having carbonyl and an ether in the chemical structure and (B) a metallic thin film having preferably 10-3000nm, more preferably 100-500nm thickness. Furthermore, the thin film of the component (B) is preferably a copper film and a copper layer is preferably formed on at least one surface of the film of the component (A) preferably by a sputtering method. The component (A) preferably has a recurring unit of formula I (X and Y are each 0 or CO; X is not equal to Y), preferably e.g. a recurring unit of formula II.

    POLYIMIDE EXCELLENT IN THERMAL STABILITY
    99.
    发明专利
    POLYIMIDE EXCELLENT IN THERMAL STABILITY 失效

    公开(公告)号：JPH08231715A

    公开(公告)日：1996-09-10

    申请号：JP5114596

    申请日：1996-03-08

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI MASAJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10

    Abstract: PURPOSE: To obtain a polyimide excellent in thermal stability, molding processability, etc., by reacting a diamine having a specific structure with a tetracarboxylic dianhydride and then thermally and chemically imidating the resultant polyamic acid. CONSTITUTION: This polyimide is obtained by reacting (A) a diamine of formula I (X is a direct bond, a 1-10C bivalent hydrocarbon group, a hexafluorinated isopropylidene, carbonyl, etc.; Y1 to Y4 are each independently H, a lower alkyl, a lower alkoxy, Cl or Br) with (B) a tetracarboxylic dianhydride of formula II (R is a tetravalent group such as a >=2C aliphatic group or cycloaliphatic group) in the presence of (C) a dicarboxylic anhydride of formula III (Z is a bivalent group such as a monocyclic aromatic group or a condensed polycyclic aromatic group) and thermally or chemically imidating the resultant polyamic acid. The polyimide has a recurring unit of formula IV and the component (B) at 0.9-1.0 molar ratio based on 1mol component (A) is reacted with the component (C) at 0.001-1.0 molar ratio based on the component (A).

    HEAT-RESISTANT ADHESIVE
    100.
    发明专利
    HEAT-RESISTANT ADHESIVE 失效

    公开(公告)号：JPH08199150A

    公开(公告)日：1996-08-06

    申请号：JP971895

    申请日：1995-01-25

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMASHITA WATARU ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: C09J179/08 ,  C08G73/10

    Abstract: PURPOSE: To obtain a heat-resistant adhesive suitable as an adhesive for a high-performance material useful in the field of electronics, aerospace devices, transportation devices, etc., having excellent shelf stability, heat resistance, bond strength, bondable even at low temperature and under low pressure, comprising a specific polyimide. CONSTITUTION: This heat-resistant adhesive comprises a polyimide obtained by reacting (A) a diamine mixture composed of 1mol compound of formula I [R1 to R4 are each H, a halogen, OH, NO2 , carboxyl, sulfonic group, a 1-3C alkyl, a fluoroalkyl, a (fluoro)alkoxy, (bi)phenyl group, (bi)phenoxy or CN] and 0.10 0.005mol compound of formula II ((n) is 0-7) with (B) a compound of formula III (Ar is benzo-1,2,4,5-tetrayl, naphthalene-2,3,6,7-tetrayl, bisphenyl-3,3',4,4'-tetrayl, etc.). The amount of the component A used is 0.8-1.2mol based on 1mol of the component B.

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