-
公开(公告)号：WO1992003887A1
公开(公告)日：1992-03-05
申请号：PCT/AU1991000385
申请日：1991-08-23
Applicant: HILLS INDUSTRIES LIMITED , RAUBISZKO, Jan , RICHARDS, Robert, John , WEST, Donald
Inventor： HILLS INDUSTRIES LIMITED
IPC: H04N05/268
CPC classification number: H01P1/201 , H01P1/04 , H04N7/104 , H05K1/0237 , H05K1/14 , H05K7/1441 , H05K2201/10325
Abstract: A signal combining apparatus particularly useful in television signal distribution systems of modular design providing an extendable and convenient means for adding and replacing modules without the need to disconnect large amounts of critical length co-axial cables. The apparatus comprises first (35) and second (36) connection means located on opposite sides of a module (18) where the connection means are adapted to releasably connect to adjacent modules (12-17) as required wherein said signal transmission means (40) is located between said connectors and each module (12-18) has a signal processing means having an output signal and a signal combiner means (90) adapted to match said output signal to the transmission means (40) and combine with a transmission line signal. Microstrip is one example of a suitable transmission means.
Abstract translation: 一种在模块化设计的电视信号分配系统中特别有用的信号组合装置，其提供用于添加和替换模块的可扩展和便利的装置，而不需要断开大量的临界长度的同轴电缆。 该装置包括位于模块（18）的相对侧上的第一（35）和第二（36）连接装置，其中连接装置适于根据需要可释放地连接到相邻模块（12-17），其中所述信号传输装置 ）位于所述连接器之间，并且每个模块（12-18）具有具有输出信号的信号处理装置和适于将所述输出信号与传输装置（40）匹配并与传输线路组合的信号组合器装置（90） 信号。 微带线是合适的传输手段的一个例子。
-
公开(公告)号：US09968004B2
公开(公告)日：2018-05-08
申请号：US15271635
申请日：2016-09-21
Applicant: LAIRD TECHNOLOGIES, INC.
Inventor： Mohammadali Khorrami , Paul Francis Dixon
CPC classification number: H05K7/2039 , H01L23/34 , H01L23/3737 , H01P1/201 , H01P3/12 , H05K1/0203 , H05K1/0216 , H05K9/0032 , H05K9/0081 , H05K2201/10371
Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.
-
公开(公告)号：US09761921B2
公开(公告)日：2017-09-12
申请号：US14962855
申请日：2015-12-08
Applicant: HUAWEI TECHNOLOGIES CANADA CO., LTD.
Inventor： Raafat R. Mansour , Kevin Yang , Vahid Miraftab
Abstract: The tunable bandpass filter is used for filtering an electromagnetic signal, has a system passband between a first and a second tunable cutoff frequencies, and has a first subfilter and a second subfilter connected to one another in series between an input port and an output port and being complementary to one another in the tunable bandpass filter. At least one of the first subfilter and the second subfilter being connected to operate in reflection.
-
公开(公告)号：US09735456B2
公开(公告)日：2017-08-15
申请号：US14783617
申请日：2014-04-14
Inventor： Yasufumi Kawai , Shuichi Nagai , Daisuke Ueda
IPC: H01P5/02 , H01P1/201 , H01L23/66 , H01L25/065 , H01P7/10 , H01P1/203 , H01P7/00 , H02J17/00 , H01P5/18 , H01L23/498
CPC classification number: H01P1/201 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/66 , H01L25/0655 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/15311 , H01L2924/19107 , H01P1/20345 , H01P1/20381 , H01P5/187 , H01P7/10 , H02J17/00 , H02J50/12 , H02J50/70 , H01L2924/00014 , H01L2924/00
Abstract: A high-frequency transmission device includes first and second resonators as ring-shaped wires each having an opening part at a part thereof, first and second input/output terminals each electrically connected to both resonators, a first ground shield formed on a plane different from planes on which both resonators are arranged, a second ground shield formed on a plane different from the planes on which both resonators and the first ground shield are arranged, and first and second ground wires each formed to surround peripheries of both resonators. The ground shields and the ground wires are respectively connected to each other. A dielectric wire is present between both ground wires, and the ground wires are not electrically connected to each other.
-
公开(公告)号：US20170094831A1
公开(公告)日：2017-03-30
申请号：US15271635
申请日：2016-09-21
Applicant: LAIRD TECHNOLOGIES, INC.
Inventor： Mohammadali Khorrami , Paul Francis Dixon
CPC classification number: H05K7/2039 , H01L23/34 , H01L23/3737 , H01P1/201 , H01P3/12 , H05K1/0203 , H05K1/0216 , H05K9/0032 , H05K9/0081 , H05K2201/10371
Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.
-
Patent Agency Ranking
116.发明申请FLIP-CHIP EMPLOYING INTEGRATED CAVITY FILTER, AND RELATED COMPONENTS, SYSTEMS, AND METHODS 有权使用集成空气过滤器的片式芯片及相关组件，系统和方法公开(公告)号：US20170077574A1
公开(公告)日：2017-03-16
申请号：US15218626
申请日：2016-07-25
Applicant: QUALCOMM Incorporated
Inventor： John Jong-Hoon Lee , Young Kyu Song , Uei-Ming Jow , Sangjo Choi , Xiaonan Zhang
CPC classification number: H01P1/207 , H01L21/4853 , H01L23/5222 , H01L23/5227 , H01L23/552 , H01L23/60 , H01L23/66 , H01L24/16 , H01L28/10 , H01L28/40 , H01L2223/6627 , H01L2223/6666 , H01L2223/6672 , H01L2224/10 , H01L2224/16227 , H01P1/201 , H01P7/06 , H01P7/065 , H03B5/1817 , H05K1/0243
Abstract: A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive “fence” that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.
Abstract translation: 公开了一种采用集成腔滤波器的倒装芯片，其包括集成电路（IC）芯片，其包括半导体管芯和多个导电凸块。 多个导电凸块互连到半导体管芯的至少一个金属层，以提供限定用于在倒装芯片中提供集成腔滤波器的内部谐振腔的导电“栅栏”。 内部谐振腔被配置为通过设置在半导体管芯中的内层中的输入信号传输孔从输入传输线接收输入RF信号。 内部谐振器腔谐振输入RF信号以产生包括输入RF信号的滤波RF信号的输出RF信号，并且通过输出传输孔将输出RF信号耦合在倒装芯片中的输出信号传输线上 孔径层。
-
公开(公告)号：US20160359215A1
公开(公告)日：2016-12-08
申请号：US15168938
申请日：2016-05-31
Applicant: TOKO, INC.
Inventor： Yukikazu YATABE
CPC classification number: H01P1/2002 , H01P1/201 , H01P1/2088 , H01P1/213 , H01P7/10
Abstract: Dielectric waveguide comprising a plurality of resonator groups disposed on a substrate, wherein each of the resonator groups comprises one or more integrally-formed resonators, each obtained by coating a dielectric body with a conductor film, wherein each resonator group in at least a set of resonator groups of the plurality of resonator groups comprises waveguide-side slot exposing the dielectric body in a bottom surface thereof, wherein the substrate comprises a cavity surrounded by conductor patterns formed in the upper and lower surfaces, and by a via hole connecting the conductor patterns in the upper and lower surfaces, wherein the cavity comprises a set of substrate-side slots exposing the core material, the set of substrate-side slots being provided at a position to which waveguide-side slots of the set of resonator groups are opposed, and wherein resonator groups in the set of resonator groups are coupled together via the cavity.
Abstract translation: 介质波导，包括设置在基板上的多个谐振器组，其中每个谐振器组包括一个或多个整体形成的谐振器，每个共振器通过用导体膜涂覆电介质体而获得，其中每个谐振器组在至少一组 多个谐振器组的谐振器组包括在其底表面中暴露电介质体的波导侧槽，其中，所述衬底包括由形成在上表面和下表面中的导体图案包围的空腔，以及连接导体图案的通孔 在所述上表面和下表面中，所述空腔包括暴露所述芯材料的一组基板侧槽，所述一组基板侧槽设置在所述一组谐振器组的波导侧槽相对的位置处， 并且其中该组谐振器组中的谐振器组经由空腔耦合在一起。
-
公开(公告)号：US09515362B2
公开(公告)日：2016-12-06
申请号：US13774363
申请日：2013-02-22
Applicant: CommScope Italy S.r.l.
Inventor： Stefano Tamiazzo , Giuseppe Resnati
CPC classification number: H01P1/20309 , H01P1/201 , H01P1/205 , H01P1/2086 , H01P7/04 , H01P11/00 , H01P11/007 , H03H7/0123 , H03H7/12 , H03H7/1791 , H03H2250/00 , Y10T29/49826
Abstract: A bandpass filter has a combline structure having a plurality of cascaded nodes. A plurality of nodes in the filter are connected both to resonant elements (a.k.a. resonators) and non-resonant elements (including elements having inductances and/or capacitances that do not resonate in a predetermined frequency band of interest). The resonant frequencies of the resonant elements may be adjusted, in order to adjust the location of the center frequency and/or the width of the passband of the filter. The characteristics of the resonant and non-resonant elements are selected such that the poles of the filter, when plotted on the complex plane, move substantially along the imaginary axis when the resonant frequencies are adjusted, without substantial movement along the real axis. The resulting bandpass filter has substantially constant losses and substantially constant absolute selectivity over a relatively wide range of bandwidths.
Abstract translation: 带通滤波器具有具有多个级联节点的梳状结构。 滤波器中的多个节点既连接到谐振元件（例如谐振器）和非共振元件（包括在感兴趣的预定频带中不谐振的电感和/或电容的元件）。 可以调节谐振元件的谐振频率，以便调节滤波器的中心频率的位置和/或通带的宽度。 选择共振和非共振元件的特性，使得当绘制在复平面上时，滤波器的极点在谐振频率被调整时基本沿着虚轴移动，而不沿实际实质运动。 所得到的带通滤波器在相对宽的带宽范围内具有基本恒定的损耗和基本上恒定的绝对选择性。
-
119.发明授权Flip-chip employing integrated cavity filter, and related components, systems, and methods 有权使用集成腔体滤波器的倒装芯片，以及相关组件，系统和方法公开(公告)号：US09443810B1
公开(公告)日：2016-09-13
申请号：US14853802
申请日：2015-09-14
Applicant: QUALCOMM Incorporated
Inventor： John Jong-Hoon Lee , Young Kyu Song , Uei-Ming Jow , Sangjo Choi , Xiaonan Zhang
IPC: H01P1/20 , H01P7/06 , H01L21/00 , H01L27/15 , H01L23/66 , H01L49/02 , H01L23/552 , H03B5/18 , H01P1/201
CPC classification number: H01P1/207 , H01L21/4853 , H01L23/5222 , H01L23/5227 , H01L23/552 , H01L23/60 , H01L23/66 , H01L24/16 , H01L28/10 , H01L28/40 , H01L2223/6627 , H01L2223/6666 , H01L2223/6672 , H01L2224/10 , H01L2224/16227 , H01P1/201 , H01P7/06 , H01P7/065 , H03B5/1817 , H05K1/0243
Abstract: A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive “fence” that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.
Abstract translation: 公开了一种采用集成腔滤波器的倒装芯片，其包括集成电路（IC）芯片，其包括半导体管芯和多个导电凸块。 多个导电凸块互连到半导体管芯的至少一个金属层，以提供限定用于在倒装芯片中提供集成腔滤波器的内部谐振腔的导电“栅栏”。 内部谐振腔被配置为通过设置在半导体管芯中的内层中的输入信号传输孔从输入传输线接收输入RF信号。 内部谐振器腔谐振输入RF信号以产生包括输入RF信号的滤波RF信号的输出RF信号，并且通过输出传输孔将输出RF信号耦合在倒装芯片中的输出信号传输线上 孔径层。
-
公开(公告)号：US20160020499A1
公开(公告)日：2016-01-21
申请号：US14790086
申请日：2015-07-02
Applicant: ANRITSU CORPORATION
Inventor： Takashi Kawamura , Akihito Otani
IPC: H01P1/207
Abstract: In an end surface 32b of the second transmission line forming body 32 forming a second waveguide 30, the height of a central region 33 which includes an opening of the second transmission line 30b is a reference plane. A depressed portion 32e that is depressed to a depth greater than the length of a thread portion of a screw 205 from the reference plane is provided in a region outside the central region 33 and includes a screw hole forming position. A screw hole 32d for fixing an external circuit 200 to be connected is provided at the screw hole forming position in the depressed portion 32e. The height of a region, which is excluding the depressed portion 32e and is further away from the central region 33 than the screw hole forming position, is equal to the reference plane.
Abstract translation: 在形成第二波导30的第二传输线形成体32的端面32b中，包括第二传输线30b的开口的中心区域33的高度是参考平面。 在中心区域33的外侧的区域设有凹陷部，该凹部32e被压入深度大于螺丝205的螺纹部分的距离基准面的长度，并包括螺孔形成位置。 用于固定待连接的外部电路200的螺纹孔32d设置在凹部32e的螺纹孔形成位置。 除了凹部32e并且比螺纹孔形成位置更远离中心区域33的区域的高度等于参考平面。
-
-
-
-
-
-
-
-
-
Search Results
264
records
(took 0.029 seconds)
