公开(公告)号：AU2003274912A8

公开(公告)日：2004-03-03

申请号：AU2003274912

申请日：2003-08-13

Applicant: INTEL CORP

Inventor： MA QING

IPC: B81B3/00 ,  H01H1/00 ,  H01H37/54 ,  H01H61/00 ,  H01H61/01

Abstract: A microelectromechanical system (MEMS) that includes a first electro-thermal actuator, a second electro-thermal actuator and a beam having a first side and a second side. The first electro-thermal actuator applies a force to the first side of the beam as current passes through the first electro-thermal actuator and the second electro-thermal actuator applies a force to the second side of the beam as current passes through the second electro-thermal actuator.

公开(公告)号：AU2003274912A1

公开(公告)日：2004-03-03

申请号：AU2003274912

申请日：2003-08-13

Applicant: INTEL CORP

Inventor： MA QING

IPC: B81B3/00 ,  H01H1/00 ,  H01H37/54 ,  H01H61/00 ,  H01H61/01 ,  H01H59/00

Abstract: A microelectromechanical system (MEMS) that includes a first electro-thermal actuator, a second electro-thermal actuator and a beam having a first side and a second side. The first electro-thermal actuator applies a force to the first side of the beam as current passes through the first electro-thermal actuator and the second electro-thermal actuator applies a force to the second side of the beam as current passes through the second electro-thermal actuator.

公开(公告)号：AU2003243482A8

公开(公告)日：2004-01-06

申请号：AU2003243482

申请日：2003-06-10

Applicant: INTEL CORP

Inventor： CHOU TSUNG-KUAN ,  MA QING

IPC: B81C1/00 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/522 ,  H01L23/66 ,  H01L27/04

Abstract: A conductive bridge (16) in a second conductive layer may be utilized to join a pair of spaced apart conductive strips (12) in a first conductive layer. A gap (44) between the first and second strips (12) may be bridged by the bridge (16) while isolating both the first and second strips (12) and the bridge (16) itself from another conductor (18) which extends through the gap (44) between the first and second strips (12).

公开(公告)号：AU2003218453A1

公开(公告)日：2003-10-20

申请号：AU2003218453

申请日：2003-03-27

Applicant: INTEL CORP

Inventor： MA QING ,  RAO VALLURI ,  WANG LI-PENG ,  TRAN QUAN ,  HECK JOHN

IPC: B81B7/00 ,  B81C3/00

公开(公告)号：AU3651101A

公开(公告)日：2001-08-27

申请号：AU3651101

申请日：2001-01-22

Applicant: INTEL CORP

Inventor： MA QING ,  CHENG PENG

IPC: G11B5/48 ,  G11B21/16 ,  H03H3/007 ,  H03H9/24 ,  H03H3/00 ,  G11B21/21

Abstract: The invention relates to a hollow microbeam that is fabricated upon a base or pedestal. Processing of the hollow microbeam includes forming at least one hollow channel in the microbeam by removing temporary fillers after formation of the microbeam. The inventive microbeam may provide at least an order of magnitude increase in oscillational frequency over a solid microbeam.