公开(公告)号：US09752247B2

公开(公告)日：2017-09-05

申请号：US14017510

申请日：2013-09-04

Applicant: University of Southern California

Inventor： Adam L. Cohen

IPC: B81C1/00 ,  C25D5/10 ,  B33Y10/00 ,  C25D1/00 ,  C25D5/02 ,  C25D5/12 ,  H01L21/288 ,  H05K3/24 ,  C25D5/22

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US20170225942A1

公开(公告)日：2017-08-10

申请号：US15422508

申请日：2017-02-02

Applicant: Analog Devices Global

Inventor： Padraig Fitzgerald ,  Michael James Twohig

IPC: B81B3/00 ,  H01H59/00 ,  B81C1/00

CPC classification number: B81B3/0051 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0181 ,  B81C1/0015 ,  B81C2201/0109 ,  B81C2201/0197 ,  H01H59/0009 ,  H01H2059/0027 ,  H01H2059/0054

Abstract: Microelectromechanical systems (MEMS) switches are described. The MEMS switches can be actively opened and closed. The switch can include a beam coupled to an anchor on a substrate by one or more hinges. The beam, the hinges and the anchor may be made of the same material in some configurations. The switch can include electrodes, disposed on a surface of the substrate, for electrically controlling the orientation of the beam. The hinges may be thinner than the beam, resulting in the hinges being more flexible than the beam. In some configurations, the hinges are located within an opening in the beam. The hinges may extend in the same direction of the axis of rotation of the beam and/or in a direction perpendicular to the axis of rotation of the beam.

公开(公告)号：US09612254B2

公开(公告)日：2017-04-04

申请号：US14318199

申请日：2014-06-27

Applicant: Freescale Semiconductor, Inc.

Inventor： Michael Naumann

IPC: G01P15/125 ,  B81B7/00 ,  B81C1/00 ,  G01P15/08

CPC classification number: G01P15/125 ,  B81B7/007 ,  B81B2207/095 ,  B81C1/00365 ,  B81C2201/0197 ,  B81C2203/0136 ,  G01P2015/0814

Abstract: Microelectromechanical system (MEMS) devices and methods for forming MEMS devices are provided. The MEMS devices include a substrate, an anchored structure fixedly coupled to the substrate, and a movable structure resiliently coupled to the substrate. The movable structure has an opening formed therethrough and is positioned such that the anchored structure is at least partially within the opening and is in a capacitor-forming relationship with the movable structure. The movable structure comprises a movable structure finger extending only partially across the opening.

公开(公告)号：US09586810B2

公开(公告)日：2017-03-07

申请号：US13811800

申请日：2011-08-01

Applicant: Gerda Fuhrmann ,  Gabriele Nelles ,  Silvia Rosselli ,  Nikolaus Knorr ,  Alfred Paris ,  Maria Kaufmann ,  Georg Bauer

Inventor： Gerda Fuhrmann ,  Gabriele Nelles ,  Silvia Rosselli ,  Nikolaus Knorr ,  Alfred Paris ,  Maria Kaufmann ,  Georg Bauer

IPC: B81B1/00 ,  B01L3/00 ,  B81C3/00 ,  C08J7/04 ,  C08J7/06 ,  C08J7/12 ,  B32B3/02 ,  B32B37/14 ,  B05D1/00 ,  C23C16/04 ,  B81C1/00 ,  C08L83/04

CPC classification number: B81B1/00 ,  B01L3/502707 ,  B01L2300/16 ,  B01L2300/161 ,  B05D1/62 ,  B81C1/00206 ,  B81C3/00 ,  B81C2201/0197 ,  C08J7/04 ,  C08J7/047 ,  C08J7/06 ,  C08J7/123 ,  C08J2383/04 ,  C08L83/04 ,  C23C16/045 ,  Y02P20/582 ,  Y10T156/10

Abstract: The present invention relates to a polymeric substrate having a glass-like surface, in particular an etched-glass-like surface and to a chip made of at least one such polymeric substrate. The present invention also relates to a method of providing a polymeric substrate with an etched-glass-like surface. Moreover, the present invention relates to a kit for manufacturing a chip using such polymeric substrate. Moreover, the present invention relates to the use of a polymeric substrate having a glass-like surface, in particular an etched-glass-like surface for manufacturing a chip.

Abstract translation: 本发明涉及具有玻璃状表面，特别是蚀刻玻璃状表面的聚合物基材和由至少一种这样的聚合物基材制成的芯片。 本发明还涉及提供具有蚀刻玻璃状表面的聚合物基材的方法。 此外，本发明涉及使用这种聚合物基材制造芯片的套件。 此外，本发明涉及具有玻璃状表面的聚合物基材，特别是用于制造芯片的蚀刻玻璃状表面的用途。

公开(公告)号：US20160153780A1

公开(公告)日：2016-06-02

申请号：US14518607

申请日：2014-10-20

Applicant: InSighTech, LLC

Inventor： Biao Zhang ,  Tao Ju

IPC: G01C19/5712 ,  G01R33/09 ,  G01P15/125

CPC classification number: G01P15/105 ,  B81B5/00 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/038 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5776 ,  G01P15/125 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098

Abstract: A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprises a movable portion capable of moving in response to angular velocity, a conducting wire attached to the movable portion for generating magnetic field, and a spintronic device for measuring the magnetic field. The easy axis of the spintronic device is aligned to the sensing mode of the movable portion and to the direction of the current flowing through the conducting wire.

Abstract translation: 本文公开了一种MEMS陀螺仪，其中MEMS陀螺仪包括能够响应于角速度移动的可移动部分，连接到用于产生磁场的可移动部分的导线以及用于测量磁场的自旋电子装置。 自旋电子器件的容易轴线与可移动部分的感测模式和流过导线的电流的方向对准。

公开(公告)号：US20150375989A1

公开(公告)日：2015-12-31

申请号：US14318199

申请日：2014-06-27

Applicant: Freescale Semiconductor, Inc.

Inventor： Michael NAUMANN

IPC: B81B3/00 ,  B81B7/02 ,  G01P15/125

CPC classification number: G01P15/125 ,  B81B7/007 ,  B81B2207/095 ,  B81C1/00365 ,  B81C2201/0197 ,  B81C2203/0136 ,  G01P2015/0814

Abstract: Microelectromechanical system (MEMS) devices and methods for forming MEMS devices are provided. The MEMS devices include a substrate, an anchored structure fixedly coupled to the substrate, and a movable structure resiliently coupled to the substrate. The movable structure has an opening formed therethrough and is positioned such that the anchored structure is at least partially within the opening and is in a capacitor-forming relationship with the movable structure. The movable structure comprises a movable structure finger extending only partially across the opening.

Abstract translation: 提供了用于形成MEMS器件的微机电系统（MEMS）器件和方法。 MEMS器件包括衬底，固定地耦合到衬底的锚定结构以及弹性地耦合到衬底的可移动结构。 可移动结构具有通过其形成的开口，并且被定位成使得锚定结构至少部分地在开口内并且与可移动结构形成电容器形成关系。 可移动结构包括仅部分地穿过开口延伸的可移动结构指状物。

公开(公告)号：US20150207101A1

公开(公告)日：2015-07-23

申请号：US14417169

申请日：2013-07-18

Applicant: OSRAM OLED GmbH

Inventor： Erwin Lang ,  Thilo Reusch ,  Philipp Schwamb

IPC: H01L51/52 ,  C23C16/455 ,  H05K5/06

CPC classification number: H01L51/5253 ,  B81C1/00269 ,  B81C2201/0197 ,  B81C2203/0118 ,  B81C2203/031 ,  C23C16/45529 ,  H01L23/564 ,  H01L51/448 ,  H01L51/524 ,  H01L2924/0002 ,  H05K5/065 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/13 ,  H01L2924/00

Abstract: An apparatus may include a first support covered with at least one ALD precursor and/or at least one MLD precursor, and a second support covered with at least one ALD precursor and/or at least one MLD precursor which is/are complementary to the ALD precursor and/or MLD precursor of the first support. The first support is at least partly joined to the second support by an atomic bond between the ALD precursor of the first support and the ALD precursor of the second support or between the MLD precursor of the first support and the MLD precursor of the second support in such a way that an ALD layer or an MLD layer is formed.

Abstract translation: 装置可以包括覆盖有至少一个ALD前体和/或至少一个MLD前体的第一载体，以及用至少一个ALD前体覆盖的第二载体和/或与ALD互补的至少一个MLD前体 前体和/或第一支持物的MLD前体。 第一载体至少部分地通过第一载体的ALD前体与第二载体的ALD前体之间的原子键或第一载体的MLD前体与第二载体的MLD前体之间的原子键连接在第二载体上 这样形成ALD层或MLD层。

公开(公告)号：US20150132891A1

公开(公告)日：2015-05-14

申请号：US14605486

申请日：2015-01-26

Applicant: Maxim Integrated Products, Inc.

Inventor： Quanbo Zou ,  Uppili Sridhar ,  Amit S. Kelkar ,  Xuejun Ying

IPC: H01L23/00

CPC classification number: H01L24/83 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/035 ,  C25D7/123 ,  C25D17/001 ,  C25D17/005 ,  C25D17/007 ,  H01L23/481 ,  H01L24/13 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/13144 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01068 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/30101 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method including: providing a first wafer stack; applying a first bonding layer on the first wafer stack; providing a second wafer stack, where the second wafer stack includes vias; and applying a second bonding layer to the second wafer stack. The vias extend through the second wafer stack and to the second bonding layer. The second bonding layer is bonded to the first bonding layer. A seed layer is applied on a side of the second wafer stack opposite the second bonding layer such that a material of the seed layer (i) contacts the vias, and (ii) extends over and past ends of the second wafer stack and onto the first bonding layer.

Abstract translation: 一种方法，包括：提供第一晶片叠层; 在第一晶片叠层上施加第一粘结层; 提供第二晶片堆叠，其中第二晶片堆叠包括通孔; 以及将第二结合层施加到所述第二晶片堆叠。 通孔延伸穿过第二晶片堆叠并延伸到第二结合层。 第二接合层与第一接合层接合。 将种子层施加在与第二接合层相对的第二晶片堆叠的一侧上，使得种子层（i）的材料接触通孔，并且（ii）延伸到第二晶片堆叠的上部和末端，并且延伸到 第一粘结层。

公开(公告)号：US20140260710A1

公开(公告)日：2014-09-18

申请号：US13839923

申请日：2013-03-15

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Gordon A. Shaw ,  Daniel Baseman ,  Chris Finn ,  Jim G. Hunter

IPC: B81C1/00 ,  G01D11/00

CPC classification number: B81B3/0021 ,  B81B2201/0292 ,  B81B2203/0118 ,  B81B2207/015 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/013 ,  B81C2201/0197

Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.

Abstract translation: 本文描述了微结构电镀系统和方法。 一种方法包括在微结构和结合层之间沉积耐镀材料，其中微结构包括电镀工艺基材并将微结构浸入电镀液中。

公开(公告)号：US20140035071A1

公开(公告)日：2014-02-06

申请号：US13563626

申请日：2012-07-31

Applicant: Po-Jui Chen ,  Gary Yama ,  Matthieu Liger ,  Andrew Graham

Inventor： Po-Jui Chen ,  Gary Yama ,  Matthieu Liger ,  Andrew Graham

IPC: H01L29/84 ,  H01L29/66

CPC classification number: H01L29/84 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/015 ,  B81C1/0023 ,  B81C2201/0197 ,  B81C2203/0136 ,  B81C2203/0771 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/18 ,  H01L29/66007

Abstract: A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.

Abstract translation: 具有多个封装的功能层的器件包括衬底，位于衬底顶表面上方的第一功能层，功能层包括第一器件部分，封装第一功能层的第一封装层，位于第一功能层上方的第二功能层 第一封装层，第二功能层包括第二器件部分和封装第二功能层的第二封装层。