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    FABRICATING PROCESS OF STRUCTURE WITH EMBEDDED CIRCUIT
    91.
    发明申请
    FABRICATING PROCESS OF STRUCTURE WITH EMBEDDED CIRCUIT 有权
    嵌入式电路结构的制作工艺

    公开(公告)号：US20090301997A1

    公开(公告)日：2009-12-10

    申请号：US12211637

    申请日：2008-09-16

    Applicant: Yi-Chun Liu

    Inventor： Yi-Chun Liu

    IPC: H01B13/00

    CPC classification number: H05K3/107 ,  H05K3/045 ,  H05K3/184 ,  H05K3/465 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2203/1173 ,  H05K2203/1338 ,  Y10T29/49155

    Abstract: A fabricating process of a structure with an embedded circuit is described as follows. Firstly, a substrate having an upper surface and a lower surface opposite to the upper surface is provided. Afterward, a dielectric layer is formed on the upper surface of the substrate. Next, a plating-resistant layer is formed on the dielectric layer. Then, the plating-resistant layer and the dielectric layer are patterned for forming an recess pattern on the dielectric layer. Subsequently, a conductive base layer is formed in the recess pattern by using a chemical method, and the plating-resistant layer is exposed by the conductive base layer. After that, the plating-resistant layer is removed.

    Abstract translation: 具有嵌入电路的结构的制造工艺描述如下。 首先，提供具有与上表面相对的上表面和下表面的基板。 之后，在基板的上表面形成电介质层。 接下来，在电介质层上形成耐电镀层。 然后，对电镀层和电介质层进行图案化以在电介质层上形成凹陷图案。 随后，通过使用化学方法在凹陷图案中形成导电性基底层，并且通过导电性基底层露出耐电镀层。 之后，除去耐电镀层。

    Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same
    93.
    发明申请
    Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same 有权
    包含硅氧烷和至少一种金属痕迹的聚合物层及其制造方法

    公开(公告)号：US20070104944A1

    公开(公告)日：2007-05-10

    申请号：US11506617

    申请日：2006-08-17

    Applicant: Lucien Laude ,  Robert Greenberg

    Inventor： Lucien Laude ,  Robert Greenberg

    IPC: B32B27/20 ,  C08L83/04 ,  B05D1/38

    CPC classification number: H05K3/185 ,  C08J7/12 ,  C08J2383/04 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1657 ,  C23C18/204 ,  C23C18/206 ,  H05K3/28 ,  H05K3/387 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/107 ,  H05K2203/1105 ,  Y10T428/26 ,  Y10T428/31663

    Abstract: The present invention provides a process for embedding at least one layer of at least one metal trace in a silicone-containing polymer, comprising: a) applying a polymer layer on a substrate; b) thermally treating the polymer; c) irradiating at least one surface area of the polymer with a light beam emitted by an excimer laser; d) immersing the irradiated polymer in at least one autocatalytic bath containing ions of at least one metal, and metallizing the polymer; e) thermally treating the metallized polymer; f) applying a polymer layer covering the thermally treated metallized polymer; and g) thermally treating the metallized covered polymer. The present invention further provides a polymer layer comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer. The present invention further provides a flexible electrode array comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, A1203, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer.

    Abstract translation: 本发明提供了一种在含硅酮聚合物中嵌入至少一层至少一种金属痕迹的方法，包括：a）在基底上施加聚合物层; b）热处理聚合物; c）用由准分子激光器发射的光束照射所述聚合物的至少一个表面积; d）将经辐射的聚合物浸入至少一种含有至少一种金属的离子的自催化浴中，并对该聚合物进行金属化; e）热处理金属化聚合物; f）涂覆覆盖热处理的金属化聚合物的聚合物层; 和g）热处理金属化被覆聚合物。 本发明还提供一种聚合物层，其包含含硅氧烷的SiO 2，TiO 2，Sb 2 O 3， N 2，N 2 O 3，N 2，N 2 O 3， Fe 3 O 3，滑石，羟基磷灰石或其混合物，以及嵌入所述聚合物层中的至少一种金属迹线。 本发明还提供了一种柔性电极阵列，其包括含硅氧烷的SiO 2，TiO 2，Sb 2 O 3， / SUB>，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3， Fe 3 O 3，滑石，羟基磷灰石或其混合物，以及嵌入所述聚合物层中的至少一种金属迹线。

    Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates
    94.
    发明申请
    Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates 失效
    聚酰亚胺树脂前体溶液，通过使用该溶液制备的电子部件的层压体和制造层压体的方法

    公开(公告)号：US20040018131A1

    公开(公告)日：2004-01-29

    申请号：US10450048

    申请日：2003-06-10

    Inventor： Shinya Izumida ,  Koji Itoh ,  Minoru Oyama ,  Atsushi Suuki

    IPC: C22B011/00 ,  C01G055/00

    CPC classification number: H05K3/387 ,  C08K5/0025 ,  C08K5/0091 ,  C09D179/08 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2033 ,  C23C18/30 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/185 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0236 ,  H05K2203/0709 ,  C08L79/04 ,  C08L79/08

    Abstract: Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.

    Abstract translation: 电子部件用层叠体通过在聚酰亚胺基板上涂布含有钯化合物的聚酰亚胺树脂前体溶液进行干燥而形成聚酰亚胺树脂前体层，在氢供体存在下照射紫外线，形成核 用于底漆电镀，通过无电解电镀形成金属底漆层，并且在形成表面镀层之后或之后通过加热将聚酰亚胺树脂前体层转化成聚酰亚胺树脂层。 本发明提供了电子部件的层叠体，其极大地改善了与金属层的粘附性，而不损害基板固有的特性，绝缘性能优异，并且用于制造层压体的聚酰亚胺树脂前体树脂溶液。

    Method for fabricating a printed circuit board by curing under superatmospheric pressure
    96.
    发明授权
    Method for fabricating a printed circuit board by curing under superatmospheric pressure 失效
    在超大气压下通过固化制造印刷电路板的方法

    公开(公告)号：US5856068A

    公开(公告)日：1999-01-05

    申请号：US850791

    申请日：1997-05-02

    Applicant: Yaroslaw Antin Magera ,  Everett Furber Simons

    Inventor： Yaroslaw Antin Magera ,  Everett Furber Simons

    IPC: H05K3/00 ,  H05K3/18 ,  H05K3/46 ,  G03F7/26

    CPC classification number: H05K3/184 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2203/074 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/0023

    Abstract: A process for fabricating a multilayer printed circuit board, in which interlayer adhesion of the layers is greatly enhanced by curing under superatmospheric pressure. The method generally includes depositing a first resin layer (12) onto a substrate (10), which is then patterned so as to cross-link a preselected portion of the resin layer (12). A second resin layer (18) is then deposited over the first resin layer (12), and then patterned to cross-link a portion thereof. Openings in the first and second resins are developed by removing those portions of the resins that were not cross-linked during patterning. Openings (26) in the second resin layer (18) provide access to the first resin layer (12) by subsequent chemical processes. The portions of the first (12) and second (18) resin layers cross-linked during patterning remain on the substrate (10) to form permanent dielectric layers. The first resin layer (12) preferably includes a filler catalytic to plating, thereby enabling direct plating of the first resin layer (12) to form metal features within the multilayer structure. The process yields a multilayer printed circuit board that exhibits increased interlayer adhesion subsequent to plating caused by curing the first and second resin under superatmospheric pressure.

    Abstract translation: 一种制造多层印刷电路板的方法，其中通过在超大气压下固化来大大提高层的层间粘合。 该方法通常包括将第一树脂层（12）沉积到衬底（10）上，然后将其图案化以交联树脂层（12）的预选部分。 然后在第一树脂层（12）上沉积第二树脂层（18），然后将其图案化以交叉其一部分。 第一和第二树脂中的开口通过去除在图案化期间未交联的那些部分树脂来开发。 第二树脂层（18）中的开口（26）通过后续的化学处理提供对第一树脂层（12）的通路。 在图案化期间交联的第一（12）和第二（18）树脂层的部分保留在基板（10）上以形成永久电介质层。 第一树脂层（12）优选包括催化镀层的填料，从而能够直接电镀第一树脂层（12）以在多层结构内形成金属特征。 该方法产生多层印刷电路板，其在超大气压下通过固化第一和第二树脂而在电镀之后表现出增加的层间粘附。

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