公开(公告)号：FR2779571B1

公开(公告)日：2003-01-24

申请号：FR9807060

申请日：1998-06-05

Applicant: ST MICROELECTRONICS SA

Inventor： MARTY MICHEL ,  CHANTRE ALAIN ,  SCHWARTZMANN THIERRY

IPC: H01L29/73 ,  H01L21/265 ,  H01L21/331 ,  H01L29/08 ,  H01L29/165 ,  H01L29/737 ,  H01L21/266

Abstract: Selective doping of the intrinsic collector of a vertical bipolar transistor comprises high energy dopant implantation before epitaxy and lower energy and lower dose dopant implantation after epitaxy of a silicon germanium heterojunction base. Selective doping of the intrinsic collector of a vertical bipolar transistor is carried out by (a) forming the intrinsic collector (4) on an extrinsic collector layer buried in a semiconductor substrate; (b) forming a lateral insulation region (5) around the upper part of the intrinsic collector and an offset extrinsic collector well; (c) effecting a first dopant implantation in the intrinsic collector through a first implantation window above the intrinsic collector; (d) forming a silicon germanium heterojunction base above the intrinsic collector (4) and the lateral insulation region (5) by non-selective epitaxy of a silicon and silicon germanium multilayer (8); and (e) effecting a second lower energy and lower dose dopant implantation in the intrinsic collector across the multilayer in a second implantation window located within the first implantation window above the multilayer (8) and self-aligned with the emitter.

公开(公告)号：FR2826179A1

公开(公告)日：2002-12-20

申请号：FR0107774

申请日：2001-06-14

Applicant: ST MICROELECTRONICS SA

Inventor： MARTY MICHEL ,  FORTUIN ARNOUD ,  ARNAL VINCENT

IPC: H01L21/3065 ,  H01L21/316 ,  H01L21/76 ,  H01L21/762 ,  H01L21/764 ,  H01L27/04

Abstract: A deep insulating trench comprises side walls (11) and a base (10) in a semiconductor substrate (1). The side walls and base are covered with an electrically insulating material (12) which defines an empty cavity (13) and forms a plug (14) to seal the cavity. The side walls are configured with a neck (15) for determining the position of the plug and a first portion (16) which tapers out towards the neck with increasing separation from the base. Independent claims are also included for: (a) an integrated circuit incorporating such a deep insulating trench; (b) an electronic or electric apparatus incorporating the integrated circuit; and (c) a method for the realization of the deep insulating trench in a semiconductor substrate.

公开(公告)号：FR2805923B1

公开(公告)日：2002-05-24

申请号：FR0002855

申请日：2000-03-06

Applicant: ST MICROELECTRONICS SA

Inventor： CHANTRE ALAIN ,  MARTY MICHEL ,  BAUDRY HELENE

IPC: H01L21/331

Abstract: The process includes successively forming, over a base region of a semiconductor substrate, a poly-Ge or poly-SiGe layer, an etch-stop layer over a selected zone of the Ge or SiGe layer, a layer of poly-Si of the same conductivity type as the base region, then an outer layer of dielectric material. Etching the layers includes stopping at the stop layer to form an emitter window preform, removing the stop film and selectively removing the Ge or SiGe layer in the emitter window preform to form an emitter window and to form an emitter made of poly-Si of conductivity type the opposite of the base region in the window.

公开(公告)号：FR2804247B1

公开(公告)日：2002-04-12

申请号：FR0000791

申请日：2000-01-21

Applicant: ST MICROELECTRONICS SA

Inventor： MARTY MICHEL

IPC: H01L21/331

Abstract: A transistor manufacturing process includes the formation, on a layer (15) that will form the base of the transistor, of a stack of an SiGe alloy layer (16), a silicon oxide layer (17) and a silicon nitride layer (18), so as to form in this layer, a false emitter (20), to form, in the layer (15) that will form the base, an extrinsic base region (22) and to siliconize the surface of this extrinsic base region, to cover the extrinsic base region (22) and the false emitter (20) with a silicon dioxide layer (24) which is chemically and mechanically polished down to the level of the false emitter (20), to etch the false emitter (20) in order to form a window (25) and to form, in the window (25) and on the silicon dioxide layer (24), a polysilicon emitter (27). This process has particular application to manufacturing heterojunction bipolar transistors.