公开(公告)号：US4700877A

公开(公告)日：1987-10-20

申请号：US842317

申请日：1986-03-21

Applicant: Ralph G. Dodds ,  Patrick B. Ryan

Inventor： Ralph G. Dodds ,  Patrick B. Ryan

IPC: H01R43/02 ,  B23K20/12 ,  B23K37/04

CPC classification number: H01R43/0256 ,  B23K2201/42 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49213 ,  Y10T29/53183 ,  Y10T29/53265

Abstract: A machine for bonding connectors to the edge of a pcb by a Luc process has upper and lower wheels which are translated along the edge of the pcb for engaging the connectors to be applied respectively to the faces of the board. The relative position of the wheels at any given time is determined by mounting one of them to move with a jaw which closes down onto one of the faces.

Abstract translation: 用于通过Luc处理将连接器连接到pcb的边缘的机器具有沿着pcb边缘平移的上轮和下轮，用于将连接器分别接合到板的表面。 车轮在任何给定时间的相对位置是通过将其中一个安装在与其中一个面相连的颚板上移动来确定的。

公开(公告)号：US4620663A

公开(公告)日：1986-11-04

申请号：US702740

申请日：1985-02-19

Applicant: Hitoshi Odashima ,  Hideaki Sasaki ,  Shinichi Kazui ,  Shigeo Shiono ,  Osamu Isshiki ,  Takeshi Kawana

Inventor： Hitoshi Odashima ,  Hideaki Sasaki ,  Shinichi Kazui ,  Shigeo Shiono ,  Osamu Isshiki ,  Takeshi Kawana

IPC: B23K1/005 ,  B23K26/08 ,  H05K3/30 ,  H05K3/34 ,  H05K13/00 ,  H05K13/04 ,  B23K37/04 ,  B23K31/02

CPC classification number: H05K13/0061 ,  B23K1/0056 ,  B23K26/0838 ,  H05K13/0465 ,  H05K3/303 ,  H05K3/3421 ,  B23K2201/42 ,  H05K2201/10689 ,  H05K2203/104 ,  H05K2203/107 ,  H05K3/3494 ,  Y02P70/613

Abstract: An apparatus for connecting wiring patterns on a wiring board and leads of a parts to be mounted on the wiring board, via the solder provided between the leads and the patterns. The parts-connecting apparatus enables, especially, circuit elements of a high degree of, to be connected automatically with high reliability and accuracy by using solder through the steps of setting the wiring board in a predetermined position while pressing a surface thereof so as to remove the warp from the wiring board, fastening the leads of the part to the wiring patterns by a magnet provided on the lower surface of the wiring board, and heating the solder provided on the portions of the leads which are fastened to the wiring patterns.

Abstract translation: 一种用于通过设置在引线和图案之间的焊料，将布线板上的布线图案和要安装在布线板上的部件的引线相连接的装置。 部件连接装置尤其能够通过使用焊料，通过将电路板设置在预定位置的同时按压其表面从而自动地以高可靠性和精度自动连接，从而能够高效地连接电路元件， 来自布线板的翘曲，通过设置在布线板的下表面上的磁体将部件的引线紧固到布线图案，以及加热设置在紧固到布线图案的引线部分上的焊料。

公开(公告)号：US4610388A

公开(公告)日：1986-09-09

申请号：US583113

申请日：1984-02-24

Applicant: Thomas A. Koltuniak ,  William A. Lawrence

Inventor： Thomas A. Koltuniak ,  William A. Lawrence

IPC: B23K1/012 ,  H05K13/04 ,  B23K1/12

CPC classification number: H05K13/0408 ,  B23K1/012 ,  B23K2201/42

Abstract: A circuit board and component manipulation device includes a housing having a circuit board clamp located thereon for positioning a circuit board on the housing. Hot gas for soldering or desoldering operations can be directed to components on the circuit board from one or the other of both an upper gas duct and a lower gas duct, both of which are fed gas from a blower. Each of the ducts include an individual heater located therein so as to control heat input to the gas passing through the ducts. The upper duct terminates in a discharge head which includes a nozzle attached thereto. The nozzle includes an appropriate opening so as to receive a circuit component. The opening is surrounded by a skirt with the gas ducts then positioned outwardly from the skirt. By positioning the component within the skirt, the component is isolated from hot gas utilized for soldering or desoldering of the connectors of the component to an appropriate circuit board.

Abstract translation: 电路板和部件操纵装置包括具有位于其上的用于将电路板定位在壳体上的电路板夹的壳体。 用于焊接或拆焊操作的热气体可以从上部气体管道和下部气体管道中的一个或另一个导向电路板上的部件，两者都是从鼓风机供给气体。 每个管道包括位于其中的单独的加热器，以便控制对通过管道的气体的热量输入。 上管道终止于包括附接到其上的喷嘴的排放头。 喷嘴包括适当的开口以便接收电路部件。 开口被裙子围绕，气体管道然后从裙部向外定位。 通过将组件定位在裙部内，组件与用于将组件的连接器焊接或拆焊的热气体隔离到适当的电路板。

公开(公告)号：US4568012A

公开(公告)日：1986-02-04

申请号：US452808

申请日：1982-12-23

Applicant: Fumio Kakuhata ,  Junzo Taguchi

Inventor： Fumio Kakuhata ,  Junzo Taguchi

IPC: B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: A soldering apparatus has a base, and a solder tank and a nozzle arranged in tandem with the base. A partition plate is arranged in the solder tank. The partition plate, a bottom plate disposed at the bottom of the solder tank, and a lower plate covering the bottom of the solder tank define a channel communicating with a portion of the solder tank remote form the nozzle and the interior of the nozzle. A moving magnetic field generating mechanism for exerting a force toward the nozzle to a solder in the channel is arranged in the base to extend along the channel under the partition wall. That portion of the solder tank at the side of the nozzle constitutes a wide portion of the same width as that of the nozzle while the remaining portion of the solder tank constitutes a narrow portion.

Abstract translation: 焊接装置具有底座和与基座并排配置的焊料槽和喷嘴。 在焊料槽中设置隔板。 分隔板，设置在焊料槽底部的底板和覆盖焊料槽底部的下板限定与远离喷嘴的喷嘴和喷嘴内部的焊料槽的一部分连通的通道。 用于向通道中的焊料施加力的移动磁场产生机构布置在基部中以沿着分隔壁下方的通道延伸。 在喷嘴一侧的焊料槽的该部分构成与喷嘴相同宽度的宽部分，而焊料槽的剩余部分构成窄部分。

公开(公告)号：US4530458A

公开(公告)日：1985-07-23

申请号：US561981

申请日：1983-12-16

Applicant: Kenshi Kondo

Inventor： Kenshi Kondo

IPC: B23K3/06 ,  B23K1/08

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: Printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path are soldered by contact with a progressive wave of a molten solder progressing in a direction transverse to the path of travel of the printed circuit board. A nozzle member provided with an array of molten solder overflowing ports arranged in a direction transverse to the travelling path is moveable in the same direction so as to form the progressive wave of molten solder.

Abstract translation: 在其下表面上承载芯片型电气部件并沿着预定路径行进的印刷电路板通过与横向于印刷电路板的行进路线的方向前进的熔融焊料的行进波接触来焊接。 设置有沿横向于行进路径的方向布置的熔融焊料溢流口的阵列的喷嘴构件可以沿相同的方向移动，以形成熔融焊料的行进波。

公开(公告)号：US4501770A

公开(公告)日：1985-02-26

申请号：US365642

申请日：1982-04-05

Applicant: Imre Bajka ,  Robert Furrer

Inventor： Imre Bajka ,  Robert Furrer

IPC: B23K1/018 ,  H05K3/00 ,  H05K3/34 ,  H05K13/00 ,  B05D3/12 ,  B05D1/18

CPC classification number: B23K1/018 ,  H05K13/0061 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/0271 ,  H05K2203/0292 ,  H05K2203/044 ,  H05K2203/0445 ,  H05K2203/045 ,  H05K2203/1509 ,  H05K2203/1518 ,  H05K3/0088

Abstract: During the pre-soldering of printed circuit boards, as a rule, also the drill holes or bores and, in particular, the through-metallized drill holes are filled in an undesirable manner with solder. This solder must be removed before mounting the electrical components or elements upon the printed circuit boards. A simple method is disclosed for this purpose, affording a faultless de-soldering of the drill holes, without deleteriously affecting the properties of the solder material. The printed circuit boards, in a condition where the solder applied during the pre-soldering operation is still molten, are accelerated at least once and thereafter suddenly brought to standstill in such a fashion that the excess solder is knocked or propelled out of the drill holes. The apparatus for accomplishing the method contemplates guiding the printed circuit board essentially horizontally in a frame and accelerating such printed circuit board in a guided vertical drop or fall in the direction of an impact location, so that upon concussion of the frame at the impact location the excess solder is downwardly knocked or propelled out.

Abstract translation: 在印刷电路板的预焊接期间，通常也可以用焊料将钻孔或孔，特别是贯穿金属化的钻孔以不期望的方式填充。 在将电气部件或元件安装在印刷电路板上之前，必须除去该焊料。 为此目的公开了一种简单的方法，提供钻孔的无故障的去焊接，而不会有害地影响焊料材料的性质。 在预焊接操作期间施加的焊料仍然熔化的情况下，印刷电路板至少加速一次，然后突然停止，使得多余的焊料从钻孔中被敲击或推出 。 用于完成该方法的装置考虑将印刷电路板基本上水平地引导到框架中并且在导向的垂直下降中加速这种印刷电路板，或者在冲击位置的方向上下降，使得当在冲击位置处的框架震荡时， 多余的焊料被向下敲击或推出。

公开(公告)号：US4410127A

公开(公告)日：1983-10-18

申请号：US236359

申请日：1981-02-20

Applicant: Manfred Bodewig

Inventor： Manfred Bodewig

IPC: B23K1/08 ,  B23K3/06 ,  H01L23/50 ,  H01R43/02 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K3/3405 ,  B23K3/0653 ,  B23K2201/42 ,  H01R43/02 ,  H05K2201/10386 ,  H05K2201/10924 ,  H05K3/0097 ,  H05K3/3468

Abstract: A method of soldering connection pins on carrier strips to printed circuit boards, notably to thick-film modules. Prior to soldering in a soldering bath, a printed circuit board is detachably connected to the connection pins. An endless carrier strip with the connection pins and printed circuit boards in the upright position is horizontally fed through liquid solder which flows off the components to be soldered at the surface. Solder which does not wet or connect the components flows away at the end of the predetermined soldering path, preferably in the transport direction of the parts, to a level below that of the carrier strip.

Abstract translation: 将载体条上的连接销焊接到印刷电路板，特别是厚膜模块的方法。 在焊接槽中焊接之前，印刷电路板可拆卸地连接到连接销。 具有直立位置的连接销和印刷电路板的环形载带被水平地馈送通过液体焊料，该液体焊料从表面上被焊接的部件流出。 未润湿或连接组件的焊料在预定焊接路径的端部优选在部件的输送方向上流动到低于载体条的水平。

公开(公告)号：US4373259A

公开(公告)日：1983-02-15

申请号：US100354

申请日：1979-12-05

Applicant: Hans Motsch

Inventor： Hans Motsch

IPC: B23K1/08 ,  B23K3/08 ,  H05K3/34

CPC classification number: B23K3/087 ,  B23K1/08 ,  H05K3/3442 ,  H05K3/3468 ,  B23K2201/28 ,  B23K2201/42 ,  H05K2201/09381 ,  H05K2201/09572 ,  H05K2201/10681 ,  H05K2201/10727 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A process for connecting flat, film-like components to a printed circuit board includes providing the printed circuit board with through-plated holes whose plating includes a fusible material and extends to contacts on the printed circuit board, positioning the flat, film-like components on the board so that the junctions of the components touch but do not extend into the holes and contacting the printed circuit board on the side opposite to the side with the components with liquid solder which rises in the holes, heats the plating and the junctions and bonds the components to the printed circuit board.

Abstract translation: 将扁平的薄膜状部件连接到印刷电路板的工艺包括为印刷电路板提供通孔，其电镀包括可熔材料并延伸到印刷电路板上的触点，将平坦的膜状部件 使得部件的接点接触但不延伸到孔中，并且使印刷电路板在与侧面相反的一侧与组件的接触，液体焊料在孔中升高，加热电镀和接合，并且 将组件粘合到印刷电路板上。

公开(公告)号：US4295596A

公开(公告)日：1981-10-20

申请号：US105463

申请日：1979-12-19

Applicant: Bradford O. Doten ,  John J. Svitak

Inventor： Bradford O. Doten ,  John J. Svitak

IPC: B23K1/012 ,  H01L21/60 ,  H05K13/04 ,  B23K1/12

CPC classification number: H01L24/81 ,  B23K1/012 ,  H01L24/75 ,  H05K13/0408 ,  H05K13/0465 ,  B23K2201/42 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/81801 ,  H01L2924/01082 ,  H01L2924/014

Abstract: A chip carrier (5) having a plurality of first ends (21--21) is aligned with and bonded to mating lands (34--34) on a PCB substrate (31) by positioning the carrier in a recess of a nozzle (66) on the tool and directing individual streams of hot gas horizontally onto the terminals and lands to cause previously deposited solder thereon to reflow to bond the articles together. Alternatively, articles bonded with reflowable material may be de-bonded in a like manner.

Abstract translation: 具有多个第一端（21-21）的芯片载体（5）通过将载体定位在喷嘴（66）的凹部中而与PCB基板（31）上的配合凸台（34-34）对准并与其接合， 在工具上并将热气体的各个水流水平地引导到端子和焊盘上，以使先前沉积的焊料在其上回流以将制品粘合在一起。 或者，与可回流材料结合的制品可以以类似的方式脱粘合。

公开(公告)号：US4208002A

公开(公告)日：1980-06-17

申请号：US934803

申请日：1978-08-18

Applicant: Matthias F. Comerford ,  Thomas N. Munroe ,  Harold T. O'Rourke

Inventor： Matthias F. Comerford ,  Thomas N. Munroe ,  Harold T. O'Rourke

IPC: B23K1/08 ,  B23K3/06

CPC classification number: B23K3/0653 ,  B23K1/08 ,  B23K2201/42

Abstract: A mass wave soldering apparatus is described. The apparatus comprises a sump having upwardly diagonally extending front and rear walls, and a pair of vertical end walls which cooperate to form an upwardly extending open ended nozzle chamber of increasing plan area. A Z-shaped baffle screen is positioned within the nozzle chamber and distributes the molten solder pumped upwardly in the sump as a wide, smooth substantially unidirectional solder wave ideally contoured for high-speed production soldering.

Abstract translation: 描述了质量波形焊接装置。 该装置包括具有向上倾斜延伸的前壁和后壁以及一对垂直端壁的贮槽，其协作以形成增加的平面面积的向上延伸的开口喷嘴室。 Z形挡板屏幕位于喷嘴室内，并将熔融焊料向上泵送到集水槽中，作为一种宽而平滑的基本上单向的焊料波浪，用于高速生产焊接。