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    PREPARATION OF OPTICALLY ANISOTROPIC DOPE
    111.
    发明专利
    PREPARATION OF OPTICALLY ANISOTROPIC DOPE 失效

    公开(公告)号：JPS60243153A

    公开(公告)日：1985-12-03

    申请号：JP9858984

    申请日：1984-05-18

    Applicant: TORAY INDUSTRIES

    Inventor： AYA TOSHIHIKO ,  SASAGAWA KOUJI

    IPC: C08L101/00 ,  C08L1/00 ,  C08L27/00 ,  C08L33/00 ,  C08L33/02 ,  C08L67/00 ,  C09K19/34

    Abstract: PURPOSE:To obtain an optically anisotropic dope useful for the production of fiber and film, etc. having high strength, by adding a specific amount of a non- solvent in a specific manner to a solution of a nitrogen-free amorphous aromatic polymer or a vinyl polymer. CONSTITUTION:A nitrogen-free amorphous aromatic polymer containing the unit of formula I (Y is O, S, SO2, CO, etc.; R and R' are H or methyl) (preferably the compound of formula II) or a vinyl polymer (preferably polymethyl methacrylate) is dissolved in its good solvent at a concentration of 5-50wt%, preferably 10-40wt% to obtain a homogeneous solution (A). Separately, a good solvent is mixed with water and a non-solvent (selected from aliphatic compounds which do not dissolve said polymer and are compatible with said good solvent) at a weight ratio of (1-95)/(99-5), preferably (10-80)/(90-20) to obtain a solution (B). The objective optically anisotropic dope can be prepared by adding the solution B to the solution A under stirring until the ratio of the good solvent to the non-solvent in the whole composition reaches 100/(10-60), preferably 100/ (15-50).

    HEAT-RESISTANT THERMOPLASTIC RESIN COMPOSITION
    112.
    发明专利
    HEAT-RESISTANT THERMOPLASTIC RESIN COMPOSITION 失效

    公开(公告)号：JPS60240760A

    公开(公告)日：1985-11-29

    申请号：JP9635884

    申请日：1984-05-16

    Applicant: TORAY INDUSTRIES

    Inventor： AYA TOSHIHIKO

    IPC: C08L79/08

    Abstract: PURPOSE:To improve heat distortion temp., etc., by blending a non-crystalline thermoplastic arom. polyamide-imide resin contg. a diphenyl ether linkage as an essential component with an arom. polyether-imide resin. CONSTITUTION:35-1wt% non-crystalline thermoplastic polyamide-imide resin (A) wherein a diamine or diisocyanate residue is composed of 0-100mol% of a group of formula II, 80-0mol% of a group of formula III and 60-0mol% of formula IV or V (wherein R1, R2 are each a 1-4C alkyl, etc.; X is SO2, CO, etc.; a is 1-25; b is 0, 1-4; c is 0, 1-2) (100mol% in total) is blended with 65- 99wt% arom. polyether-imide resin (B) contg. a repeating unit of formula I (wherein Z is a trivalent arom. residue contg. a six-membered carbon ring; Ar is a bivalent arom. residue; Y is a bivalent arom. and/or aliph. residue) as a main structual unit.

    MANUFACTURE OF FIBER-REINFORCED THERMOPLASTIC RESIN MOLDING
    114.
    发明专利
    MANUFACTURE OF FIBER-REINFORCED THERMOPLASTIC RESIN MOLDING 失效

    公开(公告)号：JPS6036137A

    公开(公告)日：1985-02-25

    申请号：JP14492283

    申请日：1983-08-10

    Applicant: TORAY INDUSTRIES

    Inventor： KOBAYASHI HIROKAZU ,  KITANAKA TAKARA ,  AYA TOSHIHIKO

    IPC: C08J5/24 ,  B29C70/06 ,  B29C70/10 ,  B29K105/08

    Abstract: PURPOSE:To highly facilitate the recovery of a solvent while eliminating environmental problems by immersing a fiber fabrics impregnated with a solution of a thermoplastic polyamide (PAI) resin, a thermoplastic polyetherimide (PEI) or a thermoplastic polyetheramide (PEA) into water. CONSTITUTION:When a molding of a PAI resin, a PEI resin or a PEA resin reinforced with a fabric of a long fiber and containing 5-70vol% of fibers is produced, the fabric is impregnated with a resin dissolved into a hydrophilic organic solvent affinitive to the resin. The fabric impregnated the resin solution thus obtained in the process is immersed into water to obtain a sheet-like matter. The sheet-like matter thus obtained is heated to dewater and remove the solvent until the content of water and the organic solvent is down to less than 3%. In addition, the sheet-like matter is heated and pressurized to be shaped into a sheet or other forms.

    THERMOPLASTIC RESIN COMPOSITION HAVING EXCELLENT SLIDING PROPERTY
    115.
    发明专利
    THERMOPLASTIC RESIN COMPOSITION HAVING EXCELLENT SLIDING PROPERTY 失效

    公开(公告)号：JPS59230052A

    公开(公告)日：1984-12-24

    申请号：JP10635783

    申请日：1983-06-14

    Applicant: TORAY INDUSTRIES

    Inventor： KUBO YASUSHI ,  AYA TOSHIHIKO

    IPC: C08L71/00 ,  C08K3/16 ,  C08L71/08

    Abstract: PURPOSE:To provide a composition having improved abrasion resistance in any kind of atmosphere without lowering the heat-resistance and mechanical properties, by compounding fluorinated graphite to an aromatic thermoplastic polymer containing aryl group and/or ether group, and melting the mixture with heat. CONSTITUTION:50-99.99pts.wt., preferably 60-99.9pts.wt. of an aromatic thermoplastic polymer containing aryl group and/or ether group (e.g. aromatic polysulfone resin, aromatic polyether ketone resin, etc.) is compounded with 0.01- 50pts.wt., preferably 0.1-40pts.wt. of fluorinated graphite fine powder having an average particle diameter of 0.1-50mu and a frictional coefficient of 0.02-0.05. The mixing is carried out at 230-400 deg.C, preferably 250-360 deg.C.

    THERMOPLASTIC POLYAMIDE-IMIDE COPOLYMER
    119.
    发明专利
    THERMOPLASTIC POLYAMIDE-IMIDE COPOLYMER 失效

    公开(公告)号：JPS5891723A

    公开(公告)日：1983-05-31

    申请号：JP18971481

    申请日：1981-11-26

    Applicant: TORAY INDUSTRIES

    Inventor： AYA TOSHIHIKO ,  SASAGAWA KOUJI

    IPC: C08G73/00 ,  C08G73/14 ,  C08G75/00 ,  C08G75/20

    Abstract: PURPOSE:A thermoplatic polyamide-imide copolymer having both good heat stability and fluidity at 300-400 deg.C, and being injection-moldable into moldings having desirable properties, comprising four specified structural units in a specified ratio. CONSTITUTION:A copolymer consisting of structural unit (A) represented by formulaI, wherein Z is a trifunctional aromatic group, two of the three functional groups of which are bonded to the adjacent carbon atoms, structural unit (B) represented by formula II, structural unit (C) represented by formula III and structural unit (D) represented by formula IV, wherein X is -S- or -O-, wherein the structural units are present in such amounts that 1mol of (C+D) is present per mol of (A+B). A/B is 4-70mol%/96-30mol%, and C/D is 10-70mol%/90- 30mol%. When the amount of unit A is below 4mol% or above 70mol%, based on (A+B) units, the melt viscosity of the polyamideimide copolymer becomes excessively high, which is unfavorable.

    PRODUCTION OF POLYAMIDEIMIDE RESIN
    120.
    发明专利
    PRODUCTION OF POLYAMIDEIMIDE RESIN 失效

    公开(公告)号：JPS5714622A

    公开(公告)日：1982-01-25

    申请号：JP8779980

    申请日：1980-06-30

    Applicant: TORAY INDUSTRIES

    Inventor： AYA TOSHIHIKO ,  SASAGAWA KOUJI

    IPC: C08G73/00 ,  C08G73/14

    Abstract: PURPOSE:In the latter half of the polymerization of aromatic polyamideimide, the polymerization reaction is conducted as the solvent containing water is being added to dilute the reaction system, thus producing the titled resin with high melt modability and high mechanical strength. CONSTITUTION:When an aromatic tricarboxylic acid or its derivative such as trimelltic anhydride is made to react with an aromatic diamine such as 4,4'-diaminodipenyl ether in a polar solvent in the presence of a dehydration catalyst such as phosphoric acid at 180-300 deg.C, the reaction is started at a high initial concentration of 45-90wt% in the reactants. Then, in the course of the polymerization, a polar solvent such as N-methylpyrrolidone containing 0.1-20wt% water is added so that the final concentration of the polymer becomes less than 45% to produce the objective resin. USE:Films, fibers, laminates.

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