Abstract:
A processor employing a dynamically configurable bus interconnect is provided. The interconnect routes data between functional units and memories included within the processor in response to an instruction field. As opposed to a particular hard-wired interconnect, the dynamically variable interconnect may be modified to form an optimum interconnect for the particular algorithm being executed. Still further, the interconnect may be modified between several configurations during the execution of the algorithm, as often as each clock cycle. Because an instruction field is used to directly specify the configuration of the interconnect during execution of that instruction, control over the interconnect is afforded to the programmer writing the code which implements a particular algorithm.
Abstract:
A method for patterning an underlying substrate includes forming a layer of spin-on glass over the substrate, forming a layer of photoresist over the spin-on glass, patterning the photoresist, patterning the spin-on glass using the photoresist as a mask, and patterning the substrate by applying an etch using the spin-on glass as a hard mask wherein the etch removes the photoresist and partially removes the spin-on glass. In one embodiment, the spin-on glass is patterned by applying a fluorine-based plasma, an aluminium-based substrate is patterned by applying a chlorine-based plasma in which an etch selectivity of the substrate to the spin-on glass is at least 10:1, and the spin-on glass is removed by applying another fluorine-based plasma.
Abstract:
A microprocessor system having a first read path from memory and a second read path from peripheral units and an isolation buffer to isolate the first read path from the second read path. The system also has a first write path to memory and a second write path to peripheral units and an isolation buffer to isolate the first write path from the second write path. The isolation buffers also isolate the write paths from the read paths. Also included is a monitoring path between the peripherals and an external bus to allow program monitoring of data in the peripheral units.
Abstract:
A microprocessor including an instruction decode unit configured to detect a DSP call instruction is provided. The DSP call instruction is indicative of a call to a subroutine which performs a DSP function. Detected DSP call instructions are routed to a DSP which executes a routing performing the corresponding function. Subsequent to the DSP completing execution of the routine, the microprocessor continues execution at the instruction subsequent to the DSP call instruction. If a DSP is not included in the computer system, the DSP call instruction is executed in a manner similar to a subroutine call instruction. The microprocessor subsequently executes a corresponding routine which performs the DSP function.
Abstract:
A DSP including a register file connected to data memories and functional units is provided. Functional units read operands from the register file and store results into the register file. Various register storage locations from communicative links between the functional units and the memories, in accordance with a particular code sequence being executed by the DSP. Because each functional unit has an independent path to the register file, each functional unit may provide results to the register file concurrently. Additionally, having multiple register storage locations which are accessible to any functional unit permits flexibility in the operation of the DSP. Multiple register storage locations may be used by the same functional unit, allowing program code to be more optimized by storing values for later use in one of the register storage locations, as opposed to storing values in the data memories. The register file essentially provides a buffer between the functional units, and between the functional units and memory.
Abstract:
An isolation technique is provided for improving the overall planarity of isolation regions relative to adjacent active area silicon mesas. The isolation process results in a trench formed in field regions immediately adjacent the active regions. The trench, however, does not extend entirely across the field region. By preventing large area trenches, substantial dielectric fill material and the problems of subsequent planarization of that fill material is avoided. Accordingly, the present isolation technique does not require conventional fill dielectric normally associated with a shallow trench process. While it achieves the advantages of forming silicon mesas, the present process avoids having to rework dielectric surfaces in large area field regions using conventional sacrificial etchback, block masking and chemical-mechanical polishing. The improved isolation technique hereof utilizes trenches of minimal width etched into the silicon substrate at the periphery of field regions, leaving a field mesa. A field dielectric, preferably oxide, is formed upon the field mesa and fills trenches between the field mesa and active mesas, leaving a substantially planar field dielectric commensurate with the upper surface of adjacent active mesas.
Abstract:
An isolation technique is provided for improving the overall planarity of trench isolation regions relative to adjacent silicon mesas. The isolation process results in a spaced plurality of field dielectric having an upper surface substantially coplanar with each other and with adjacent silicon mesa upper surfaces. The isolation process is thereby a planarization process used with the shallow trench technique, wherein etch-enhancing ions are forwarded into the fill dielectric at upper elevational regions of that dielectric. When subjected to a subsequent etchant, the dopants cause the higher elevational regions to be removed at a faster rate than the lower elevational regions. Thus, selective placement of dopants and etch removal pre-conditions the fill dielectric upper surface to a more planar surface globally across the entire wafer. After etch removal predominantly at the higher elevational regions, the remaining fill dielectric upper surface is removed to a level commensurate with the upper surface of silicon mesas thereby producing separate field dielectrics interposed between silicon mesas. The field dielectrics, regardless of their lateral area, each have a substantially planar upper surface at or slightly below the adjoining silicon mesas. By producing planar field dielectric upper surfaces, various problems of non-planarity are removed from the thin films which are thereafter formed on the field dielectrics or between the field dielectrics and silicon mesas.
Abstract:
An execute unit including an integer operation circuit is provided. The integer operation circuit is dynamically configurable to operate upon many different widths of operands. A single pair of operands may be operated upon, wherein the width of the operands is the maximum width the integer operation circuit is configured to handle. Alternatively, multiple pairs of operands having narrower widths may be operated upon. The instruction being executed defines the width of the operands and therefore the number of operands. Wide operand operations are performed at a rate of one per instruction, and a rate of more than one instruction is achieved for narrow operands. The same integer operation circuitry is employed to perform both narrow and wide integer operations. Silicon area consumed by the integer operation circuitry may be reduced as compared to a wide integer operation circuit and multiple narrow integer operation circuits.
Abstract:
A power cross detection circuit that detects a power cross condition on the ring and tip lines of a telephone system. The power cross detection circuit senses a loop current flowing across a ring feed resistor (Rgfd 1), as well as a loop voltage at a first node (2) and a second node (4) at opposite ends of the ring feed resistor. Based on these sensed values, a threshold voltage for detecting a power cross condition can be adjusted to detect the power cross condition at a lower voltage value.
Abstract:
A method and apparatus for software to access a microprocessor serial number. Provision of the serial number allows the manufacturer better control over its product and also permits software vendors to register their products. The serial number is encrypted using a pair of encryption keys to prevent unauthorized changes. At least one of the encryption keys is itself encoded to prevent unauthorized access, while permitting software to access the serial number.