公开(公告)号：SG125883A1

公开(公告)日：2006-10-30

申请号：SG200004850

申请日：2000-09-16

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/027 ,  G03F7/004 ,  G03F7/039

Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

公开(公告)号：DE60025297T2

公开(公告)日：2006-08-17

申请号：DE60025297

申请日：2000-09-14

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/027 ,  G03F7/039 ,  G03F7/004

Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

公开(公告)号：DE60025297D1

公开(公告)日：2006-03-30

申请号：DE60025297

申请日：2000-09-14

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/027 ,  G03F7/039 ,  G03F7/004

Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

公开(公告)号：AT315245T

公开(公告)日：2006-02-15

申请号：AT00120000

申请日：2000-09-14

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/027 ,  G03F7/004 ,  G03F7/039

Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

公开(公告)号：JPH11121935A

公开(公告)日：1999-04-30

申请号：JP19874398

申请日：1998-07-14

Applicant: JSR CORP

Inventor： SHIODA ATSUSHI ,  MURATA KIYOSHI ,  SATO HOZUMI

IPC: B32B15/08 ,  B32B15/088 ,  B32B15/20 ,  H05K1/03 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To improve adhesion property, heat resistance, electrical insulation, and maintenance stability, by forming a resin layer consisting of a composition with polycarbodiimide and/or modified polycarbodiimide and epoxy compound on a copper foil. SOLUTION: A laminate is formed by forming a resin layer in film shape and then laminating it to a copper foil. The resin layer consists of a composition containing polycarbodiimide and/or deformed polycarbodiimide and epoxy compound. The polycarbodiimide can be obtained by polymerization while regulating the molar amount from organic di-isocyanate and organic mono-isocyanate. Also, a deformed polycarbodiimide where at least one type of compound with a graft reactive group and a carboxylic acid anhydride group is grafted in advance can be used as at least one portion of polycarbodiimide, thus improving the adhesion property, heat resistance, electrical insulation, and maintenance stability of the lamination body.

公开(公告)号：JPH10338810A

公开(公告)日：1998-12-22

申请号：JP16493697

申请日：1997-06-09

Applicant: JSR CORP

Inventor： SHIODA ATSUSHI ,  MURATA KIYOSHI ,  SATO HOZUMI

IPC: C08K5/45 ,  C08L79/08

Abstract: PROBLEM TO BE SOLVED: To obtain a resin composition excellent in solubility in various solvents, storage stability and curing characteristics and capable of giving cured products having high softening temperature and excellent heat resistance, transparency, electrical insulation properties, humidity resistance, wet-heat resistance, adhesiveness and mechanical properties by including a polycarbodiimide and a thiirane compound. SOLUTION: The polymer (polycarbodiimide) (A) having repeating units represented by the formula: -N=C=N-R' (wherein R' is a divalent organic group) is obtained by the decarboxylation condensation of a polyisocyanate compound and is a thermoplastic resin which shows excellent heat resistance because the carbodiimide groups in the molecule are crosslinked when heated. The organic polyisocyanate used in the synthesis is exemplified by phenylene-1,3- diisocyanate. The thiirane compound (B) has at least one thiiranyl group in the molecule and has a molecular weight of 70-20,000 and is obtained by replacing the oxygen atom in the oxirane ring of an oxirane compound by a sulfur atom. 100 pts.wt. component A is incorporated with 5-1,000 pts.wt. component B.

公开(公告)号：JP2002047309A

公开(公告)日：2002-02-12

申请号：JP2000231057

申请日：2000-07-31

Applicant: JSR CORP

Inventor： NAKASE YOSHIHISA ,  KAKIGI KATSUYUKI ,  MURATA KIYOSHI

IPC: B01D15/00 ,  B01D15/04 ,  B01D39/14 ,  C08F2/00 ,  C08F6/06 ,  C08F32/00

Abstract: PROBLEM TO BE SOLVED: To provide a removing method with high energy efficiency, in which metals included can be removed with high-efficiency. SOLUTION: The metal removing method in which the monomer of an alicyclic polymer to or the polymer solution is passed through a filter on which ζ-potential acts, is provided.

公开(公告)号：JP2001209181A

公开(公告)日：2001-08-03

申请号：JP2000277966

申请日：2000-09-13

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F220/18 ,  C08F222/06 ,  C08F232/00 ,  C08K5/00 ,  C08L45/00 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having superior dry etching resistance and high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, excellent also in shelf stability as a composition and retaining satisfactory adhesiveness to a substrate. SOLUTION: The radiation sensitive resin composition contains (A) a resin having repeating units derived from a derivative substituted by an oxygen- containing polar group (e.g. a hydroxyl or hydroxymethyl group) or a nitrogen- containing polar group (e.g. a cyano group), e.g. bicyclo[2.2.1]hept-2-ene or tetracyclo[4.4.0.12,5.17,10]dodec-3-ene, repeating units derived from maleic anhydride and repeating units derived from an acid dissociable ester derivative of (meth)acrylic acid typified by formula 1, 2 or 3 and (B) a radiation sensitive acid generating gent.

公开(公告)号：JPH11116772A

公开(公告)日：1999-04-27

申请号：JP29950997

申请日：1997-10-16

Applicant: JSR CORP

Inventor： SHIODA ATSUSHI ,  MURATA KIYOSHI

IPC: C08K5/40 ,  C08G59/40 ,  C08L63/00 ,  C08L79/00

Abstract: PROBLEM TO BE SOLVED: To obtain a composition having excellent storage stability, curable at a low temperature in a short time to give a cured product with a high softening temperature and excellent in heat resistance, humidity resistance, moist heat resistance and adhesion by admixing a polycarbodiimide and/or a modified polycarbodiimide with an epoxy compound and a thiirane compound. SOLUTION: As the polycarbodiimide is employed one having recurring units of -N=C=N-R (wherein R is a divalent organic group) and a number average mol.wt., in terms of polystyrene measured by the GPC, of usually 400-500,000. As the epoxy compound is employed a compound containing one or more epoxy groups and having a mol.wt. of usually 70-20,000. As the thiirane compound is employed one containing one or more thiiranyl groups and having a mol.wt. of usually 70-20,000. The composition is obtained by substituting, with a thiirane compound, 0.1-75 wt.% of the epoxy compounds in a mixture composition comprising 100 pts.wt. of the polycarbodiimide and 5-1,000 pts.wt. of the epoxy compound.

公开(公告)号：JP2002082438A

公开(公告)日：2002-03-22

申请号：JP2000273962

申请日：2000-09-08

Applicant: JSR CORP

Inventor： MURATA KIYOSHI ,  YAMAMOTO MASASHI ,  SOYANO AKIMASA ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08K5/00 ,  C08L45/00 ,  C08L101/08 ,  G03F7/004 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist, e.g. sensitivity, resolution and pattern shape, excellent also in shelf stability as a composition and retaining satisfactory adhesiveness to a substrate. SOLUTION: The radiation sensitive resin composition contains (A) a low molecular compound obtained by preparing a compound having one or more amino groups with at least one hydrogen atom bonding to a nitrogen atom and substituting a t-butoxycarbonyl group for one or more of such hydrogen atoms bonding to a nitrogen atom, (B) a radiation sensitive acid generating agent and (C) an alkali-insoluble or slightly alkali-soluble acid dissociable group- containing resin having an alicyclic structure in the principal chain and/or a side chain and a carboxylic acid anhydride structure in a side chain and convertible to an alkali-soluble resin when the acid dissociable group is dissociated.