公开(公告)号：EP0242025A1

公开(公告)日：1987-10-21

申请号：EP87301263.7

申请日：1987-02-13

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Tsukagoshi, Isao ,  Yamaguchi, Yutaka ,  Nakajima, Atsuo ,  Mikami, Yoshikatsu ,  Muto, Kuniteru ,  Ikezoe, Yoshiyuki

IPC: H01B1/22 ,  H01R4/04

CPC classification number: H01R4/04 ,  H01B1/22 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/068 ,  Y10T29/49194

Abstract: Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or film capable of exhibiting anisotropic-­electroconductivity comprising an electrically insulating adhesive component and electroconductive particles each particle comprising a polymeric core material coated with a thin metal layer.

Abstract translation: 具有高可靠性的导体良好的连接可以通过使用粘接剂组合物或薄膜能够显示出各向异性导电包括电绝缘粘合剂组分和导电颗粒每个颗粒包含涂覆有薄金属层的聚合物芯材来完成。

公开(公告)号：EP0179805A1

公开(公告)日：1986-05-07

申请号：EP85901804.0

申请日：1985-04-16

Applicant: AMP INCORPORATED (a New Jersey corporation)

Inventor： DERY, Ronald, Allen ,  JONES, Warren, Charlie ,  LYNN, William, Joseph ,  ROWLETTE, John, Robert

IPC: H01B1 ,  H05K3 ,  H01H1

CPC classification number: H05K3/323 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01H1/029 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233

Abstract: Composition adhésive anisotropiquement conductrice (10) à utiliser pour connecter électriquement au moins une zone conductrice (14) placée sur un substrat (12) à au moins une zone conductrice (20) placée sur un second substrat (18). La composition (10) consiste en un mélange de particules conductrices et d'un liant adhésif non conducteur (26). Les particules conductrices sont dispersées à travers le liant dans plusieurs éléments conducteurs non contigus (24), de manière que, en appliquant une couche (30) de la composition (10) sur la zone conductrice et la zone isolante (14, 16) sur un substrat (12) et en plaçant dans une relation de conductivité et en faisant adhérer au moins ladite zone conductrice (20) sur le second substrat (18) à au moins ladite zone conductrice (14) sur le premier substrat (12), les éléments (24) établissent une connexion électrique entre les zones conductrices adhérées (14, 20) sur les deux substrats (12, 18). Les éléments (24), toutefois, sont suffisamment espacés entre eux pour empêcher une conductivité électrique entre les zones adjacentes sur le même substrat. Sont également décrits un procédé de connexion électrique des zones conductrices sur deux substrats au moyen de cette composition adhésive anisotropiquement conductrice (0) ainsi que des produits fabriqués en utilisant ce procédé.

公开(公告)号：US20190157541A1

公开(公告)日：2019-05-23

申请号：US16257252

申请日：2019-01-25

Applicant: BROTHER KOGYO KABUSHIKI KAISHA

Inventor： Toru KAKIUCHI

IPC: H01L41/047 ,  B41J2/14 ,  B41J2/16 ,  B41J2/175 ,  H05K3/36 ,  H05K3/32

CPC classification number: H01L41/0475 ,  B41J2/14072 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1643 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14491 ,  H01L41/0973 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/0233 ,  H05K2201/09745 ,  H05K2203/0278

Abstract: An actuator device includes: an actuator including a first contact; and a wire member including a second contact connected to the first contact with a conductive adhesive including a conductive particle. One of the first contact and the second contact is a particular contact. The other of the first contact and the second contact is a specific contact. At least two protrusions and at least one recess are formed on and in the particular contact. The at least two protrusions are arranged in a first direction. The at least one recess is interposed between the at least two protrusions. The particular contact is joined to the specific contact with the conductive adhesive provided in the at least one recess, in a state in which each of the at least two protrusions is in contact with the specific contact.

公开(公告)号：US09756728B2

公开(公告)日：2017-09-05

申请号：US14423417

申请日：2013-05-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tadahiko Sakai ,  Hideki Eifuku ,  Koji Motomura

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/32 ,  H01L23/00 ,  H05K1/03 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/18 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/81193 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/147 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0278 ,  H05K2203/0425 ,  H05K2203/0465 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

公开(公告)号：US20150009633A1

公开(公告)日：2015-01-08

申请号：US14321995

申请日：2014-07-02

Applicant: AU Optronics Corporation

Inventor： Chih-Hung CHEN ,  Po-Fu HUANG ,  Chih-Hao WANG

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K3/361 ,  H05K1/0269 ,  H05K3/323 ,  H05K3/4015 ,  H05K2201/0233 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/10136

Abstract: A circuit board module includes a first circuit board, an electrically conductive structure, a first bump, a second circuit board and an electrically conductive film. The electrically conductive structure and the first bump are disposed on the supporting surface of the first circuit board. The electrically conductive structure and the first bump respectively have a first maximal thickness T1 and a second maximal thickness T2 along the normal direction of the supporting surface. The second circuit board is disposed on the electrically conductive structure and the first bump. The electrically conductive film is disposed between the second circuit board and the electrically conductive structure, and it has a plurality of electrically conductive particles. An average particle diameter D of the electrically conductive particles when undeformed satisfies: 0

Abstract translation: 电路板模块包括第一电路板，导电结构，第一凸块，第二电路板和导电膜。 导电结构和第一凸块设置在第一电路板的支撑表面上。 导电结构和第一凸块分别具有沿着支撑表面的法线方向的第一最大厚度T1和第二最大厚度T2。 第二电路板设置在导电结构和第一凸块上。 导电膜设置在第二电路板和导电结构之间，并且其具有多个导电颗粒。 当未变形时导电颗粒的平均粒径D满足：0

公开(公告)号：US08153030B2

公开(公告)日：2012-04-10

申请号：US12207138

申请日：2008-09-09

Applicant: Min-Sok Jang ,  Kyung-Hwan Ko ,  Seung-Il Lee ,  Jin-Wook Moon ,  Jeong-Geun Han

Inventor： Min-Sok Jang ,  Kyung-Hwan Ko ,  Seung-Il Lee ,  Jin-Wook Moon ,  Jeong-Geun Han

IPC: H01B1/22

CPC classification number: H05K3/323 ,  B22F1/025 ,  H05K2201/0218 ,  H05K2201/0233 ,  Y10T428/2991

Abstract: In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.

Abstract translation: 在含有导电性粒子的各向异性导电性粘合剂中，导电性粒子包括树脂粒子，该树脂粒子形成有腔，该导电性层包围树脂粒子的表面。 通过将树脂颗粒与反应物混合并从树脂颗粒中部分除去反应物而形成空腔。 因此，导电性粒子可以容易地吸收外部压力，从而为导电性粒子提供改善的延展性。

公开(公告)号：US07524559B2

公开(公告)日：2009-04-28

申请号：US11800831

申请日：2007-05-08

Applicant: Kazunobu Kamiya ,  Ryoji Kojima

Inventor： Kazunobu Kamiya ,  Ryoji Kojima

IPC: B32B5/66

CPC classification number: C08J3/128 ,  C01P2004/84 ,  C08J2333/06 ,  C09C3/10 ,  C09J9/02 ,  H01R4/04 ,  H01R4/58 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.

Abstract translation: 由丙烯酸树脂构成的树脂颗粒。 其最大压缩变形率不仅高达60％以上，而且60％压缩变形所需的载荷也小至60mN以下。 因此，使用各向异性导电粘合剂，将导电性材料粘接到作为核心的上述树脂粒子的表面，使用各向异性导电粘合剂，将导电性粒子形成在树脂粒子表面上的导电性粒子。 在将导电粒子分散在粘合剂材料中时，夹在布线板的金属线之间的导电颗粒由于负载较小而大大地变形，从而可以获得具有高导电可靠性的电子器件。

公开(公告)号：US20080153207A1

公开(公告)日：2008-06-26

申请号：US12044239

申请日：2008-03-07

Applicant: Daoqiang Lu ,  Henning Braunisch

Inventor： Daoqiang Lu ,  Henning Braunisch

IPC: H01L21/00

CPC classification number: H01L23/49827 ,  H01L21/485 ,  H01L23/5382 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/365 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H01L2924/00

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.

Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括将包括至少一个顺应性导电球的各向异性导电层放置在设置在第一衬底上的至少一个互连结构上，施加压力以使柔性导电球接触至少一个互连结构， 各向异性导电层以暴露柔性导电球体中的至少一个; 然后将第二基板附着到各向异性导电层。

公开(公告)号：US20080102277A1

公开(公告)日：2008-05-01

申请号：US11966040

申请日：2007-12-28

Applicant: Tae BAE ,  Jin PARK ,  Jung JUN ,  Jae LEE ,  Jung PARK ,  Sang LEE

Inventor： Tae BAE ,  Jin PARK ,  Jung JUN ,  Jae LEE ,  Jung PARK ,  Sang LEE

IPC: B32B5/16 ,  B05D3/04

CPC classification number: H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/25 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).

Abstract translation: 本文公开了具有优异的电可靠性的各向异性导电颗粒，其可用作电连接结构的材料。 进一步公开了一种制备导电颗粒的方法，该导电颗粒包括聚合物树脂基础颗粒和形成在基础颗粒表面上的导电复合金属镀层，其中导电复合金属镀层具有基本上连续的密度梯度，并且可以包括镍（Ni）和 金（Au）。

公开(公告)号：US20080078977A1

公开(公告)日：2008-04-03

申请号：US11863379

申请日：2007-09-28

Applicant: Toshifumi HASHIBA ,  Kazutoshi HAYAKAWA ,  Satomi KUDO ,  Kohei MORIYAMA ,  Tsuyoshi FUJII

Inventor： Toshifumi HASHIBA ,  Kazutoshi HAYAKAWA ,  Satomi KUDO ,  Kohei MORIYAMA ,  Tsuyoshi FUJII

IPC: H01B1/00 ,  B05D5/12 ,  B32B5/16

CPC classification number: H01B1/20 ,  C08J3/12 ,  C08J3/126 ,  C08J2333/20 ,  H01B1/128 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2998

Abstract: Conductive particles each includes a polymer base particle and a conductive layer coating the polymer base particle. Let the compressive elastic deformation characteristic KX of one conductive particle when the displacement of particle diameter of the conductive particles is X % be defined by the following formula: KX=(3/√2)·(SX−3/2)·(R−1/2)·FX. FX is the load (N) necessary for X % displacement of the conductive particles. SX is the compressive deformation amount (mm) upon X % displacement of the conductive particles. R is the particle radius (mm) of the conductive particles. The compressive elastic deformation characteristic K50 when the displacement of particle diameter of the conductive particles is 50% is 100 to 50000 N/mm2 at 20° C., and the recovery factor of particle diameter of the conductive particles when the displacement of particle diameter of the conductive particles is 50% is not less than 30% at 20° C.

Abstract translation: 导电粒子各自包含聚合物基体颗粒和涂覆聚合物基础颗粒的导电层。 使导电粒子的粒径的位移为X％时的一个导电性粒子的压缩弹性变形特性K 由下式定义：K X = 3 /√2）。（S×S-3/2）。（R 1 -2/2）。F X / SUB>。 F X是导电颗粒的X％位移所需的载荷（N）。 S 是导电粒子的X％位移时的压缩变形量（mm）。 R是导电粒子的粒子半径（mm）。 导电粒子的粒径为50％时的压缩弹性变形特性K 50为20℃时为100〜50000N / mm 2，在 当导电颗粒的粒径为50％时，导电颗粒的粒径的恢复系数在20℃时不小于30％