METHOD FOR INJECTION MOLDING OF POLYAMIDE RESIN COMPOSITION

    公开(公告)号:JPS61287960A

    公开(公告)日:1986-12-18

    申请号:JP12824585

    申请日:1985-06-14

    Abstract: PURPOSE:To obtain a resin compsn. having excellent moldability and physical properties, by injection-molding a compsn. consisting of a polyamide resin mainly composed of a xylyleneadipamide unit and a polyester resin mainly composed of a butylene terephthalate unit. CONSTITUTION:A compsn. consisting of 98-50wt% polyamide resin (A) mainly composed of a xylyleneadipamide as a main structural unit and 2-50wt% polyester resin (B) mainly composed of a butylene terephthalate unit as a main structural unit is injection-molded by using a mold at 100 deg.C or below. Examples of the polyamide resins are m-xylyleneadipamide alone and xylyleneadipamide mixtures of at least 60wt% m-xylyleneadipamide and at most 40wt% p- xylyleneadipamide. When injection molding is carried out at a mold temp. of 100 deg.C or below, a molding having excellent physical properties can be obtd. with good moldability. The mold temp. of exceeding 100 deg.C gives no increased benefits in respect of energy and cost.

    UNDERHOOD PARTS FOR AUTOMOBILE USE
    103.
    发明专利

    公开(公告)号:JPS61250054A

    公开(公告)日:1986-11-07

    申请号:JP9100285

    申请日:1985-04-30

    Abstract: PURPOSE:To obtain the titled economical parts of high rigidity, heat resistance and toughness as well as high durability to road anti-freezing agent, by molding a blend of polyamide resin and an active methylol group-contg. phenolic resin. CONSTITUTION:The objective parts can be obtained by molding a blend compris ing (A) 95-45wt% of a polyamide resin [pref. polycapramide (6), polytetra methylene adipamide (46)] and (B) 5-60wt% of a phenolic resin containing 0.5-15(pref. 1-13)wt% of active methylol group (a phenolic resin with both moderate crosslink density and methylol group concentration).

    PRODUCTION OF POLYAMIDE RESIN MOLDED ARTICLE

    公开(公告)号:JPS61204264A

    公开(公告)日:1986-09-10

    申请号:JP4626285

    申请日:1985-03-07

    Abstract: PURPOSE:To produce a molded article of polyamide having excellent mechanical strength, rigidity, moldability and flame-retardance, by adjusting the water- content of a composition composed of an aliphatic polyamide and a specific thermoplastic polyester within a specific range and molding the mixture under melting. CONSTITUTION:(A) 98-60wt%, preferably 90-75% aliphatic polyamide having a relative viscosity of 2-5 (measured in 1% concentrated sulfuric acid solution at 25 deg.C), preferablynylon 6, nylon 46 or nylon 66 is compounded with (B) 2-40%, preferably 10-25% thermoplastic polyester composed mainly of an alkylene terephthalate unit and having an intrinsic viscosity of >=0.4 (measured in 6/4 mixture of phenol/tetrachloroethane at 30 deg.C), preferably polyethylene terephtha late. The water-content of the composition is adjusted to 0.005-0.1% and the composition is molded under melting.

    RESIN COMPOSITION
    106.
    发明专利

    公开(公告)号:JPS6035042A

    公开(公告)日:1985-02-22

    申请号:JP14251083

    申请日:1983-08-05

    Inventor: CHIBA KAZUMASA

    Abstract: PURPOSE:A resin composition excellent in impact resistance, heat resistance, flexibility, moldability, etc., comprising a polyamide resin and a modified polyolefin having a specified functional group. CONSTITUTION:A resin composition comprising 5-98wt% polyamide resin (e.g., nylon 6 or 66) and a modified polyolefin containing 0.001-10mol% at least one functional group selected from among those of formulas I , II, and III (wherein R1-R5 are each H or an organic group), e.g., ethylene/proplylene compolymer having 0.18mol% functional groups of formula IV in side chains. Because the above functional groups contain imido, amido, or like groups and are similar in structure to units constituting a polyamide, this modified polyolefin shows good compatibility with a polyamide. Therefore, it is possible to obtain a resin composition having well-balanced excellent impact resistance, heat resistance, flexibility, fluidity etc.

    POLYAMIDE RESIN COMPOSITION
    108.
    发明专利

    公开(公告)号:JPS5829854A

    公开(公告)日:1983-02-22

    申请号:JP12774481

    申请日:1981-08-17

    Abstract: PURPOSE:To provide the titled compsn. having excellent flexibility and resistance to impact and flexural fatigue, consistng of a polyamide, a copolyolefin and an ionomer resin. CONSTITUTION:A polyamide resin compsn. consists of 50-95wt% polyamide (A) such as nylon 6, nylon 66 or nylon 610, 5-40wt% copolyolefin (B) in which ethylene and 3C or higher alpha-olefin such as propylene are main structural units, and 1-30wt% ethylene ionomer resin (C) such as an ionic polymer obtd. by adding Na to an ethylene/(meth)acrylic acid copolymer. An extremely intinate mixture having excellent flexibility and resistance to impact and flexural fatigue can be obtd. by incorporating a small amount of component C in a mixture of components A and B, said mixture of A and B being poor in compatibility.

    RESIN COMPOSITION
    109.
    发明专利

    公开(公告)号:JPS57207644A

    公开(公告)日:1982-12-20

    申请号:JP9085681

    申请日:1981-06-15

    Abstract: PURPOSE:To obtain a resin composition having lowered moisture absorption and improved dimensional stability and hydrolysis resistance, and miscible uniformly over a wide range of the mixing ratio without phase-separation, by mixing a specific polyester-amide with a polyamide. CONSTITUTION:The objective resin is obtained by mixing (A) 5-95pts.wt. of a polyester-amide composed mainly of (i) 10-95wt% polyester unit of formulaI- formula V (k is 8-10; l is 2-6; m is 1-20), e.g. polybutylene terephthalate unit or a unit derived from undecane dicarboxylic acid and ethylene glycol and (ii) 5-90wt% polyamide unit of formula VI or VII[n is 10 or 11; R is (CH2)q or monocyclic aromatic nucleus; p is 6-12; q is 6-10]e.g. a unit derived from 11-aminoundecanoic acid, and (B) 95-5pts.wt. of a polyamide having a relative viscosity of 2.0-5.0 (measured at 25 deg.C by dissolving 1g of the polymer in 100ml of 98% concentrated sulfuric acid).

    THERMOPLASTIC FILM
    110.
    发明专利

    公开(公告)号:JPS57160612A

    公开(公告)日:1982-10-04

    申请号:JP4563881

    申请日:1981-03-30

    Abstract: PURPOSE:To manufacture film of good pinhole-proofness at low temperature and transparency, by mixing polyamide composed of caproamide as a main constituent and ethylene type ionomer of the specified value at the specified compounding ratio. CONSTITUTION:Polycaproamide obtained by melting epsilon-caprolactam, 60-95wt% and ethylene type ionomer, 5-40wt% (5-50% of carboxyl radical of the copolymer composed of alpha-olefin and alpha,beta unsaturated carboxylic acid is neutralized with zinc ion, ionized and it has a melt index larger than 7.0.) are mixed and pelletized after melting and milling. Then, a film is obtained by extrusion- forming of this pellet by an extruder having a T die. Biaxial stretch treatment is done if necessary.

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