公开(公告)号：EP2121510A2

公开(公告)日：2009-11-25

申请号：EP07859371.2

申请日：2007-12-10

Applicant: NXP B.V.

Inventor： STEENEKEN, Peter G.

IPC: B81B3/00 ,  H01H59/00

CPC classification number: H01H59/0009 ,  B81B3/0056 ,  B81B2201/016 ,  B81C2201/017 ,  Y10T29/49105

Abstract: The present invention relates to MEMS device that comprises a first electrode, and a second electrode suspended with a distance to the first electrode with the aid of a suspension structure. The MEMS device further comprises at least one deformation electrode. The second electrode or the suspension structure or both are plastically deformable upon application of an electrostatic deformation force via the deformation electrode. This way, variations in the off- state position of the second electrode that occur during fabrication of different devices or during operation of a single device can be eliminated.

公开(公告)号：EP1864310A2

公开(公告)日：2007-12-12

申请号：EP05858635.5

申请日：2005-11-23

Applicant: GEORGIA TECH RESEARCH CORPORATION ,  Kingsley, Nickolas

Inventor： KINGSLEY, Nickolas ,  THOMPSON, Dane ,  WANG, Guoan ,  TENTZERIS, Emmanouil, M. ,  PAPAPOLYMEROU, Loannis

IPC: H01J33/00

CPC classification number: B81B7/0041 ,  B81B2201/016 ,  B81C2203/0136 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

Abstract: Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first elecctronic component.

公开(公告)号：EP1846320A1

公开(公告)日：2007-10-24

申请号：EP06709238.7

申请日：2006-02-02

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： FLEURY, Gatien ,  CHARVET, Pierre-Louis

IPC: B81B3/00 ,  H01H50/00

CPC classification number: B81C1/00666 ,  B81B2201/016 ,  B81C2201/0167

Abstract: The invention relates to a micromechanical device comprising a mobile beam (1), said beam being attached by the two ends (2) thereof to a rigid frame (3) provided with two arms (4) each having two ends (5). The ends (5) of an arm (4) are respectively fixed to the two ends (2) of the mobile beam (1). Each arm (4) has a central part (6) arranged between the two ends (5) of the corresponding arm (4). A rear face of the central part (6) of each arm (4) is attached to a base support (10). The frame (3) comprises at least one stressed element (11) for adjusting the stressed state of the beam. The stressed element (11) can be centred between the front face and the rear face of the corresponding arm (4). The frame (3) can comprise pairs of front and rear stressed elements (11) which are respectively arranged on the front face and the rear face of the arms (4) in such a way that they face each other.

公开(公告)号：EP1733999A1

公开(公告)日：2006-12-20

申请号：EP05105336.1

申请日：2005-06-16

Applicant: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW

Inventor： Tilmans, Hendrikus ,  Klaasse, Gerald

IPC: B81B3/00 ,  H01H1/00

CPC classification number: B81B3/0072 ,  B81B2201/016 ,  H01L41/0933 ,  H02N1/002

Abstract: A micro electromechanical device comprising a floating element extending between at least two anchors, the floating element comprising a predetermined reference portion, which in at least one predetermined state of the device in use is to be located within a predetermined reference plane, and at least two flexible sections which each extend between the reference portion and one of the anchors, at least two of the flexible sections comprising a stress relieving element which enables deflection of the floating element as a result of a stress gradient, characterised in that the stress relieving elements are provided on predetermined locations between the respective anchor and the reference portion, chosen such that the reference portion is substantially located within the predetermined reference plane in said predetermined state of the device in use.

Abstract translation: 一种微机电装置，包括在至少两个锚之间延伸的浮动元件，所述浮动元件包括预定参考部分，所述参考部分在至少一个使用中的装置的预定状态位于预定参考平面内，并且至少两个 所述柔性部分各自在所述参考部分和所述锚固件之一之间延伸，所述柔性部分中的至少两个包括应力释放元件，所述应力释放元件能够由于应力梯度而偏移所述浮动元件，其特征在于，所述应力释放元件 设置在相应锚和参考部分之间的预定位置处，被选择为使得参考部分在使用中的装置的所述预定状态中基本上位于预定参考平面内。

公开(公告)号：EP1705151A1

公开(公告)日：2006-09-27

申请号：EP05292363.8

申请日：2005-11-08

Applicant: STMICROELECTRONICS SA ,  COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： Casset, Fabrice ,  Segueni, Karim ,  De Grave, Arnaud ,  Abele, Nicolas

IPC: B81B3/00 ,  H03H9/24

CPC classification number: H03H9/2463 ,  B81B3/007 ,  B81B2201/016 ,  B81B2201/0271 ,  B81B2203/0118 ,  H03H3/0076 ,  H03H9/2447

Abstract: Un microsystème électromécanique comprend une poutre (1) et une électrode (10) couplée par une interaction électrostatique avec la poutre. La poutre est adaptée pour subir des déformations élastiques par flexion et possède un motif de section sensiblement constant. La poutre (1) est constituée de plusieurs pans (P1-P4) s'étendant sur la longueur de la poutre (L), et ayant chacun une épaisseur inférieure à une dimension extérieure du motif de section (w, t). Une fréquence de vibration par flexion de la poutre est alors accrue par rapport à une poutre pleine de mêmes dimensions extérieures. Un tel microsystème est adapté pour des applications à durées de transition très courtes, ou pour réaliser des oscillateurs et des résonateurs à haute fréquence.

Abstract translation: 该系统具有适于通过弯曲进行弹性应变并且在垂直于纵向方向（D）的平面中具有截面图案的微束（1）。 微束包括沿着微束的主要部分延伸的部分（P1-P4）。 这些部分沿着平行于方向（D）的线彼此连接。 这些部分的厚度小于截面图案的外部尺寸。 这些部分具有外形尺寸为60×60微米的方形形状。 该微束具有2.1兆赫的弹性弯曲应变频率。 还包括以下独立权利要求：（1）包括微机电系统的断续器（2）包括微机电系统的加速度计（3）包括微电机械系统（4）的振荡器 ）包括微机电系统的谐振器（5）用于制造微机电系统的方法。

公开(公告)号：TWI246101B

公开(公告)日：2005-12-21

申请号：TW093119104

申请日：2004-06-29

Applicant: 富士通股份有限公司 FUJITSU LIMITED

Inventor： 中谷忠司 NAKATANI, TADASHI ,  宮下勉 TSUTOMU MIYASHITA

IPC: H01H ,  B81C ,  B81B

CPC classification number: H01H59/0009 ,  B81B2201/016 ,  B81B2203/0127 ,  B81C1/00142 ,  B81C2201/0109

Abstract: 提供一種用於製造一微切換元件之方法。切換元件包括一基材、固定至基材之兩支撐構件、及橋接在支撐構件之間的一可移式樑。樑係包括一薄膜、皆配置於薄膜上之一可移式接觸電極及一可移式驅動電極。切換元件亦包括面對可移式接觸電極之一對靜態接觸電極、及與可移式驅動電極合作用以產生靜電力之一靜態驅動電極。此方法包括下列步驟：在基材上製造一犧牲層、及在犧牲層上製造薄膜、及以薄膜介入使犧牲層受到蝕刻，藉以將支撐構件形成為基材與薄膜之間之犧牲層的剩餘部分。

Abstract in simplified Chinese: 提供一种用于制造一微切换组件之方法。切换组件包括一基材、固定至基材之两支撑构件、及桥接在支撑构件之间的一可移式梁。梁系包括一薄膜、皆配置于薄膜上之一可移式接触电极及一可移式驱动电极。切换组件亦包括面对可移式接触电极之一对静态接触电极、及与可移式驱动电极合作用以产生静电力之一静态驱动电极。此方法包括下列步骤：在基材上制造一牺牲层、及在牺牲层上制造薄膜、及以薄膜介入使牺牲层受到蚀刻，借以将支撑构件形成为基材与薄膜之间之牺牲层的剩余部分。

公开(公告)号：US20180315571A1

公开(公告)日：2018-11-01

申请号：US15770705

申请日：2016-11-15

Applicant: CAVENDISH KINETICS, INC.

Inventor： Robertus Petrus VAN KAMPEN ,  Richard L. KNIPE ,  Mickael RENAULT ,  Shibajyoti Ghosh DASTIDER ,  Jacques Marcel MUYANGO

IPC: H01H59/00 ,  H01G5/16 ,  B81B3/00

CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B3/0035 ,  B81B2201/016 ,  H01G5/16 ,  H01H2059/0018 ,  H01H2059/0072

Abstract: A MEMS switch contains an RF electrode 102, pull-down electrodes 104 and anchor electrodes 108 located on a substrate 101. A plurality of islands 226 are provided in the pull-down electrode and electrically isolated therefrom. On top of the RF electrode is the RF contact 206 to which the MEMS-bridge 212, 214 forms an ohmic contact in the pulled-down state. The pull-down electrodes 104 are covered with a dielectric layer 202 to avoid a short-circuit between the bridge and the pull-down electrode. Contact stoppers 224 are disposed on the dielectric layer 202 at locations corresponding to the islands 226, and the resulting gap between the bridge and the dielectric layer in the pulled-down state reduces dielectric charging. In alternative embodiments, the contact stoppers are provide within the dielectric layer 202 or disposed on the islands themselves and under the dielectric layer. The switch provides good controllability of the contact resistance of MEMS switches over a wide voltage operating range.

公开(公告)号：US20180012972A1

公开(公告)日：2018-01-11

申请号：US15695440

申请日：2017-09-05

Applicant: Purdue Research Foundation

Inventor： Muhammad Ashraful Alam ,  Muhammad Masuduzzaman ,  Ankit Jain

IPC: H01L29/51 ,  H01G7/06 ,  H01G4/38 ,  H01G5/40 ,  H01L27/08 ,  B81B7/02 ,  H01L29/78 ,  H01G5/16 ,  H01L49/02

CPC classification number: H01L29/515 ,  B81B7/02 ,  B81B2201/014 ,  B81B2201/016 ,  B81B2201/07 ,  H01G4/38 ,  H01G5/16 ,  H01G5/40 ,  H01G7/06 ,  H01L27/0805 ,  H01L27/11502 ,  H01L27/11585 ,  H01L29/516 ,  H01L29/7842

Abstract: An electrical circuit comprising at least two negative capacitance insulators connected in series, one of the two negative capacitance insulators is biased to generate a negative capacitance. One of the negative capacitance insulators may include an air-gap which is part of a nanoelectromechnical system (NEMS) device and the second negative capacitance insulator includes a ferroelectric material. Both of the negative capacitance insulators may be located between the channel and gate of a field effect transistor. The NEMS device may include a movable electrode, a dielectric and a fixed electrode and arranged so that the movable electrode is attached to at least two points and spaced apart from the dielectric and fixed electrode, and the ferroelectric capacitor is electrically connected to either of the electrodes.

公开(公告)号：US09708177B2

公开(公告)日：2017-07-18

申请号：US14342387

申请日：2012-08-31

Applicant: Robertus Petrus Van Kampen ,  Mickael Renault ,  Vikram Joshi ,  Richard L. Knipe ,  Anartz Unamuno

Inventor： Robertus Petrus Van Kampen ,  Mickael Renault ,  Vikram Joshi ,  Richard L. Knipe ,  Anartz Unamuno

IPC: B81B7/00 ,  B81C1/00 ,  H01H59/00 ,  H01G5/16

CPC classification number: B81B7/00 ,  B81B2201/016 ,  B81B2203/0307 ,  B81C1/00039 ,  B81C2203/0136 ,  H01G5/16 ,  H01H59/0009 ,  Y10T29/49105

Abstract: Embodiments of the present invention generally relate to a MEMS device that is anchored using the layer that is deposited to form the cavity sealing layer and/or with the layer that is deposited to form the pull-off electrode. The switching element of the MEMS device will have a flexible or movable portion and will also have a fixed or anchor portion that is electrically coupled to ground. The layer that is used to seal the cavity in which the switching element is disposed can also be coupled to the fixed or anchor portion of the switching element to anchor the fixed or anchor portion within the cavity. Additionally, the layer that is used to form one of the electrodes may be used to provide additional leverage for anchoring the fixed or anchor portion within the cavity. In either situation, the movement of the flexible or movable portion is not hindered.

公开(公告)号：US20170098509A1

公开(公告)日：2017-04-06

申请号：US15385431

申请日：2016-12-20

Applicant: Texas Instruments Incorporated

Inventor： Arun Gupta ,  William C. McDonald ,  Adam Fruehling ,  Ivan Kmecko ,  Lance Barron ,  Divyanshu Agrawal ,  Arthur M. Turner ,  John C. Ehmke

IPC: H01G5/16 ,  H01G5/011 ,  B81B7/00 ,  H01G5/40

CPC classification number: H01G5/16 ,  B81B3/0008 ,  B81B3/001 ,  B81B3/0013 ,  B81B7/0064 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/016 ,  B81B2201/0221 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/058 ,  B81B2203/06 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00158 ,  H01G5/011 ,  H01G5/40

Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.