公开(公告)号：JP2006257220A

公开(公告)日：2006-09-28

申请号：JP2005075230

申请日：2005-03-16

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： ICHINOHE DAIGO ,  HAMAGUCHI HITOSHI ,  YONEKURA ISAMU ,  HISAMA SHUNPEI ,  NISHIO HISAHIRO ,  SHIHO KOUJI ,  KAJITA TORU

IPC: C08F220/02 ,  G02F1/1339 ,  G03F7/027 ,  G03F7/033 ,  G03F7/40

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition of high sensitivity and high resolution, and excellent in resilience, rubbing resistance, adhesivity to a transparent substrate and thermal resistance. SOLUTION: This radiation-sensitive resin composition comprises a copolymer having a weight-average molecular weight of 2,000-100,000, obtained by copolymerizing an unsaturated carboxylic acid and/or carboxylic acid anhydride, an unsaturated compound expressed by formula (1) and other unsaturated compounds, a polymerizable unsaturated compound and a radiation-sensitive polymerization initiator. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供高灵敏度和高分辨率，回弹性，耐摩擦性，对透明基材的粘合性和耐热性优异的辐射敏感性树脂组合物。 解决方案：该辐射敏感性树脂组合物包含通过使不饱和羧酸和/或羧酸酐，式（1）表示的不饱和化合物和式（1）表示的不饱和化合物和 其它不饱和化合物，可聚合不饱和化合物和辐射敏感聚合引发剂。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006126397A

公开(公告)日：2006-05-18

申请号：JP2004313456

申请日：2004-10-28

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： ICHINOHE DAIGO ,  KAJITA TORU

IPC: G03F7/004 ,  C08F2/44 ,  C08F20/00 ,  G02F1/1339 ,  G03F7/032 ,  G03F7/40

Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition free of safety problem to a living body, having good suitability to application even to a large substrate, capable of faithfully reproducing the design size of a mask pattern with high sensitivity, and capable of forming spacers for a display panel excellent in adhesion to the substrate and excellent also in strength, heat resistance, etc.
SOLUTION: The photosensitive resin composition comprises (A) a copolymer of (a1) an ethylenically unsaturated carboxylic acid and/or an ethylenically unsaturated carboxylic acid anhydride, (a2) an epoxy-containing ethylenically unsaturated compound and (a3) another ethylenically unsaturated compound, (B) a polymerizable compound having an ethylenically unsaturated bond, (C) a radiation sensitive polymerization initiator, and (D) an organic solvent typified by 1-(1-methyl-2-methoxyethoxy)-2-methoxypropane.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供一种对生物体没有安全问题的感光性树脂组合物，即使对于大的基材也适用于适用性，能够忠实地以高灵敏度再现掩模图案的设计尺寸，以及 能够形成用于显示面板的间隔物，并且在强度，耐热性等方面也具有优异的粘合性。解决方案：感光性树脂组合物包含（A）（a1）烯键式不饱和羧酸和 烯烃不饱和羧酸酐，（a2）含环氧基的烯属不饱和化合物和（a3）另一种烯属不饱和化合物，（B）具有烯属不饱和键的聚合性化合物，（C）辐射敏感聚合引发剂，和 （D）以1-（1-甲基-2-甲氧基乙氧基）-2-甲氧基丙烷为代表的有机溶剂。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005234362A

公开(公告)日：2005-09-02

申请号：JP2004045033

申请日：2004-02-20

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： ICHINOHE DAIGO ,  IWABUCHI TOMOKO ,  NISHIO HISAHIRO ,  KAJITA TORU

IPC: G03F7/032 ,  C08F2/44 ,  C08F265/00 ,  G03F7/028 ,  G03F7/038

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition for spacers capable of suppressing stain of a photomask, etc., due to sublimation of a radiation sensitive polymerization initiator component, producing no in-liquid foreign substance, having high sensitivity and high resolution, and capable of forming spacers excellent in the shape of a cross section, compressive strength, rubbing resistance and adhesiveness to a transparent substrate. SOLUTION: The radiation sensitive resin composition for forming spacers contains (A) a copolymer of an unsaturated carboxylic acid (anhydride), an epoxy-containing unsaturated compound and another unsaturated compound, (B) a polymerizable unsaturated compound, and (C) a radiation sensitive polymerization initiator containing a compound represented by formula (1) as an essential component, wherein R 1 denotes alkyl; R 2 and R 3 each denotes H, alkyl or benzyl; R 4 , R 5 , R 7 and R 8 each denotes H, halogen, alkyl or alkoxyl; and R 6 denotes halogen, alkyl, alkoxyl or the like. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于抑制由于辐射敏感性聚合引发剂组分的升华而导致的光掩模等的污点的辐射敏感性树脂组合物，不产生液体异物，具有高灵敏度 并且能够形成横截面形状优异的隔离物，抗压强度，耐摩擦性和与透明基材的粘合性。 解决方案：用于形成间隔物的辐射敏感性树脂组合物包含（A）不饱和羧酸（酸酐），含环氧基的不饱和化合物和另一种不饱和化合物的共聚物，（B）可聚合不饱和化合物和（C ）含有由式（1）表示的化合物作为必需组分的辐射敏感聚合引发剂，其中R 1表示烷基; R 2 和R 3 各自表示H，烷基或苄基; R 4 ，R 5 ，R＆lt; SP＆gt; 7＆lt; SP＆gt;和＆lt; SP＆gt; 8＆lt; SP＆gt;各自表示H，卤素，烷基或烷氧基; R 6为卤素，烷基，烷氧基等。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005043902A

公开(公告)日：2005-02-17

申请号：JP2004228885

申请日：2004-08-05

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： IWAZAWA HARUO ,  KAJITA TORU ,  IWANAGA SHINICHIRO

IPC: G03F7/004 ,  G03F7/038 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a negative radiation-sensitive resin composition having particularly high sensitivity and excellent resolution, pattern profile or the like. SOLUTION: The negative radiation-sensitive resin composition contains: (A) a radiation-sensitive acid generating agent expressed by formula (1-1) or (1-2); (C) an alkali-soluble resin; and (D) a crosslinking agent. In formulae (1-1), (1-2), each of R 1 , R 2 , R 5 , R 6 represents a hydrogen atom or a 1-4C alkyl group, R 3 represents a hydroxyl group or -OR 4 (wherein R 4 represents a 1-6C monovalent organic group), R 7 represents a hydroxyl group or -OR 8 (wherein R 8 represents a 1-6C monovalent organic group), each of A 1 - and A 2 - represents a monovalent anion, a is an integer of 4 to 7, b is an integer of 0 to 7, c is an integer of 4 to 7, and d is an integer of 0 to 4. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供具有特别高灵敏度和优异分辨率，图案轮廓等的负辐射敏感性树脂组合物。 解决方案：负辐射敏感性树脂组合物包含：（A）由式（1-1）或（1-2）表示的辐射敏感性酸产生剂; （C）碱溶性树脂; 和（D）交联剂。 在式（1-1），（1-2）中，R 1，R 2，R 3，R 3， 6 表示氢原子或1-4C烷基，R 3表示羟基或-OR 4，其中R 4 = SP>表示1-6C单价有机基团），R SP 7表示羟基或-OR 8，其中R SP 8表示1 -6C一价有机基团）中，A“表示1价阴离子，1价阴离子， 是4〜7的整数，b为0〜7的整数，c为4〜7的整数，d为0〜4的整数。（C）2005，JPO＆NCIPI

公开(公告)号：JP2005041931A

公开(公告)日：2005-02-17

申请号：JP2003200723

申请日：2003-07-23

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： TOYOIZUMI TAKASHI ,  KAJITA TORU ,  HATTORI IWAKAZU

IPC: C08J3/00 ,  C08G69/00 ,  C08G77/442 ,  C08J5/18 ,  C08L53/02 ,  C08L77/00 ,  C08L83/10 ,  C08L101/00

Abstract: PROBLEM TO BE SOLVED: To provide a polymer composition for forming a nanometer order fine pattern, and to provide a process for performing a fine processing with the polymer composition. SOLUTION: This polymer composition comprising a polymer and a solvent for dissolving the polymer, wherein the content of foreign matters having diameters of ≤200 nm is ≤10 foreign matters / mL, and the content of foreign matters having diameters of ≥200 nm is ≤1 foreign matter / mL. This method for forming the nanometer order pattern comprises forming the nanometer order pattern with the polymer composition. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 待解决的问题：提供一种用于形成纳米级精细图案的聚合物组合物，并提供用聚合物组合物进行精细加工的方法。 解决方案：该聚合物组合物包含用于溶解聚合物的聚合物和溶剂，其中直径≤200nm的异物含量≤10异物/ mL，直径≥200的异物含量 nm为≤1异物/ mL。 用于形成纳米级图案的方法包括用聚合物组合物形成纳米级图案。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005018086A

公开(公告)日：2005-01-20

申请号：JP2004235722

申请日：2004-08-13

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： IWAZAWA HARUO ,  KAJITA TORU ,  IWANAGA SHINICHIRO

IPC: G03F7/039 ,  G03F7/032 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition as a chemically amplified resist, which is, in particular, excellent in resolution for a contact hole as well as excellent in transparency for radiation, dry etching durability, pattern profile, sensitivity, resolution or the like. SOLUTION: The radiation-sensitive resin composition contains: (A) a resin having an alicyclic skeleton in the main chain and/or the side chain; (B) a resin having ≥60 %/μm transmittance for radiation at 100 to 300 nm wavelength; and (C) a radiation-sensitive acid generating agent. At least one of the component (C) and the component (B) contains an acid-cleaving group. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供作为化学增幅抗蚀剂的辐射敏感性树脂组合物，特别是对于接触孔的分辨率优异，以及辐射透明度优异，干蚀刻耐久性，图案图 ，灵敏度，分辨率等。 解决方案：辐射敏感性树脂组合物含有：（A）主链和/或侧链具有脂环骨架的树脂; （B）100〜300nm波长的辐射透射率≥60％的树脂; 和（C）辐射敏感性酸产生剂。 组分（C）和组分（B）中的至少一种含有酸裂解基团。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2001290274A

公开(公告)日：2001-10-19

申请号：JP2000107183

申请日：2000-04-07

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F32/00 ,  C08F220/00 ,  C08F222/06 ,  C08K5/00 ,  C08K5/092 ,  C08K5/12 ,  C08L33/00 ,  C08L35/00 ,  C08L45/00 ,  C08L101/00 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in balance of characteristics including sensitivity and resolution. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive acid generating agent and (C) a compound of formula (l) [where R1 and R2 are each H, an optionally substituted 1-20C alkyl or -CH2 COOR3 (R3 is a 1-18C alkyl)].

公开(公告)号：JP2001147531A

公开(公告)日：2001-05-29

申请号：JP32809199

申请日：1999-11-18

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: H01L21/027 ,  G03F7/039

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in dry etching resistance, sensitivity, resolution, etc., as a chemical amplification type resist, capable of avoiding a change of the line width of a resist pattern due to a change of the time elapsed from exposure to post-exposure heating and having superior process stability. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin comprising a copolymer of a norbornene derivative typified by 8- hydroxymethyltetracyclo [4.4.0.12,5.17,10]dodec-3-ene, itaconic anhydride and a (meth)acrylic acid derivative typified by a compound of formula 1 or 2 and (B) a radiation sensitive acid generating agent. The resin A is made alkali- soluble when the acid dissociable group is dissociated.

公开(公告)号：JP2001109158A

公开(公告)日：2001-04-20

申请号：JP29150799

申请日：1999-10-13

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: H01L21/027 ,  G03F7/039

Abstract: PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin composition having high transparency to radiation as a chemical amplification type resist, excellent in basic physical properties as a resist such as dry etching resistance, sensitivity, resolution and pattern shape, causing no development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or hardly alkali-soluble acid-dissociable group-containing resin typified by 8-hydroxymethyltetracyclo[4.4.0.12,5.17,10]dodeca-3-ene/maleic anhydride/t-butyl (meth)acrylate copolymer and (B) a radiation sensitive acid generating agent. The resin A is made alkali-soluble when the acid-dissociable group is dissociated.

公开(公告)号：JPH10254139A

公开(公告)日：1998-09-25

申请号：JP7471797

申请日：1997-03-12

Applicant: JSR CORP

Inventor： SUWA MITSUFUMI ,  IWAZAWA HARUO ,  KAJITA TORU ,  IWANAGA SHINICHIRO

IPC: G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To obtain a resist pattern excellent in radiation transmitting property and dry etching resistance by incorporating a specified resin, a radiation sensitive acid producing agent and a solvent mixture of straight chain ketone with cyclic ketone, etc. SOLUTION: This radiation sensitive resin compsn. contains an alkali-insoluble or slightly alkali-soluble resin having an alicyclic skeleton in the principal chain and/or a side chain, contg. acid-cleavable groups and convertible into an alkali-soluble resin when the groups are cleaved, a radiation sensitive acid generating agent that produces an acid when irradiated and a solvent mixture of straight chain ketone with at least one selected from among cyclic ketone, propylene glycol monoalkyl ether acetate and alkyl 2-hydroxypropionate. A resist pattern excellent in uniformity in film thickness, adhesiveness to the substrate, sensitivity, resolution, etc., can be formed.