公开(公告)号：US20170104906A1

公开(公告)日：2017-04-13

申请号：US15388814

申请日：2016-12-22

Applicant: SZ DJI TECHNOLOGY CO., LTD.

Inventor： Yin TANG ,  Hualiang QIU ,  Feihu YANG

IPC: H04N5/225 ,  H05K7/14 ,  H05K1/14

CPC classification number: H04N5/2257 ,  H04N5/225 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K7/14 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/09063 ,  H05K2203/167

Abstract: A circuit board device includes a polyhedral support frame and a circuit board unit. The circuit board unit includes two rigid boards and a flexible board connecting the two rigid boards. The two rigid boards are folded with respect to each other through the flexible board and are disposed on different sides of the support frame, respectively.

公开(公告)号：US09402306B2

公开(公告)日：2016-07-26

申请号：US13574630

申请日：2011-01-31

Applicant: Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

Inventor： Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

IPC: H05K1/00 ,  H05K1/02 ,  H01L27/32 ,  H01L51/52 ,  H01R4/70 ,  H05K3/36 ,  H05B33/08 ,  H05B33/10 ,  H05K13/04 ,  H01L31/0392 ,  H01L31/042 ,  G09F9/00 ,  G09F19/22 ,  H01R4/04 ,  H01R12/70 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.

Abstract translation: 具有载体（40）的多个瓦片（1）的组件。 瓦片（1）包括具有电物理换能器（10）的箔（20）和到所述换能器的电连接器（24,28）。 所述瓦片在所述瓦片的连接部分（1c）中机械地和电耦合到所述载体。

公开(公告)号：US08971676B1

公开(公告)日：2015-03-03

申请号：US14047918

申请日：2013-10-07

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  Robert David Hopkins, II ,  Jon Lexau ,  Ronald Ho ,  John E. Cunningham

IPC: G02B6/12

CPC classification number: G02B6/12 ,  G02B6/42 ,  G02B6/4274 ,  G02B6/428 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/141 ,  H05K2201/046 ,  H05K2201/10121

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract translation: 芯片封装包括在芯片封装中的基板的相同侧上彼此相邻的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，输入/输出（I / O）集成电路耦合到基板和光学集成电路之间的光学集成电路。 该I / O集成电路包括高速I / O电路和节能驱动器和接收器电路，并与光学集成电路上的光学器件进行通信。 通过将集成电路，集成电路和I / O集成电路集成在一起，与具有电互连的芯片封装相比，芯片封装可以有助于提高性能。

公开(公告)号：US08971048B2

公开(公告)日：2015-03-03

申请号：US13787438

申请日：2013-03-06

Applicant: Alliant Techsystems Inc.

Inventor： James D. Lucas ,  Christopher A. McKellips

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/46

CPC classification number: H05K1/148 ,  F42C15/40 ,  F42C19/02 ,  F42C19/06 ,  H05K1/144 ,  H05K3/4691 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/053 ,  H05K2201/2036

Abstract: An electronics package comprising a plurality of mutually parallel, vertically spaced circuit boards of generally circular configuration and electrically connected by a flex circuit comprising a trunk extending circumferentially around the circuit boards and having a branch extending to each circuit board. An electronics package precursor structure and a method of configuring the electronics package from the precursor structure is also disclosed.

Abstract translation: 一种电子封装，包括多个相互平行的垂直间隔的电路板，其大致为圆形，并通过柔性电路电连接，该柔性电路包括围绕电路板周向延伸的导体，并具有延伸到每个电路板的分支。 还公开了电子封装前体结构和从前体结构配置电子封装的方法。

公开(公告)号：US08817458B2

公开(公告)日：2014-08-26

申请号：US13573971

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K1/18 ,  G06F1/18

CPC classification number: H05K1/181 ,  G06F1/16 ,  G06F1/184 ,  G06F1/185 ,  H01R12/79 ,  H05K1/118 ,  H05K1/147 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10545

Abstract: An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

Abstract translation: 电互连系统包括在分叉的内表面上具有电极焊盘的分叉的多层柔性电路。 电子部件通过常规方式安装在柔性电路的一侧或两侧。 当分叉分开时，电极焊盘可与印刷电路板上的各个触点对准。 在通过焊接，导电粘合剂或其他方式将焊盘接合到触点之后，保持牢固的电连接，同时仍然允许柔性电路从一侧到另一侧弯曲一些，从而产生不具有刚性安装的部件和模块的附加设计选项。

公开(公告)号：US20140218954A1

公开(公告)日：2014-08-07

申请号：US14094294

申请日：2013-12-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-jeong YOON ,  Ki-won CHOI

IPC: H01L33/62 ,  F21S8/10 ,  F21S2/00

CPC classification number: H01L33/62 ,  F21S41/141 ,  F21S41/192 ,  F21S43/14 ,  F21S43/195 ,  H01L2224/48091 ,  H05K1/0284 ,  H05K1/117 ,  H05K1/14 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/046 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: Provided is a light-emitting device package module including a light-emitting device; a first circuit board receiving the light-emitting device, and electrically connected with the light-emitting device; and a second circuit board assembled with the first circuit board by using a connection member, and electrically connected with the first circuit board.

Abstract translation: 提供一种发光器件封装模块，其包括发光器件; 接收所述发光装置的第一电路板，并与所述发光装置电连接; 以及通过使用连接构件与第一电路板组装的第二电路板，并与第一电路板电连接。

公开(公告)号：US20140104786A1

公开(公告)日：2014-04-17

申请号：US13573968

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K7/20 ,  H05K3/10 ,  G06F1/20

CPC classification number: H05K1/147 ,  G06F1/20 ,  H01R12/62 ,  H01R12/737 ,  H05K1/118 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10545 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155

Abstract: An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.

公开(公告)号：US20140104775A1

公开(公告)日：2014-04-17

申请号：US13573971

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/18 ,  G06F1/16

CPC classification number: H05K1/181 ,  G06F1/16 ,  G06F1/184 ,  G06F1/185 ,  H01R12/79 ,  H05K1/118 ,  H05K1/147 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10545

Abstract: An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

公开(公告)号：US20100059880A1

公开(公告)日：2010-03-11

申请号：US12554173

申请日：2009-09-04

Applicant: Joong-Hyun BAEK

Inventor： Joong-Hyun BAEK

IPC: H01L23/34

CPC classification number: H01L23/467 ,  H01L23/5385 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/06579 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/046 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10734 ,  H01L2224/0401

Abstract: A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the module substrate, and a plurality of memory devices formed on another part of the module substrate, wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter. The electronic system includes the semiconductor module.

Abstract translation: 提供了三维半导体模块和包括该三维半导体模块的电子系统。 半导体模块包括模块衬底，形成在模块衬底的一部分上的逻辑器件和形成在模块衬底的另一部分上的多个存储器件，其中多个存储器件垂直于逻辑器件设置，以及 其上形成有多个存储器件的模块衬底由支撑件支撑。 电子系统包括半导体模块。

公开(公告)号：US20100038758A1

公开(公告)日：2010-02-18

申请号：US12192496

申请日：2008-08-15

Applicant: Thilo Stolze

Inventor： Thilo Stolze

IPC: H01L23/34 ,  H01L21/00 ,  H01L23/495

CPC classification number: H01L23/367 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/5387 ,  H01L24/48 ,  H01L25/07 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K1/141 ,  H05K1/148 ,  H05K3/284 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/10484 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.

Abstract translation: 具有两个冷却表面和方法的半导体模块。 一个实施例包括具有第一冷却表面的第一载体和具有第二冷却表面的第二载体。 第一冷却表面布置在第一平面中，第二冷却表面相对于第一平面以不同于0°的角度布置在第二平面中。