Packaging of micro device
    110.
    发明专利
    Packaging of micro device 审中-公开
    微型器件的封装

    公开(公告)号:JP2008126402A

    公开(公告)日:2008-06-05

    申请号:JP2007296008

    申请日:2007-11-14

    Inventor: PAN SHAOHER X

    CPC classification number: B81B3/0005 B81C1/00992 B81C2201/0181 B81C2201/112

    Abstract: PROBLEM TO BE SOLVED: To provide a method for applying an anti-stiction material to a micro device, and a micro mechanical device to which the anti-stiction material is applied.
    SOLUTION: There is provided a method of applying an anti-stiction material to a micro device, including the steps of: enclosing the micro device in a chamber; vaporizing the anti-stiction material in a container, thereby forming the vaporized anti-stiction material; transferring the vaporized anti-stiction material from the container into the chamber in which the micro device is enclosed, via an inlet fluidly communicating with the chamber; and depositing the vaporized anti-stiction material on a surface of the micro device.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供将抗静电材料施加到微型装置的方法以及应用抗静电材料的微机械装置。 解决方案:提供了一种将抗静电材料施加到微型装置的方法,包括以下步骤:将微型装置封闭在腔室中; 在容器中蒸发抗静电材料,从而形成汽化的抗静电材料; 通过与腔室流体连通的入口将蒸发的抗静电材料从容器转移到微型装置被封闭的腔室中; 以及将所述蒸发的抗静电材料沉积在所述微型装置的表面上。 版权所有(C)2008,JPO&INPIT

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