Abstract:
A semiconductor fabrication process for fabricating MOS transistors in which dielectric spacer structures are used prior to gate formation to reduce the gate length below the minimum feature size resolvable by the photolithography equipment. A semiconductor substrate having a channel region laterally disposed between a pair of source/drain regions is provided. A dielectric stack is formed on an upper surface of the semiconductor substrate and patterned to expose on upper surface of a spacer region of the semiconductor substrate. The spacer region includes the channel region and peripheral portions of the pair of source/drain regions proximal to the channel region. The patterning of the dielectric stack results in the formation of a pair of opposing sidewalls in the dielectric stack. Thereafter, a pair of first spacer structures are formed on the pair of opposing sidewalls such that the pair of first spacer structures cover or shadow the peripheral portions of the source/drain regions and such that an upper surface of the channel region is exposed. A gate structure is then formed on the upper surface of the channel region. The gate structure is laterally disposed between the pair of first spacer structures. A first dopant species is then introduced into the source/drain regions of the semiconductor substrate.
Abstract:
A circuit is presented which can produce a temperature insensitive, constant current value. The constant current source comprises transistor pairs which mirror a temperature dependent current into a node along with another temperature dependent current. The node thereby receives two temperature dependent currents, wherein one is inversely dependent to that of the other. More specifically, one current may increase as temperature increases, whereas the other current decreases as temperature increases. The two currents may thereby be construed to offset one another such that the output of a common node produces a current output which does not change with either an increase or decrease in temperature imputed upon the current source component.
Abstract:
A load/store buffer is provided which allows both load memory operations and store memory operations to be stored within it. Because each storage location may contain either a load or a store memory operation, the number of available storage locations for load memory operations is maximally the number of storage locations in the entire buffer. Similarly, the number of available storage locations for store memory operations is maximally the number of storage locations in the entire buffer. This invention improves use of silicon area for load and store buffers by implementing, in a smaller area, a performance-equivalent alternative to the separate load and store buffer approach previously used in many superscalar microprocessors.
Abstract:
The invention utilizes two separate LI stack depositions and etches. In the first step, a layer of oxide etch stop (24) and a layer (26) of TEOS oxide are deposited to form a first LI stack. This stac is then contact etched, filled, and polished. A second LI stack is then formed by deposition of a doped silane oxide layer (30) that is contact etched, filled, and polished. The method produces an ILD with a first layer of oxide etch stop (24), a second layer (26) of undoped TEOS oxide, and a final layer of doped silane oxide (30).
Abstract:
A microprocessor including an instruction translation unit and a storage control unit is provided. The instruction translation unit scans the instructions to be executed by the microprocessor. The instructions are coded in the instruction set of a CPU core included within the microprocessor. The instruction translation unit detects code sequences which may be more efficiently executed in a DSP core included within the microprocessor, and translates detected code sequences into one or more DSP instructions. The instruction translation unit conveys the translated code sequences to a storage control unit. The storage control unit stores the code sequences along with the address of the original code sequences. As instructions are fetched, the storage control unit is searched. If a translated code sequence is stored for the instructions being fetched, the translated code sequence is substituted for the code sequence.
Abstract:
Delay times are modified in Ethernet network devices by adding an integer multiple of a delay interval to the minimum interpacket gap (IPG) interval, and decrementing the integer in each network station in response to detected activity on the media. Each station has a unique integer value from the range of zero to the number of stations (N) minus one. The unique integer value ensures that each station has a different delay interval in accessing the media after sensing deassertion of the receive carrier. The station having a zero integer value will have its integer counter reset to (N-1) after a station transmits a data packet on the network, and the stations having nonzero integer values decrement their respective integer counters. Each network station also includes a deferral timer that counts the maximum delay interval of (N-1) delay intervals plus the minimum IPG value, and thus establishes a bounded access latency for a half-duplex shared network.
Abstract:
The high density plasma metal etch rate of a conductive material within a dense array of conductive lines is increased to no less than the etch rate of the conductive material in a bordering open field by injecting a sufficient amount of nitrogen into the total gas flow of the plasma. The injection of nitrogen in amounts of about 15 % and 50 % by volume of the total gas flow effectively reduces the etch rate differential between the dense array and open field, thereby reducing overetching, resist loss, and oxide loss in the open field, and facilitating planarization.
Abstract:
Efficient communication in a network having a minimum data transmission time interval wherein a data packet is transmitted beginning at a start (t20) of the minimum data transmission time interval. An end (t26) of the minimum data transmission time interval is determined and then at least one next data packet is transmitted after the data packet if the end of the minimum data transmission time (t26) is after the end of the data packet (t21).
Abstract:
Delay times are modified in Ethernet network devices by adding a slot time to the minimum interpacked gap (IPG) interval between uninterrupted consecutive transmissions by a network station. If a network station transmits a data packet and has another data packet to send, modified delay time prevents the station from contending for access of the media, enabling other stations having data to transmit to attempt access on the media. If a collision occurs during the transmission of a second successive data packet, the network station uses a modified collision arbitration and automatically sets the collision delay interval to zero for the first access attempt. If another collision occurs during the access attempt, the collision interval is calculated according to the truncated binary exponential backoff algorithm.
Abstract:
A byte swapping device includes first and second data ports and data path logic coupled between the first and second data ports. The byte swapping device is employed in a data processing system comprising a data storage device configured to store bytes of data, a processor which reads data from the data storage device and writes data to the data storage device, and the bytes wapping device coupled between the data storage device and the processor. The first data port is coupled to the storage device and the second data port is coupled to the processor. The storage device is typically a system memory or peripheral device controller. The processor processes data in a first endian format, i.e., big-endian or little-endian format, and at least a portion of the data stored in the data storage device is in the opposite byte ordering. The byte swapping device selectively byte swaps data transferred between the processor and storage device. In the preferred embodiment, data conversion apertures, or ranges, are defined in the processor address space and the processor provides address signals to the byte swapping device. The byte swapping device selectively byte swaps the data based upon the relationship between the addresses received by the byte swapping device and the data conversion apertures. In one embodiment, the processor programs aperture storage elements with the values of the data conversion apertures. In another embodiment, the data conversion apertures are fixed. In an alternate embodiment, the processor provides control signals to the byte swapping device, wherein the byte swapping device selectively converts the data in response to the control signals from the processor. In one embodiment, the processor is configured to execute a characteristic instruction set, wherein the processor provides the one or more control signals to the byte swapping device in response device in response to which instruction in the instruction set the processor executes.