公开(公告)号：US20100319470A1

公开(公告)日：2010-12-23

申请号：US12816791

申请日：2010-06-16

Applicant: Wolfgang Wehrle ,  Alexander Juergens

Inventor： Wolfgang Wehrle ,  Alexander Juergens

IPC: G01D7/00 ,  B32B37/24 ,  B23K31/02

CPC classification number: H05K5/065 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2203/1316

Abstract: The present invention relates to a method for manufacturing a housing-less sensor, in particular a proximity sensor. Here it is proposed to build all of the components needed for the mechanical and electrical functions on one sensor chassis and then to inject a plastic compound around the components.

Abstract translation: 本发明涉及一种用于制造无外壳传感器，特别是接近传感器的方法。 在这里，建议在一个传感器底盘上构建机械和电气功能所需的所有组件，然后在组件周围注入塑料复合材料。

公开(公告)号：US07633015B2

公开(公告)日：2009-12-15

申请号：US12214682

申请日：2008-06-19

Applicant: Josh Wurzel ,  Shawn Robert Gettemy ,  Ahmad Al-Dahle ,  Carlin James Vieri ,  Wei Yao

Inventor： Josh Wurzel ,  Shawn Robert Gettemy ,  Ahmad Al-Dahle ,  Carlin James Vieri ,  Wei Yao

IPC: H05K1/16

CPC classification number: H05K9/0024 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/181 ,  H05K3/284 ,  H05K9/0084 ,  H05K2201/09872 ,  H05K2201/10689 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T156/1052 ,  H01L2924/00

Abstract: An electronic circuit component is provided with shielding for electro-magnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is then covered by a layer of EMI shielding that conforms to the shape of the surface of the insulation to which the shielding is applied.

公开(公告)号：US20060047053A1

公开(公告)日：2006-03-02

申请号：US10927039

申请日：2004-08-27

Applicant: Ivan Pawlenko ,  Larry Samson

Inventor： Ivan Pawlenko ,  Larry Samson

IPC: B32B15/04 ,  B32B5/16 ,  C08K3/04

CPC classification number: H05K9/0083 ,  B82Y30/00 ,  C08K3/041 ,  C08K7/06 ,  C08K2201/011 ,  H05K1/0218 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/09872 ,  H05K2203/0126 ,  Y10T428/25 ,  Y10T428/31678

Abstract: A thermally conductive polymer composition is applied to mounted components to provide both thermal control and RF radiation attenuation. In order to improve the RF attenuation performance, a plurality of discrete conductive elements may be incorporated into the polymer composition, with the sizing, spacing and configuration of the suppressed most efficiently by the particular composition. The discrete conductive elements are significantly larger, on the order of 1-5 mils (approximately 25-127 μm) than the filler materials utilized to render the base polymer conductive. Also disclosed is an apparatus and a method for preparing and applying such a polymer composition to an electronic component.

Abstract translation: 将导热聚合物组合物应用于安装的组件以提供热控制和RF辐射衰减。 为了提高RF衰减性能，可以将多个离散的导电元件结合到聚合物组合物中，具有通过特定组合最有效地抑制的尺寸，间距和构型。 离散导电元件显着地大于用于使基底聚合物导电的填充材料大约1-5密耳（约25-127μm）。 还公开了一种用于制备和应用这种聚合物组合物到电子部件的装置和方法。

公开(公告)号：US5380806A

公开(公告)日：1995-01-10

申请号：US227989

申请日：1994-04-15

Applicant: Hitoshi Yano

Inventor： Hitoshi Yano

IPC: C08G59/00 ,  C08L63/00 ,  C08L75/00 ,  C08L75/06 ,  C09D11/00 ,  C09D11/03 ,  C09D11/10 ,  C09D11/102 ,  H05K3/28 ,  C08F283/00

CPC classification number: H05K3/285 ,  C08L63/00 ,  C08L75/06 ,  C09D11/102 ,  H05K2201/09872

Abstract: The present invention provides an ink composition for printing which comprises a blend of 100 parts by weight of a copolymer comprising a polycaprolactonepolyol, a diamine and a diisocyanate, 30 to 300 parts by weight of a novolac type epoxy resin, 30 to 300 parts by weight of a bisphenol type epoxy resin, 0.2 to 20 parts by weight of a thixotropic agent, 0.1 to 30 parts by weight of a defoaming agent, and 0.1 to 10 parts by weight of a leveling agent. This ink composition is excellent in storage stability, heat resistance, adhesive properties, flexibility, electrical properties, chemical resistance and printing properties as a one-pack type ink composition.

Abstract translation: 本发明提供一种印刷用油墨组合物，其包含100重量份的包含聚己内酯多元醇，二胺和二异氰酸酯的共聚物，30〜300重量份酚醛清漆型环氧树脂，30〜300重量份 的双酚型环氧树脂，0.2〜20重量份的触变剂，0.1〜30重量份的消泡剂和0.1〜10重量份的流平剂。 该油墨组合物作为单组分型油墨组合物的储存稳定性，耐热性，粘合性，柔性，电性能，耐化学性和印刷性优异。

公开(公告)号：US5330101A

公开(公告)日：1994-07-19

申请号：US954313

申请日：1992-09-30

Applicant: James J. Turner ,  William E. Donges

Inventor： James J. Turner ,  William E. Donges

IPC: B05B7/26 ,  B05B12/14 ,  B05B15/02 ,  B05C9/06 ,  B05D1/02 ,  B05D7/24 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K3/0091 ,  B05B12/14 ,  B05B15/025 ,  H05K2201/09872 ,  H05K2203/086 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1509 ,  H05K3/284

Abstract: Apparatus for applying a conformal coating to circuit boards which includes fluid circuits for applying coating material, solvent and drying circuits for cleaning the coating material circuits, and both a solvent dock and a nitrogen dock for the coating application nozzle to prevent skin-over of various coating materials thereon between coatings. Changeover controls and circuits for changing coating materials are disclosed, as well as solvent dump and replenishment circuits for the applicator nozzle solvent dock, and a supply line and cup for the alternative nitrogen dock.

Abstract translation: 用于对电路板施加保形涂层的装置，其包括用于涂覆涂料的流体回路，用于清洁涂料回路的溶剂和干燥回路，以及用于涂布应用喷嘴的溶剂基座和氮底座，以防止各种 在涂层之间涂覆材料。 公开了用于改变涂层材料的转换控制和电路，以及用于涂布器喷嘴溶剂基座的溶剂转储和补充电路，以及用于替代氮气底座的供应管线和杯子。

公开(公告)号：US5266349A

公开(公告)日：1993-11-30

申请号：US660072

申请日：1991-02-25

Applicant: Hendrik F. Bok

Inventor： Hendrik F. Bok

IPC: B05D1/26 ,  B05D1/30 ,  B05D3/00 ,  B05D3/02 ,  H05K3/00 ,  H05K3/28 ,  B05D3/12

CPC classification number: B05D1/30 ,  H05K3/0091 ,  B05D3/0254 ,  H05K2201/09872 ,  H05K2203/1105 ,  H05K2203/111 ,  H05K2203/1366 ,  H05K2203/1509 ,  H05K3/284

Abstract: Spray coating, particularly flat spray coating of circuit boards. Applicant's method of discrete conformal coating eliminates "railroading" at the edges of the flat spray web and assures precise control of the amount of coating material placed on the circuit board surface, as well as on the varying and complex circuit board components. The method includes pressurizing the coating; longitudinally advancing a surface to be coated, such as a circuit board, beneath the coating, while simultaneously feeding the coating onto the advancing surface as a plural series of aligned droplets extending transversely across the advancing surface. The feeding of coating is triggered "ON/OFF" so as to define longitudinally the series of droplets feeding onto the advancing surface.

Abstract translation: 喷涂，特别是平面喷涂电路板。 申请人的分散保形涂层方法消除了在平坦喷涂网边缘的“铁路”，并确保精确控制放置在电路板表面上的涂层材料的数量，以及变化和复杂的电路板部件。 该方法包括加压涂层; 在涂层下方纵向推进待涂覆的表面（例如电路板），同时将涂层作为横向延伸穿过前进表面延伸的多个对齐的液滴进给到前进表面上。 涂层的供给被触发“ON / OFF”，以便纵向地限定供给到前进表面上的一系列液滴。

公开(公告)号：US5246730A

公开(公告)日：1993-09-21

申请号：US794037

申请日：1991-11-19

Applicant: Roger J. Peirce ,  Raymond P. Becker

Inventor： Roger J. Peirce ,  Raymond P. Becker

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H05K2201/09872 ,  H05K2203/0557 ,  H05K2203/304

Abstract: A method of applying a conformal coating to a printed circuit board and components attached thereto while leaving selected components attached thereto uncoated, comprises the steps of providing a printed circuit board having a multiplicity of components attached thereto, including selected components that are not to be coated; enclosing the selected components within conductive protective enclosures sized to enclose the selected components therein and thereby protect those components from the intrusion of conformal coating material, the enclosures having sufficient electrical conductivity to discharge electrostatic charges therefrom when one of the enclosures is contacted by an electrically conductive medium, thereby protecting the components attached to the printed circuit board from damage due to the discharge of electrostatic charges from the enclosures; applying a conformal coating to the printed circuit board, thereby conformal coating the enclosures and the components which are not protected by the enclosures; and removing the coated enclosures from the selected components.

Abstract translation: 将保形涂层施加到印刷电路板和附着于其上的部件同时留下未涂覆的选定部件的方法包括以下步骤：提供具有连接到其上的多个部件的印刷电路板，包括未被涂覆的选定部件 ; 将所选择的部件封装在导电保护外壳内，其尺寸适于将选定部件包围在其中，从而保护这些部件免受保形涂层材料的侵入，所述外壳具有足够的导电性，以在其中一个外壳与导电 从而保护附接到印刷电路板的部件免受来自外壳的静电电荷的损坏; 将适形涂层施加到印刷电路板上，由此共形涂覆外壳和未被外壳保护的部件; 并从所选择的组件中移除涂覆的外壳。

公开(公告)号：US5155143A

公开(公告)日：1992-10-13

申请号：US674168

申请日：1991-03-25

Applicant: Joseph V. Koleske

Inventor： Joseph V. Koleske

IPC: C08G59/18 ,  C08G59/00 ,  C08G59/20 ,  C08G59/24 ,  C08G59/30 ,  C08G59/62 ,  C08G59/68 ,  C08G63/00 ,  C08G65/06 ,  C08K5/00 ,  C08L63/00 ,  C09D5/00 ,  C09D163/00 ,  H05K3/28

CPC classification number: H05K3/287 ,  C08G59/24 ,  C08G59/68 ,  C08G65/06 ,  C08L63/00 ,  C09D163/00 ,  H05K2201/09872 ,  Y10S428/901 ,  Y10S428/913 ,  Y10T428/31511

Abstract: A photocurable composition based on a cycloaliphatic polyepoxide, a poly(tetramethylene oxide)polyol and photoinitiator; and a printed circuit board having as a conformal coating thereon, the cured product of the photocurable composition.

Abstract translation: 基于脂环族聚环氧化物的光固化性组合物，聚（四氢呋喃）多元醇和光引发剂; 以及其上具有保形涂层的印刷电路板，该光固化组合物的固化产物。

公开(公告)号：US4956221A

公开(公告)日：1990-09-11

申请号：US281304

申请日：1988-12-08

Applicant: Beth I. Gutek

Inventor： Beth I. Gutek

IPC: B05D3/06 ,  C08F299/08 ,  C08L83/08 ,  C09D183/08 ,  H05K3/28

CPC classification number: B05D3/06 ,  C08F299/08 ,  C08L83/08 ,  C09D183/08 ,  H05K3/287 ,  H05K2201/09872 ,  Y10T428/24364 ,  Y10T428/24521 ,  Y10T428/31725

Abstract: A conformal coating composition is made from a mixture of acrylamide functional polydimethylsiloxane, a methacrylate functional/dialkoxy polydiorganosiloxane, reactive diluent including isobornyl acrylate, cyclohexyl acrylate, and 2- ethylhexyl acrylate; a photoinitiator combination of 2-hydroxy- 2-methylphenylpropanone and 2-methyl-1-[4-(methylthio)phenyl]-2- morpholenopropanone, an amine including dimethylethanolamine and diisopropylethylamine, and an organic titantate. The composition has a viscosity of from 0.07 to 0.2 Pa.s at 25.degree. C. and cures by exposure to ultraviolet radiation and to atmospheric moisture, i.e. a dual curing composition. This composition cures too fast by exposure to ultraviolet radiation in the presence of nitrogen resulting in a distorted surface and therefore for coating printed circuit boards it is recommended that it be cured in air so that the rate of cure is reduced and no surface distortions are formed.

Abstract translation: 保形涂料组合物由丙烯酰胺官能的聚二甲基硅氧烷，甲基丙烯酸酯官能/二烷氧基聚二有机硅氧烷，包括丙烯酸异冰片酯，丙烯酸环己酯和丙烯酸2-乙基己酯的反应性稀释剂的混合物制成。 2-羟基-2-甲基苯基丙酮和2-甲基-1- [4-（甲硫基）苯基] -2-吗啉代丙酮的光引发剂组合，包括二甲基乙醇胺和二异丙基乙胺的胺和有机钛酸酯。 该组合物在25℃下的粘度为0.07至0.2Pa.s，并通过暴露于紫外线和大气水分（即双重固化组合物）固化。 该组合物在氮气存在下通过暴露于紫外线辐射而固化得太快，导致表面变形，因此为了涂布印刷电路板，建议在空气中固化，使得固化速率降低并且不形成表面变形 。

公开(公告)号：US4843520A

公开(公告)日：1989-06-27

申请号：US151904

申请日：1988-02-03

Applicant: Yoshio Nakatani ,  Tooru Tamura ,  Mikio Nozu ,  Takahiro Manabe

Inventor： Yoshio Nakatani ,  Tooru Tamura ,  Mikio Nozu ,  Takahiro Manabe

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K5/00

CPC classification number: H05K7/20518 ,  H05K1/0201 ,  H05K1/189 ,  H05K3/284 ,  H05K5/0056 ,  H05K1/05 ,  H05K1/118 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/062 ,  H05K2201/09445 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K3/0058

Abstract: An electronic circuit module comprises a case, first and second substrates disposed in the case on opposite inner walls with a gap therebetween and, a flexible film having a circuit pattern thereon and attached at a part to the first substrate and attached at another part to the second substrate. A first group of electronic components including a heat-generating component are mounted on the film part attached to the first substrate. A second group of electronic components including a low-heat-resistive component are mounted on the film part attached to the second substrate. The gap between the first and second substrates is filled with a resin layer, preferably a foam resin layer, having a low heat conductivity so as to prevent a heat transfer from the heat-generating part to the low-heat-resistive part.

Abstract translation: 电子电路模块包括壳体，第一和第二基板设置在壳体上的相对的内壁上，其间具有间隙;柔性膜，其上具有电路图案，并且在一部分处附接到第一基板并且在另一部分处附接到第一基板 第二基板。 包括发热部件的第一组电子部件安装在附接到第一基板的膜部上。 包括低热阻部件的第二组电子部件安装在附着于第二基板的膜部上。 第一和第二基板之间的间隙填充有导热性低的树脂层，优选泡沫树脂层，以防止从发热部分向低热阻部分的热传递。