公开(公告)号：US5992725A

公开(公告)日：1999-11-30

申请号：US815844

申请日：1997-03-12

Applicant: Hidemitsu Egawa ,  Hirokazu Ezawa

Inventor： Hidemitsu Egawa ,  Hirokazu Ezawa

IPC: H01L21/60 ,  B23K20/00 ,  H01L21/607 ,  H05K13/06

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K20/007 ,  H01L24/48 ,  H01L24/78 ,  H05K13/06 ,  B23K2201/40 ,  H01L2224/02126 ,  H01L2224/02166 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85009 ,  H01L2224/8502 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L24/45 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/12044 ,  H01L2924/20753

Abstract: An electronic element producing apparatus comprises a bonding tool 1 which has a first supply hole 2 for passing a bonding wire 3 used to bond a bonding pad 6 of a semiconductor device 5 and an external conductor which is to be connected electrically with the bonding pad 6, and contacts a leading end 3b of the bonding wire 3 protruded outside from the first supply hole 2 to the bonding pad 6, and which also has a second supply hole 12 to supply a bonding material to bond the bonding pad 6 and the leading end 3b of the bonding wire 3, the second supply hole 12 being formed to supply the conductive material to a contact point between the bonding wire 3 and the bonding pad 6. Therefore, the bonding pad 6 and the bonding wire 3 can be bonded without applying a dynamic or thermal load to the semiconductor device 5.

Abstract translation: 电子元件制造装置包括接合工具1，该接合工具1具有用于使用于接合半导体器件5的接合焊盘6的接合线3和与接合焊盘6电连接的外部导体的第一供给孔2 并且接触从第一供给孔2向外侧突出的接合线3的前端3b到接合焊盘6，并且还具有第二供给孔12，用于提供接合材料以将接合焊盘6和前端 3b形成，第二供应孔12形成为将导电材料供应到接合线3和接合焊盘6之间的接触点。因此，接合焊盘6和接合线3可以粘合而不施加 对半导体器件5的动态或热负载。

公开(公告)号：US5971257A

公开(公告)日：1999-10-26

申请号：US257787

申请日：1999-02-25

Applicant: Renyi Yang

Inventor： Renyi Yang

IPC: B23K3/08 ,  B23K37/04 ,  H01L21/00 ,  H05K13/04 ,  B23K5/22 ,  B23K37/00 ,  B23P19/00 ,  B25B11/00

CPC classification number: H01L21/67132 ,  B23K3/087 ,  B23K37/0426 ,  H05K13/046 ,  B23K2201/40 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53961

Abstract: A fixture for use in the bonding of a plurality of chips each to a respective one of a plurality of substrates includes a lower vacuum chuck and a frame member supported on the chuck for reciprocatory motion toward and away from the chuck surface. The chuck surface is arranged to hold substrates with predeposited solder in pockets at predetermined locations thereon. The frame member has openings aligned with those pockets and weights which extend through the openings. After substrates are placed on the chuck surface, the substrates are heated so that the predeposited solder reaches eutectic status, and then chips are placed on the substrates. The frame member is then mounted on the chuck and gradually lowered until the weights press against respective chips, thereby holding the chips in position on the substrates. The entire assembly is then transported to a solder reflow bonding station.

Abstract translation: 用于将多个芯片各自连接到多个基板中的相应一个的多个芯片的固定装置包括下部真空卡盘和支撑在卡盘上以朝向和远离卡盘表面往复运动的框架构件。 卡盘表面被布置成在其上的预定位置处将预沉积的焊料保持在凹穴中。 框架构件具有与延伸穿过开口的那些口袋和重物对齐的开口。 将基板放置在卡盘表面之后，加热基板，使预沉积的焊料达到共晶状态，然后将芯片放置在基板上。 然后将框架构件安装在卡盘上并逐渐降低，直到重物压在相应的芯片上，从而将芯片保持在基板上的适当位置。 然后将整个组件运输到焊料回流焊接站。

公开(公告)号：US5946791A

公开(公告)日：1999-09-07

申请号：US899846

申请日：1997-07-24

Applicant: Donald D. Baldwin

Inventor： Donald D. Baldwin

IPC: B23K1/00 ,  B23K3/08 ,  B23K31/12 ,  B23Q3/154 ,  G01R1/04 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  B23K31/02 ,  B23P19/00 ,  G01R31/00

CPC classification number: B23K31/12 ,  B23K1/0016 ,  B23K3/087 ,  B23Q3/1546 ,  G01R1/04 ,  H05K3/303 ,  H05K3/325 ,  B23K2201/40 ,  B23K2201/42 ,  H05K2201/10689 ,  H05K2203/104 ,  H05K2203/1394 ,  H05K2203/162 ,  H05K3/3421 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/53083 ,  Y10T29/53183 ,  Y10T29/53196

Abstract: An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

Abstract translation: 通过在PCB的表面处引入选定强度的磁场将IC器件临时保持在PCB上，将集成电路（IC）器件安装到印刷电路板（PCB）上。 IC器件具有被磁场吸引的磁性材料。 当IC器件和PCB被测试时，然后在IC器件永久地接合到PCB时在焊接期间保持磁场。

公开(公告)号：US5938102A

公开(公告)日：1999-08-17

申请号：US583641

申请日：1996-01-05

Applicant: Eric Phillip Muntz ,  Melissa E. Orme-Marmarelis ,  Gerald C. Pham-Van-Diep ,  Robert J. Balog

Inventor： Eric Phillip Muntz ,  Melissa E. Orme-Marmarelis ,  Gerald C. Pham-Van-Diep ,  Robert J. Balog

IPC: B23K3/06 ,  H05K3/12 ,  H05K3/34 ,  B23K3/00

CPC classification number: H05K3/3457 ,  B23K3/0607 ,  B23K3/0623 ,  B22F2009/0836 ,  B23K2201/40 ,  B23K2201/42 ,  H05K2203/013 ,  H05K3/1241 ,  H05K3/125

Abstract: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.

Abstract translation: 将选定的焊点图案沉积到要安装一个或多个电子部件的基板上，将基板安装在基板支撑件上并沿着扫描轴线相对于焊料喷射器移动，液滴沿风扇轴线偏转 通过选择性地施加电荷并使带电的液滴通过电场而横向于扫描轴。

公开(公告)号：US5921458A

公开(公告)日：1999-07-13

申请号：US882136

申请日：1997-06-25

Applicant: Kuang-Shu Fan

Inventor： Kuang-Shu Fan

IPC: B23K3/06 ,  H01L21/00 ,  H05K3/34 ,  B23K3/006 ,  H01L21/06

CPC classification number: H01L21/67138 ,  B23K3/0623 ,  B23K2201/40 ,  H05K3/3478

Abstract: The invention herein relates to a kind of integrated circuit solder ball implant machine that is mainly comprised of a machine base, a solder ball implant device, a solder ball loading device, an integrated circuit component positioning device and an integrated circuit mold ejection device, the innovations of which includes the utilization of the aforesaid integrated circuit component positioning device that reciprocates leftward and rightward at the lower extent of the solder ball implant device as well as the aforesaid solder ball loading device that is vibrated forward and backward to directly transport the solder balls through the feed holes of the solder ball implant device such that each of the solder balls are reliably, accurately, soundly and expeditiously carried and positioned onto integrated circuit component in the integrated circuit component positioning device. Furthermore, when the ball implant device moves upward during utilization, the module of the aforesaid integrated circuit component positioning device is capable of horizontal movement, and thereby enables the integrated circuit component to be lifted out by the mold ejection device at a set position at the completion of the solder ball implantation onto the integrated circuit component in an operation that is simple, convenient and rapid.

Abstract translation: 本发明涉及一种集成电路焊球注入机，其主要由机台，焊球注入装置，焊球加载装置，集成电路部件定位装置和集成电路模具排出装置组成， 其创新包括利用上述集成电路元件定位装置，其在焊球注入装置的下部范围内向左和向右往复运动，以及前述的向前和向后振动以直接输送焊球的焊球加载装置 通过焊球注入装置的馈电孔，使得每个焊球能够可靠，准确，准确地携带并定位在集成电路部件定位装置的集成电路部件上。 此外，当球体植入装置在使用期间向上移动时，上述集成电路部件定位装置的模块能够水平移动，从而使得集成电路部件能够通过模具排出装置在设置位置被提升 在简单，方便和快速的操作中完成焊球注入到集成电路部件上。

公开(公告)号：US5912984A

公开(公告)日：1999-06-15

申请号：US769739

申请日：1996-12-19

Applicant: David J. Michael ,  Juha Koljonen ,  Sanjay Nichani ,  Peter Roberts

Inventor： David J. Michael ,  Juha Koljonen ,  Sanjay Nichani ,  Peter Roberts

IPC: B23K3/08 ,  G06T7/00 ,  H05K1/02 ,  H05K3/12 ,  H05K3/34 ,  G06K9/00

CPC classification number: G06T7/001 ,  B23K3/08 ,  G06T7/0028 ,  G06T7/2053 ,  H05K3/3484 ,  B23K2201/40 ,  G06T2207/30152 ,  H05K1/0269 ,  H05K2203/163 ,  H05K3/1216

Abstract: Inspection of solder paste on a printed circuit board using a before printing image (pre-image) to normalize an after printing image (post-image) of the printed circuit board. Existing lighting and optics used for alignment of the screen printing stencil to the printed circuit board are used for the solder paste inspection. A stencil in the screen printing process is also inspected using a before printing image (pre) to normalize an after printing image (post) of the stencil.

Abstract translation: 使用之前打印的图像（预图像）检查印刷电路板上的焊膏以使印刷电路板的后打印图像（后图像）归一化。 用于将丝网印刷模板对准印刷电路板的现有照明和光学装置用于焊膏检查。 丝网印刷过程中的模板也使用之前的打印图像（预）进行检查，以对印版图像（后）进行归一化。

公开(公告)号：US5909838A

公开(公告)日：1999-06-08

申请号：US964291

申请日：1997-11-04

Applicant: Lisa Jeanine Jimarez ,  Miguel Angel Jimarez

Inventor： Lisa Jeanine Jimarez ,  Miguel Angel Jimarez

IPC: B23K1/018

CPC classification number: B23K1/018 ,  B23K2201/40

Abstract: Excess solder is removed from an article such as a circuit substrate or electronic component as is often required after separation of a mounted component from a substrate. A metal foil having a surface with micro-roughness is brought in contact with the solder material and heated to thereby melt the solder, allowing it to flow onto the foil surface. The foil, having the molten solder therein, is then withdrawn.

Abstract translation: 从诸如电路基板或电子部件的物品上去除过量的焊料，这是在从基板分离安装的部件之后经常需要的。 将具有微粗糙度的表面的金属箔与焊料材料接触并加热，从而熔化焊料，使其流到箔表面。 然后将其中具有熔融焊料的箔片取出。

公开(公告)号：US5881944A

公开(公告)日：1999-03-16

申请号：US846929

申请日：1997-04-30

Applicant: David L. Edwards ,  Armando S. Cammarano ,  Jeffrey T. Coffin ,  Mark G. Courtney ,  Stephen S. Drofitz, Jr. ,  Michael J. Ellsworth, Jr. ,  Lewis S. Goldmann ,  Sushumna Iruvanti ,  Frank L. Pompeo ,  William E. Sablinski ,  Raed A. Sherif ,  Hilton T. Toy

Inventor： David L. Edwards ,  Armando S. Cammarano ,  Jeffrey T. Coffin ,  Mark G. Courtney ,  Stephen S. Drofitz, Jr. ,  Michael J. Ellsworth, Jr. ,  Lewis S. Goldmann ,  Sushumna Iruvanti ,  Frank L. Pompeo ,  William E. Sablinski ,  Raed A. Sherif ,  Hilton T. Toy

IPC: B23K35/02 ,  B23K35/26 ,  H01L23/10 ,  B23K31/02 ,  B23K35/22

CPC classification number: H01L23/10 ,  B23K35/0238 ,  B23K35/26 ,  B23K2201/40 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/163 ,  Y10T428/12361

Abstract: The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.

Abstract translation: 本发明一般涉及为半导体衬底和芯片载体提供密封带的新方案。 更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。 这种多层金属密封提供增强的气密寿命和环境保护。 对于优选实施例，多层金属密封带是用于为模块产生低成本，高可靠性气密密封的三层焊料夹层结构。 该焊料夹层具有较高的熔化温度较厚的焊料内芯和较低熔点的薄互连焊料层，其中薄的互连焊料层可具有相似或不同的熔点。

公开(公告)号：US5872051A

公开(公告)日：1999-02-16

申请号：US510401

申请日：1995-08-02

Applicant: Kenneth Michael Fallon ,  Christian Robert Le Coz ,  Mark Vincent Pierson

Inventor： Kenneth Michael Fallon ,  Christian Robert Le Coz ,  Mark Vincent Pierson

IPC: B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L21/288 ,  H01L21/58

CPC classification number: H01L24/12 ,  B23K1/0016 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H05K3/3484 ,  B23K2201/40 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/742 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3463

Abstract: A process within substrate is provided with vias communicating with surface contacts or bumps. Joining material paste is forced through holes in a screen onto an area array of the contacts on the substrate then the screen is biased against the substrate as the paste is heated and cooled to transfer the joining material onto the contacts. Alternately, joining material paste is forced into the screen and then a substrate is placed onto the screen with an area array of bump contacts of the substrate in contact with the solder paste, and then the paste is heated and cooled to transfer the material onto the bumps. The joining material may be a solder paste, conductive adhesive paste, or transient liquid bond paste. The substrate may be a semiconductor chip substrate, flexible or rigid organic substrate, or a metal substrate coated to form a dielectric surface. Also, the substrate may be a computer chip, chip carrier substrate or a circuit board substrate. The process may be used to produce flip chips, ball grid array modules, column grid array modules, circuit boards, and attachment structures of the preceding components including information handling systems.

Abstract translation: 衬底内的工艺设有与表面接触或凸块连通的通孔。 连接材料糊料被迫通过筛网上的孔到基板上的触点的区域阵列上，然后当膏被加热和冷却以将接合材料转移到触点上时，屏幕被偏压到基板上。 或者，将接合材料糊剂强制进入筛网，然后将基板放置在具有与焊膏接触的基板的凸起接触的区域阵列的屏幕上，然后将该浆料加热并冷却以将材料转移到 颠簸 接合材料可以是焊膏，导电粘合剂糊或瞬态液体粘合膏。 衬底可以是半导体芯片衬底，柔性或刚性有机衬底或涂覆以形成电介质表面的金属衬底。 此外，基板可以是计算机芯片，芯片载体基板或电路板基板。 该过程可用于制造包括信息处理系统的前述组件的倒装芯片，球栅阵列模块，列网格阵列模块，电路板和附接结构。

公开(公告)号：US5862588A

公开(公告)日：1999-01-26

申请号：US514703

申请日：1995-08-14

Applicant: Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

Inventor： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC: B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/91 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H05K3/3415 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  H05K3/3436 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265

Abstract: A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

Abstract translation: 一种制造互连结构和电路板的方法，包括将布置在背板上的基板上的相应金属触点上具有连接凸块的区域阵列部件放置在一起，提供与凸块和触点相连通的热固化连接材料，直接接触气体喷嘴 到围绕组件的基板的一部分，以将衬底压在喷嘴和背板之间，以限制衬底的包裹，加热组件，接合材料和接近金属触点的衬底，同时将喷嘴保持在衬底上以固化 接合材料，并冷却组件，接合材料和基底。 选择的部件也可以利用气体喷嘴进行更换，以限制基材的包装。