公开(公告)号：US20160336637A1

公开(公告)日：2016-11-17

申请号：US15222230

申请日：2016-07-28

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P3/16

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US20150349398A1

公开(公告)日：2015-12-03

申请号：US14825682

申请日：2015-08-13

Applicant: FUJIKURA, LTD.

Inventor： Yusuke UEMICHI

IPC: H01P11/00

CPC classification number: H01P11/003 ,  H01P5/107 ,  H05K1/0251 ,  H05K3/002 ,  H05K3/0029 ,  H05K2201/037 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2203/0733 ,  Y10T29/49018

Abstract: A method for manufacturing a mode converter including a substrate that is a single member and includes a first main surface, a second main surface opposite to the first main surface, and a micro hole which is formed in the first main surface, grounding conductor layers that are formed on the first main surface and the second main surface, a plane circuit that is formed on the first main surface, and a pin that is formed so as to cover an inner surface of the micro hole and is electrically connected to the plane circuit, the method includes: irradiating the substrate with laser light to form a first modified portion to a desired depth from one main surface of the substrate; removing the first modified portion to form the micro hole; and filling the micro hole with a conductive material to form the pin.

Abstract translation: 一种制造模式转换器的方法，该模式转换器包括作为单个部件的基板，包括第一主表面，与第一主表面相对的第二主表面和形成在第一主表面中的微孔，接地导体层， 形成在第一主表面和第二主表面上，形成在第一主表面上的平面电路和形成为覆盖微孔的内表面并且与平面电路电连接的销 所述方法包括：用激光照射所述基板，以从所述基板的一个主表面形成到所需深度的第一改质部分; 去除所述第一改性部分以形成所述微孔; 并用导电材料填充微孔以形成销。

公开(公告)号：US09052074B2

公开(公告)日：2015-06-09

申请号：US13591249

申请日：2012-08-22

Applicant: Gerald Katzler ,  Alessandro Scordino ,  Franco Zanon

Inventor： Gerald Katzler ,  Alessandro Scordino ,  Franco Zanon

IPC: F21S4/00 ,  F21V23/06 ,  H01R13/10 ,  H05K3/28 ,  H05K3/40 ,  H01R12/71 ,  H01R13/11 ,  H01R12/52 ,  F21Y101/02

CPC classification number: F21S4/003 ,  F21S4/20 ,  F21V23/06 ,  F21Y2115/10 ,  H01R12/52 ,  H01R12/718 ,  H01R13/10 ,  H01R13/11 ,  H05K1/0293 ,  H05K1/189 ,  H05K3/284 ,  H05K3/403 ,  H05K2201/037 ,  H05K2201/10106 ,  H05K2201/1031 ,  H05K2203/0228 ,  H05K2203/1316 ,  Y02P70/611 ,  Y10T29/49002

Abstract: Provide a plurality of lighting modules. Connect together a plurality of the lighting modules for forming a series of lighting modules. Cut the series of lighting modules into lighting devices having a lighting module. Interconnection elements of the last lighting module of each lighting device are cut along their transverse axes. Each lighting module includes a first set of contacts placed at a first end of said lighting module and a second set of contacts placed in corresponding positions at a second end of said lighting module. Each lighting module is connected to the next lighting module by means of interconnection elements which connect the first set of contacts of each lighting module to the second set of contacts of the next lighting module. Interconnection elements include a base plate and a hollow portion in order to form female connectors when said interconnection elements are cut along their transverse axis.

Abstract translation: 提供多个照明模块。 将多个照明模块连接在一起以形成一系列照明模块。 将一系列照明模块切割成具有照明模块的照明装置。 每个照明装置的最后一个照明模块的互连元件沿其横向轴线被切割。 每个照明模块包括放置在所述照明模块的第一端处的第一组触点和放置在所述照明模块的第二端处的对应位置的第二组触点。 每个照明模块通过将每个照明模块的第一组触点连接到下一个照明模块的第二组触点的互连元件连接到下一个照明模块。 互连元件包括基板和中空部分，以便当所述互连元件沿其横向轴线切割时形成阴连接器。

公开(公告)号：US08848389B2

公开(公告)日：2014-09-30

申请号：US13062121

申请日：2009-09-15

Applicant: Hirofumi Kawamura ,  Yasuhiro Okada

Inventor： Hirofumi Kawamura ,  Yasuhiro Okada

IPC: H05K1/11 ,  H04B3/52 ,  H01P5/107 ,  H01P5/02 ,  H01P1/04 ,  H05K1/14 ,  H05K1/02

CPC classification number: H01P5/107 ,  H01P1/047 ,  H01P5/028 ,  H04B3/52 ,  H05K1/0237 ,  H05K1/144 ,  H05K2201/037 ,  H05K2201/042 ,  H05K2201/10303 ,  Y10T29/49016

Abstract: An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.

Abstract translation: 设置有多个电路板的电子设备使用支撑部件来支持电路板作为无线信号的传输路径。 例如，电子设备设置有用于处理毫米波信号的第一印刷电路板，与印刷电路板信号耦合的第二印刷电路板，并接收毫米波信号以将接收到的信号 信号处理以及布置在印刷电路板之间的预定介电常数的波导，其中波导构成电介质传输路径，并且波导支撑印刷电路板。 该结构使得可以在其另一端接收基于构成介质传输路径的波导的一端辐射的毫米波信号的电磁波。

公开(公告)号：US08818319B2

公开(公告)日：2014-08-26

申请号：US13537727

申请日：2012-06-29

Applicant: Martin Christopher Alderton

Inventor： Martin Christopher Alderton

IPC: H04B1/28

CPC classification number: H01P3/121 ,  H01P1/207 ,  H04H40/90 ,  H05K1/0225 ,  H05K2201/037

Abstract: Various embodiments implement waveguides for signal distribution or signal filtering in satellite receivers. According to some embodiments, a low noise block downconverter (LNB) is implemented using waveguides configured for signal distribution, band pass filtering, low pass filtering, high pass filtering, or band stop filtering. For some embodiments, the waveguides may be formed by the LNB chassis and the ground plane of a printed circuit board mounted to the LNB chassis.

Abstract translation: 各种实施例在卫星接收机中实现用于信号分配或信号滤波的波导。 根据一些实施例，使用配置用于信号分配，带通滤波，低通滤波，高通滤波或带阻滤波的波导来实现低噪声块下变频器（LNB）。 对于一些实施例，波导可以由LNB底架和安装到LNB底架的印刷电路板的接地平面形成。

公开(公告)号：US20130265733A1

公开(公告)日：2013-10-10

申请号：US13439621

申请日：2012-04-04

Applicant: Juan A. Herbsommer ,  Robert F. Payne ,  Marco Corsi ,  Baher S. Haroun ,  Hassan Ali

Inventor： Juan A. Herbsommer ,  Robert F. Payne ,  Marco Corsi ,  Baher S. Haroun ,  Hassan Ali

IPC: H05K1/11 ,  H05K1/18

CPC classification number: G02B6/12004 ,  G02B6/1228 ,  G02B6/43 ,  H01L2223/6627 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01P3/16 ,  H01P5/107 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0274 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2201/10098

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract translation: 提供了一种装置。 存在具有封装基板和集成电路（IC）的电路组件。 封装衬底具有微带线，并且IC被固定到封装衬底并且电耦合到微带线。 电路板也固定到封装衬底。 介质波导固定在电路板上。 电介质波导具有延伸到位于电介质波导和微带线之间的过渡区域的介质芯，并且微带线被配置为与介质波导形成通信链路。

公开(公告)号：US20130051022A1

公开(公告)日：2013-02-28

申请号：US13591249

申请日：2012-08-22

Applicant: Gerald Katzler ,  Alessandro Scordino ,  Franco Zanon

Inventor： Gerald Katzler ,  Alessandro Scordino ,  Franco Zanon

IPC: H05K13/00 ,  F21S4/00

CPC classification number: F21S4/003 ,  F21S4/20 ,  F21V23/06 ,  F21Y2115/10 ,  H01R12/52 ,  H01R12/718 ,  H01R13/10 ,  H01R13/11 ,  H05K1/0293 ,  H05K1/189 ,  H05K3/284 ,  H05K3/403 ,  H05K2201/037 ,  H05K2201/10106 ,  H05K2201/1031 ,  H05K2203/0228 ,  H05K2203/1316 ,  Y02P70/611 ,  Y10T29/49002

Abstract: Provide a plurality of lighting modules. Connect together a plurality of the lighting modules for forming a series of lighting modules. Cut the series of lighting modules into lighting devices having a lighting module. Interconnection elements of the last lighting module of each lighting device are cut along their transverse axes. Each lighting module includes a first set of contacts placed at a first end of said lighting module and a second set of contacts placed in corresponding positions at a second end of said lighting module. Each lighting module is connected to the next lighting module by means of interconnection elements which connect the first set of contacts of each lighting module to the second set of contacts of the next lighting module. Interconnection elements include a base plate and a hollow portion in order to form female connectors when said interconnection elements are cut along their transverse axis.

Abstract translation: 提供多个照明模块。 将多个照明模块连接在一起以形成一系列照明模块。 将一系列照明模块切割成具有照明模块的照明装置。 每个照明装置的最后一个照明模块的互连元件沿其横向轴线被切割。 每个照明模块包括放置在所述照明模块的第一端处的第一组触点和放置在所述照明模块的第二端处的对应位置的第二组触点。 每个照明模块通过将每个照明模块的第一组触点连接到下一个照明模块的第二组触点的互连元件连接到下一个照明模块。 互连元件包括基板和中空部分，以便当所述互连元件沿其横向轴线切割时形成阴连接器。

公开(公告)号：US20120013499A1

公开(公告)日：2012-01-19

申请号：US13259126

申请日：2010-03-31

Applicant: Kazuki Hayata

Inventor： Kazuki Hayata

IPC: G01S13/58 ,  H01Q1/00 ,  H01P3/18

CPC classification number: H01P3/121 ,  G01S7/032 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01P5/107 ,  H05K1/0237 ,  H05K2201/037 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board is provided. The circuit board includes a substrate, a waveguide line and a laminated waveguide. The waveguide line is at least partially positioned on a first surface of the substrate. The waveguide line transmits a high frequency signal. The laminated waveguide is formed inside the substrate. The laminated waveguide is electromagnetically coupled to the waveguide line, and has a lead-out portion led out from inside the substrate to a surface other than the first surface. The laminated waveguide includes a dielectric layer, a pair of main conductive layers and a through conductor group. The pair of main conductive layers sandwiches the dielectric layer in a thickness direction thereof. In the through conductor group, a plurality of through conductors are arranged along a high frequency signal transmitting direction. The plurality of through conductors electrically connect the pair of main conductive layers.

Abstract translation: 提供电路板。 电路板包括基板，波导线和层叠波导。 波导线至少部分地位于基板的第一表面上。 波导线传输高频信号。 层叠波导形成在基板的内部。 层叠波导与波导线电磁耦合，并且具有从基板内引出到除了第一表面之外的表面的引出部分。 叠层波导包括电介质层，一对主导电层和贯通导体组。 一对主导电层在电介质层的厚度方向夹着电介质层。 在贯通导体组中，沿着高频信号发送方向配置多根贯通导体。 多个贯通导体电连接一对主导电层。

公开(公告)号：US20110158344A1

公开(公告)日：2011-06-30

申请号：US13062121

申请日：2009-09-15

Applicant: Hirofumi Kawamura ,  Yasuhiro Okada

Inventor： Hirofumi Kawamura ,  Yasuhiro Okada

IPC: H04L27/04 ,  H01P3/12 ,  H01P11/00

CPC classification number: H01P5/107 ,  H01P1/047 ,  H01P5/028 ,  H04B3/52 ,  H05K1/0237 ,  H05K1/144 ,  H05K2201/037 ,  H05K2201/042 ,  H05K2201/10303 ,  Y10T29/49016

Abstract: An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.

Abstract translation: 设置有多个电路板的电子设备使用支撑部件来支持电路板作为无线信号的传输路径。 例如，电子设备设置有用于处理毫米波信号的第一印刷电路板，与印刷电路板信号耦合的第二印刷电路板，并接收毫米波信号以将接收到的信号 信号处理以及布置在印刷电路板之间的预定介电常数的波导，其中波导构成电介质传输路径，并且波导支撑印刷电路板。 该结构使得可以在其另一端接收基于构成介质传输路径的波导的一端辐射的毫米波信号的电磁波。

公开(公告)号：US20020093402A1

公开(公告)日：2002-07-18

申请号：US10068512

申请日：2002-02-06

Inventor： Louise C. Sengupta ,  Steven C. Stowell ,  Yongfei Zhu ,  Somnath Sengupta ,  Luna H. Chiu ,  Xubai Zhang

IPC: H01P003/08

CPC classification number: H05K1/162 ,  H01P1/181 ,  H01P3/003 ,  H01P3/06 ,  H01P3/081 ,  H01P3/088 ,  H01P3/122 ,  H01P7/06 ,  H01Q3/44 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2203/105 ,  H05K2203/171

Abstract: A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including coaxial cables, cavity antennas, microstrip lines, coplanar lines, and waveguides.

Abstract translation: 可调电介质结构包括第一介电材料层，邻近第一介电材料层定位的第二介电材料层，第二介电材料层的介电常数小于第一层的介电常数 以及用于在第一介电材料上施加可控电压的电极，从而控制第一介电材料的介电常数，其中至少一个电极位于第一和第二介电层之间。 介电材料可以形成为各种形状并且以各种取向相对于彼此组装。 可调电介质结构用于包括同轴电缆，空腔天线，微带线，共面线和波导在内的各种装置。