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    System and method for protecting micro-structure of display array using spacers in gap within display device
    106.
    发明公开
    System and method for protecting micro-structure of display array using spacers in gap within display device 有权
    装置和方法用于在显示单元内的凹部保护显示阵列的微结构通过隔离件

    公开(公告)号：EP1640322A3

    公开(公告)日：2008-07-02

    申请号：EP05255641.2

    申请日：2005-09-14

    Applicant: IDC, LLC

    Inventor： Cummings, William J. ,  Gally, Brian J. ,  Palmateer, Lauren ,  Chui, Clarence

    IPC: B81B7/00 ,  G02B26/08

    CPC classification number: B81B7/0058 ,  B81B2201/045 ,  G02B26/001

    Abstract: Physical forces sufficient to deform an electronic device 700 and/or packaging for the electronic device 700 can damage the device. Some mechanical components in a device, for example, in a microelectromechanical device and/or in an interferometric modulator 722 are particularly susceptible to damage. Accordingly, provided herein is a packaging system and packaged electronic device that resists physical damage, a method for manufacturing the same, and a method for protecting an electronic device 700 from physical damage. The packaging system for the electronic device includes one or more spacers 730 that prevent or reduce damage to the electronic device arising from contact with the a backplate 750. In some embodiments, the packaged electronic device comprising spacers is thinner than a comparable device manufactured without spacers.

    METHOD OF MANUFACTURING OF A MICROMACHINE
    107.
    发明授权
    METHOD OF MANUFACTURING OF A MICROMACHINE 有权
    微器件及产生微器件方法

    公开(公告)号：EP1041036B1

    公开(公告)日：2007-05-09

    申请号：EP99947884.5

    申请日：1999-10-13

    Applicant: SEIKO EPSON CORPORATION

    Inventor： KAMIJIMA, Shunji Seiko Epson Corporation ,  YONEKUBO, Masatoshi Seiko Epson Corporation ,  TAKEDA, Takashi Seiko Epson Corporation ,  NISHIKAWA, Takao Seiko Epson Corporation

    IPC: B81B1/00 ,  B81B3/00

    CPC classification number: B81C1/00182 ,  B81B2201/045 ,  B81C2201/034 ,  G02B26/02

    Abstract: A micromachine and a method of manufacturing the same which are suitable as or for a micromachine having a first dynamic fine structural portion constituting a driving portion, and a second static fine structural portion performing a switching function or a function of an optical element, the method comprising forming the second static fine structural portion on the first dynamic fine structural portion, or superposing the second static fine structural portion thereon and die transferring the same thereto, whereby the method enables the second fine structure to be formed without using at least a complicated step, such as a silicon process in an intermediate stage of the method, and into a complicated shape easily with a high reproducibility, and contributes to the improvement of the productivity. Especially, when a plurality of elements are arranged in an arrayed state as in a spatial light modulator, the die transfer techniques enable the second fine structure to be reproduced stably as compared with the techniques using a silicon process for forming all parts of a micromachine, whereby the subject method reduces the probability of occurrence of defects to a remarkably low level and contributes to the improvement of the yield.

    INTEGRATED DRIVER PROCESS FLOW
    109.
    发明公开
    INTEGRATED DRIVER PROCESS FLOW 有权
    DRIVER一体化进程FLOW

    公开(公告)号：EP1509946A1

    公开(公告)日：2005-03-02

    申请号：EP03756181.8

    申请日：2003-05-14

    Applicant: Silicon Light Machines Corporation

    Inventor： HUNTER, James, A.

    IPC: H01L21/00 ,  H01L21/82 ,  H01L21/302

    CPC classification number: G02B26/0808 ,  B81B2201/045 ,  B81B2207/015 ,  B81B2207/07 ,  B81C1/00246 ,  B81C2201/016 ,  B81C2203/0735 ,  B81C2203/0778 ,  H01L27/0611

    Abstract: An integrated device including one or more device drivers and a diffractive light modulator monolithically coupled to the one or more driver circuits. The one or more driver circuits are configured to process received control signals and to transmit the processed control signals to the diffractive light modulator. A method of fabricating the integrated device preferably comprises fabricating a front-end portion for each of a plurality of transistors, isolating the front-end portions of the plurality of transistors, fabricating a front-end portion of a diffractive light modulator, isolating the front-end portion of the diffractive light modulator, fabricating interconnects for the plurality of transistors, applying an open array mask and wet etch to access the diffractive light modulator, and fabricating a back-end portion of the diffractive light modulator, thereby monolithically coupling the diffractive light modulator and the plurality of transistors.

    Electrostatic bimorph actuator
    110.
    发明公开
    Electrostatic bimorph actuator 有权
    静电双晶片致动

    公开(公告)号：EP1350758A3

    公开(公告)日：2004-12-15

    申请号：EP03002122.4

    申请日：2003-01-30

    Applicant: MICROSOFT CORPORATION

    Inventor： Sinclair, Michael J.

    IPC: B81B3/00 ,  G02B26/08

    CPC classification number: B81B3/0054 ,  B81B2201/032 ,  B81B2201/038 ,  B81B2201/045 ,  B81B2201/047

    Abstract: An electrostatic bimorph actuator includes a cantilevered flexible bimorph arm that is secured and insulated at one end to a planar substrate. In an electrostatically activated state the bimorph arm is generally parallel to the planar substrate. In a relaxed state, residual stress in the bimorph arm causes its free end to extend out-of-plane from the planar substrate. The actuator includes a substrate electrode that is secured to and insulated from the substrate and positioned under and in alignment with the bimorph arm. An electrical potential difference applied between the bimorph arm and the substrate electrode imparts electrostatic attraction between the bimorph arm and the substrate electrode to activate the actuator. As an exemplary application in which such actuators could be used, a microelectrical mechanical optical display system is described.

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