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公开(公告)号:JPH0368043B2
公开(公告)日:1991-10-25
申请号:JP12291282
申请日:1982-07-16
Applicant: TORAY INDUSTRIES
Inventor: NAKAGAWA KEIJI , TANAKA MASAYUKI , KISHIMOTO AKIHIKO
IPC: C08F8/00 , C08F8/30 , C08F8/48 , C08F222/00 , C08F222/06 , C08F279/02 , C08G73/00 , C08G73/10
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公开(公告)号:JPH0361698B2
公开(公告)日:1991-09-20
申请号:JP13513682
申请日:1982-08-04
Applicant: TORAY INDUSTRIES
Inventor: TANAKA MASAYUKI , MORIOKA KATSUJI , KISHIMOTO AKIHIKO
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公开(公告)号:JPH0249325B2
公开(公告)日:1990-10-29
申请号:JP11843282
申请日:1982-07-09
Applicant: TORAY INDUSTRIES
Inventor: TANAKA MASAYUKI , NAKAGAWA KEIJI , KISHIMOTO AKIHIKO
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公开(公告)号:JPH0222761B2
公开(公告)日:1990-05-21
申请号:JP4569282
申请日:1982-03-24
Applicant: TORAY INDUSTRIES
Inventor: NAKAGAWA KEIJI , TANAKA MASAYUKI , KISHIMOTO AKIHIKO
IPC: C08F212/00 , C08F2/00 , C08F20/00 , C08F22/36 , C08F212/06 , C08F220/52 , C08F222/40
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公开(公告)号:JPH0299551A
公开(公告)日:1990-04-11
申请号:JP25358188
申请日:1988-10-06
Applicant: TORAY INDUSTRIES
Inventor: KAYABA KEIJI , TAKU KAZUSHIROU , TANAKA MASAYUKI
Abstract: PURPOSE:To obtain an epoxy resin composition excellent in solder heat resistance, adhesion and reliability and suitable for sealing semiconductors by blending an epoxy resin with a curing agent, polystyrene-based block copolymer and fused silica of a specific composition. CONSTITUTION:An epoxy resin composition obtained by blending (A) 5-25wt.% epoxy resin containing an epoxy resin having a skeleton expressed by the formula (R to R are H, 1-4C alkyl, etc.) as an essential component with (B) 2-15wt.% curing agent (e.g., novolak resin, such as phenol novolak), (C) 0.2-5wt.% polystyrene-based block copolymer (e.g., polystyrene/polybutadiene/polystyrene triblock copolymer) and (D) 70-85wt.%, preferably 75-83wt.% fused silica, consisting of (D1) >=40wt.% crushed fused silica having
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公开(公告)号:JPH0299514A
公开(公告)日:1990-04-11
申请号:JP25358388
申请日:1988-10-06
Applicant: TORAY INDUSTRIES
Inventor: KAYABA KEIJI , TAKUWA SHIRO , TANAKA MASAYUKI
Abstract: PURPOSE:To obtain the title composition containing an epoxy resin having a specific structure, curing agent and fused silica having a specific composition and having excellent heat resistance to solder, reliability and fluidity and useful as a coating, etc. CONSTITUTION:The aimed composition containing (A) an epoxy resin having skeleton expressed by the formula (R -R are H, 1-4C alkyl or halogen), (B) curing agent and (C) fused silica having =40wt.% crushed fused silica having
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公开(公告)号:JPH0125337B2
公开(公告)日:1989-05-17
申请号:JP18307581
申请日:1981-11-17
Applicant: TORAY INDUSTRIES
Inventor: TANAKA MASAYUKI , MORIOKA KATSUJI , KISHIMOTO AKIHIKO
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公开(公告)号:JPH0125334B2
公开(公告)日:1989-05-17
申请号:JP17970181
申请日:1981-11-11
Applicant: TORAY INDUSTRIES
Inventor: TANAKA MASAYUKI , MORIOKA KATSUJI , KISHIMOTO AKIHIKO
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公开(公告)号:JPS6128698B2
公开(公告)日:1986-07-02
申请号:JP21312581
申请日:1981-12-29
Applicant: TORAY INDUSTRIES
Inventor: KISHIMOTO AKIHIKO , TANAKA MASAYUKI , YAMAMOTO HIDEZO
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公开(公告)号:JPS6124418B2
公开(公告)日:1986-06-11
申请号:JP15959782
申请日:1982-09-16
Applicant: Toray Industries
Inventor: TANAKA MASAYUKI , NAKAGAWA KEIJI , KISHIMOTO AKIHIKO
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