EPOXY-BASED RESIN COMPOSITION
    95.
    发明专利

    公开(公告)号:JPH0299551A

    公开(公告)日:1990-04-11

    申请号:JP25358188

    申请日:1988-10-06

    Abstract: PURPOSE:To obtain an epoxy resin composition excellent in solder heat resistance, adhesion and reliability and suitable for sealing semiconductors by blending an epoxy resin with a curing agent, polystyrene-based block copolymer and fused silica of a specific composition. CONSTITUTION:An epoxy resin composition obtained by blending (A) 5-25wt.% epoxy resin containing an epoxy resin having a skeleton expressed by the formula (R to R are H, 1-4C alkyl, etc.) as an essential component with (B) 2-15wt.% curing agent (e.g., novolak resin, such as phenol novolak), (C) 0.2-5wt.% polystyrene-based block copolymer (e.g., polystyrene/polybutadiene/polystyrene triblock copolymer) and (D) 70-85wt.%, preferably 75-83wt.% fused silica, consisting of (D1) >=40wt.% crushed fused silica having

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