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公开(公告)号：US10278314B2
公开(公告)日：2019-04-30
申请号：US15869961
申请日：2018-01-12
Applicant: Laird Technologies, Inc.
Inventor： John Song , Gerald R. English , Mohammadali Khorrami , Paul Francis Dixon
IPC: H05K9/00
Abstract: According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).
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公开(公告)号：US20180199429A1
公开(公告)日：2018-07-12
申请号：US15862334
申请日：2018-01-04
Applicant: Laird Technologies, Inc.
Inventor： Paul Francis Dixon , Mohammadali Khorrami
IPC: H05K1/02
CPC classification number: H05K1/0245 , H05K1/0216 , H05K1/0231 , H05K1/0233 , H05K1/024 , H05K1/0242 , H05K1/025 , H05K2201/086 , H05K2201/2036
Abstract: Exemplary embodiments are provided of absorber assemblies having dielectric spacers. In an exemplary embodiment, an absorber assembly includes a printed circuit board and a differential line disposed on the printed circuit board. The differential line includes a first trace and a second trace opposite the first trace. The assembly also includes a dielectric spacer coupled to the printed circuit board and covering at least a portion of the differential line, and an absorber coupled to the dielectric spacer to inhibit electromagnetic interference radiation from the differential line. Example methods of assembling an electromagnetic interference radiation absorber assembly for a differential line are also disclosed.
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公开(公告)号：US10477739B2
公开(公告)日：2019-11-12
申请号：US15936045
申请日：2018-03-26
Applicant: Laird Technologies, Inc.
Inventor： Paul Francis Dixon , Mohammadali Khorrami
Abstract: According to various aspects, exemplary embodiments are disclosed that include thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI absorber includes one or more portions disposed between a board level shield and a heat dissipation/removal structure. The thermally-conductive EMI absorber may be operable for attenuating EMI that propagates within the portions of the thermally-conductive EMI absorber between the board level shield and a heat dissipation/removal structure.
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公开(公告)号：US10455688B2
公开(公告)日：2019-10-22
申请号：US16003929
申请日：2018-06-08
Applicant: Laird Technologies, Inc.
Inventor： Mohammadali Khorrami , Paul Francis Dixon , George William Rhyne
Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.
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公开(公告)号：US10212806B2
公开(公告)日：2019-02-19
申请号：US15862334
申请日：2018-01-04
Applicant: Laird Technologies, Inc.
Inventor： Paul Francis Dixon , Mohammadali Khorrami
IPC: H05K1/02
Abstract: Exemplary embodiments are provided of absorber assemblies having dielectric spacers. In an exemplary embodiment, an absorber assembly includes a printed circuit board and a differential line disposed on the printed circuit board. The differential line includes a first trace and a second trace opposite the first trace. The assembly also includes a dielectric spacer coupled to the printed circuit board and covering at least a portion of the differential line, and an absorber coupled to the dielectric spacer to inhibit electromagnetic interference radiation from the differential line. Example methods of assembling an electromagnetic interference radiation absorber assembly for a differential line are also disclosed.
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Patent Agency Ranking
公开(公告)号：US20180168076A1
公开(公告)日：2018-06-14
申请号：US15859951
申请日：2018-01-02
Applicant: Laird Technologies, Inc.
Inventor： Kuo Chun Chao , Mohammadali Khorrami , Paul Francis Dixon
CPC classification number: H05K9/0022 , H05K1/0216 , H05K1/028 , H05K1/181 , H05K3/303 , H05K9/009 , H05K2201/10015 , H05K2201/1003 , H05K2201/10371 , H05K2203/1311
Abstract: According to various aspects, exemplary embodiments are disclosed of stretchable and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield generally includes a stretchable and/or flexible shielding layer including a first side and a second side. One or more adhesion and/or dielectric layers are along at least the first side and/or the second side of the stretchable and/or flexible shielding layer.
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公开(公告)号：US09968004B2
公开(公告)日：2018-05-08
申请号：US15271635
申请日：2016-09-21
Applicant: LAIRD TECHNOLOGIES, INC.
Inventor： Mohammadali Khorrami , Paul Francis Dixon
CPC classification number: H05K7/2039 , H01L23/34 , H01L23/3737 , H01P1/201 , H01P3/12 , H05K1/0203 , H05K1/0216 , H05K9/0032 , H05K9/0081 , H05K2201/10371
Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.
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公开(公告)号：US20170094831A1
公开(公告)日：2017-03-30
申请号：US15271635
申请日：2016-09-21
Applicant: LAIRD TECHNOLOGIES, INC.
Inventor： Mohammadali Khorrami , Paul Francis Dixon
CPC classification number: H05K7/2039 , H01L23/34 , H01L23/3737 , H01P1/201 , H01P3/12 , H05K1/0203 , H05K1/0216 , H05K9/0032 , H05K9/0081 , H05K2201/10371
Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.
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公开(公告)号：US20180228063A1
公开(公告)日：2018-08-09
申请号：US15936045
申请日：2018-03-26
Applicant: Laird Technologies, Inc.
Inventor： Paul Francis Dixon , Mohammadali Khorrami
CPC classification number: H05K9/0032 , H01L23/36 , H01L23/367 , H01L23/552 , H05K1/0203 , H05K1/181 , H05K7/20445 , H05K2201/10371
Abstract: According to various aspects, exemplary embodiments are disclosed that include thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI absorber includes one or more portions disposed between a board level shield and a heat dissipation/removal structure. The thermally-conductive EMI absorber may be operable for attenuating EMI that propagates within the portions of the thermally-conductive EMI absorber between the board level shield and a heat dissipation/removal structure.
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公开(公告)号：US09999121B2
公开(公告)日：2018-06-12
申请号：US15490012
申请日：2017-04-18
Applicant: Laird Technologies, Inc.
Inventor： Mohammadali Khorrami , Paul Francis Dixon , George William Rhyne
CPC classification number: H05K1/0216 , H01L23/3114 , H01L23/552 , H01L23/64 , H01L23/642 , H01L23/645 , H01L24/48 , H01L24/85 , H01L2924/141 , H01L2924/1615 , H01L2924/16251 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H05K1/0233 , H05K1/18 , H05K3/30 , H05K9/0003 , H05K9/0028 , H05K2201/0707 , H05K2201/10015 , H05K2201/1003 , H05K2201/10371 , H05K2201/2018
Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.
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