HEAT-RESISTANT ADHESIVE
    112.
    发明专利

    公开(公告)号:JPH0741752A

    公开(公告)日:1995-02-10

    申请号:JP1099994

    申请日:1994-02-02

    Abstract: PURPOSE:To obtain a heat-resistant adhesive which does not deteriorate in heat resistance and adhesiveness even when used at high temperatures by forming it from a specified polymer. CONSTITUTION:The adhesive is formed from a polymer terminated with a group of formula VI (wherein R' is the below-mentioned R or the like) or a group of formula VII and comprising repeating units of formula I [wherein Y1 is a bivalent group of formula II (wherein R is a tetravalent group of formula III or the like)] and repeating unit of formula IV (wherein Y2 is a group of formula V).

    NEW POLYIMIDE AND ITS PRODUCTION
    117.
    发明专利

    公开(公告)号:JPH05186591A

    公开(公告)日:1993-07-27

    申请号:JP22393091

    申请日:1991-09-04

    Abstract: PURPOSE:To improve moldability by imidizing a polyamic acid prepd. by reacting a specific diamine component with a tetracarboxylic acid dianhydride. CONSTITUTION:1mol of a diamine component mainly comprising an arom. diamine of formula I (wherein X is a divalent group of formula II or III) is reacted with 0.001-1.0mol of a tetracarboxylic acid dianhydride of formula IV (wherein R is a tetravalent group selected from the group consisting of noncondensed polycyclic arom. groups formed by linking a 2-27C aliph. group, a cycloaliph. group, a monocyclic aliph. group, a condensed polycyclic arom. group, and an arom. group to each other directly or through a linking member) at 250 deg.C or lower for 4-24hr to give a polyamic acid, which is imidized by heating to 100-400 deg.C to give a polyimide having repeating structural units of formula V.

    POLYAMIDE-IMIDE RESIN COMPOSITION
    119.
    发明专利

    公开(公告)号:JPH0253855A

    公开(公告)日:1990-02-22

    申请号:JP20371688

    申请日:1988-08-18

    Abstract: PURPOSE:To obtain a polyamide-imide resin composition having excellent properties of characteristic polyimide and excellent processing properties and/or low water absorption by blending a polyamide-imide with a specific amount of a specific polyimide. CONSTITUTION:(A) 100 pts.wt. aromatic polyamide-imide containing a repeating unit shown by formula I (Ar is trifunctional aromatic group containing one or more benzene rings; Z is bifunctional organic group), preferably one containing repeating units shown by formula II and formula III is blended with (B) >=1 pt.wt. - =2C aliphatic group, alicyclic group or monocyclic aromatic group), mixed in a dry state and kneaded in a molten state to give a composition.

    AROMATIC POLYESTER IMIDE RESIN COMPOSITION

    公开(公告)号:JPH01319565A

    公开(公告)日:1989-12-25

    申请号:JP15224788

    申请日:1988-06-22

    Abstract: PURPOSE:To obtain aromatic polyether imide-based resin composition for molding having excellent processability and improved heat resistance, chemical resistance and mechanical strength by blending specific thermoplastic polyimide to aromatic polyether imide. CONSTITUTION:(A) 100 pts.wt. aromatic polyether imide is blended with (B) 1-100 pts.wt. thermoplastic polyimide having repeating unit expressed by formula II (R is tetrafunctional group selected from >=2C aliphatic group, cycloaliphatic group or monocyclic aromatic group, etc.), obtained by imidizing of polyamic acid resulted from reaction of ether diamine expressed by formula I and at least one tetracarboxylic dianhydride, by, for instance, preliminary blending of A and B in Henschel mixer, etc., made to powdery, then mixed in molten state at 280-420 deg.C, preferably 300-400 deg.C with twin-screw melt extruder, etc., to afford the aimed aromatic polyether imide resin composition.

Patent Agency Ranking