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    Printed wiring board and electronic equipment
    113.
    发明专利
    Printed wiring board and electronic equipment 有权
    印刷线路板和电子设备

    公开(公告)号：JP2010067776A

    公开(公告)日：2010-03-25

    申请号：JP2008232390

    申请日：2008-09-10

    Applicant: Toshiba Corp ,  株式会社東芝

    Inventor： HASEGAWA KENJI ,  KOZAI TAKESHI ,  KANO TERUSHIGE

    IPC: H05K1/11 ,  H05K1/02

    CPC classification number: H05K1/02 ,  H05K1/0215 ,  H05K1/116 ,  H05K3/325 ,  H05K5/0247 ,  H05K7/142 ,  H05K9/0064 ,  H05K2201/09463 ,  H05K2201/10409

    Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board having a land capable of obtaining a wide packaging area.
    SOLUTION: The printed wiring board includes: a substrate body 33, having a side 35 for prescribing one portion of the outer periphery and a fixing hole 36 through which a screw 26 is passed while the fixing hole 36 is provided at a position adjacent to the side 35; and a land 34 that is provided near the fixing hole 36, and is spread toward the periphery from the fixing hole 36 in a range between a direction D1 toward a center 45 of the substrate body 33 from the fixing hole 36 and a direction D2 along an extension direction of the side 35.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 解决的问题：提供一种能够获得宽的包装面积的印刷电路板。 解决方案：印刷电路板包括：具有用于规定外周的一部分的侧面35的基板主体33和螺钉26通过的固定孔36，同时固定孔36设置在位置 靠近侧面35; 以及设置在固定孔36附近并且从固定孔36朝向基板主体33的中心45的方向D1朝向中心45的范围内的固定孔36朝向周边扩散的平台34以及沿着固定孔36的方向D2 侧面的延伸方向35.版权所有（C）2010，JPO＆INPIT

    Printed wiring board and electronic equipment
    117.
    发明专利
    Printed wiring board and electronic equipment 有权
    印刷线路板和电子设备

    公开(公告)号：JP2010067777A

    公开(公告)日：2010-03-25

    申请号：JP2008232392

    申请日：2008-09-10

    Applicant: Toshiba Corp ,  株式会社東芝

    Inventor： HASEGAWA KENJI ,  KOZAI TAKESHI

    IPC: H05K1/02 ,  H05K3/34

    CPC classification number: H05K1/116 ,  H05K1/0215 ,  H05K3/325 ,  H05K3/3452 ,  H05K2201/09463 ,  H05K2201/09909 ,  H05K2201/10409 ,  H05K2201/2036

    Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board having a land capable of ensuring ground performance and obtaining a wide packaging area. SOLUTION: The printed wiring board 31 includes: a substrate body 33, having a pair of sides 35A, 35B for prescribing one portion of the outer periphery and a fixing hole 36 through which a screw 26 is passed while the fixing hole 36 is provided at a position adjacent to the pair of sides 35A, 35B; a land 34 that is provided near the fixing hole 36, and is spread toward the periphery from the fixing hole 36 in a range between a direction D1 toward a center 45 of the substrate body 33 from the fixing hole 36 and a direction D2 along an extension direction of the pair of sides 35; and an insulating height adjustment section 37 that is provided at a position between the fixing hole 36 and the pair of sides 35 and has height equal to that of the land 34. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种具有能够确保地面性能并获得宽的包装面积的地面的印刷线路板。 解决方案：印刷电路板31包括：基板主体33，其具有用于规定外周的一部分的一对侧面35A，35B以及螺钉26通过的固定孔36，同时固定孔36 设置在与所述一对侧面35A，35B相邻的位置; 在固定孔36附近设置有从固定孔36向基板本体33的方向D1朝向中心45的方向从固定孔36向周边扩散的平台34， 一对侧的延伸方向35; 以及设置在固定孔36和一对侧面35之间的高度等于平台34的高度的绝缘高度调节部分37.权利要求：（C）2010，JPO＆INPIT

    Printed circuit board, electronic apparatus
    118.
    发明专利
    Printed circuit board, electronic apparatus 有权

    公开(公告)号：JP4421663B1

    公开(公告)日：2010-02-24

    申请号：JP2008232392

    申请日：2008-09-10

    Applicant: 株式会社東芝

    Inventor： 剛 小材 ,  健治 長谷川

    IPC: H05K1/02

    CPC classification number: H05K1/116 ,  H05K1/0215 ,  H05K3/325 ,  H05K3/3452 ,  H05K2201/09463 ,  H05K2201/09909 ,  H05K2201/10409 ,  H05K2201/2036

    Abstract: 【課題】アースの性能を確保しつつ、広い実装面積を得ることができるランドを有するプリント配線板を提供する。
    【解決手段】プリント配線板３１は、外周の一部を規定する一対の辺部３５Ａ、３５Ｂと、一対の辺部３５Ａ、３５Ｂに隣接する位置に設けられるとともにねじ２６が通される固定孔部３６と、を有した基板本体３３と、固定孔部３６の近傍に設けられるとともに、固定孔部３６から基板本体３３の中央部４５に向かう方向Ｄ１と、一対の辺部３５の延びる方向に沿った方向Ｄ２との間の範囲内で、固定孔部３６から周囲に向けて広がったランド３４と、固定孔部３６と一対の辺部３５との間の位置に設けられるとともに、ランド３４の高さと同等の高さを有した絶縁性の高さ調整部３７と、を具備する。
    【選択図】図３

    Packaging substrate having two-stage structure, and crystal oscillator using the same
    119.
    发明专利
    Packaging substrate having two-stage structure, and crystal oscillator using the same 有权
    具有两级结构的包装衬底和使用其的晶体振荡器

    公开(公告)号：JP2008117804A

    公开(公告)日：2008-05-22

    申请号：JP2006296914

    申请日：2006-10-31

    Applicant: Nippon Dempa Kogyo Co Ltd ,  日本電波工業株式会社

    Inventor： UCHIDA TAKASHI ,  ITO MANABU ,  KURODA TOMOTAKA

    IPC: H05K3/34 ,  H03B5/32 ,  H05K1/02 ,  H05K1/18

    CPC classification number: H01R43/0256 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/09463 ,  H05K2201/10303 ,  H05K2201/1084 ,  H05K2201/10871 ,  H05K2203/1178 ,  Y10T428/24612

    Abstract: PROBLEM TO BE SOLVED: To provide a packaging substrate having a two-stage structure, where a metal pin is reliably joined to a first substrate, and to provide a crystal oscillator using the packaging substrate. SOLUTION: In the packaging substrate having a two-stage structure, a second substrate 1b is supported onto the first substrate 1a having a mounted electrode on an external bottom surface by the metal pin 4, and the tip of the metal pin 4 is inserted into a hole 5 provided on the surface of the first substrate 1a for fixing to an annular electrode land 6 provided on the surface of the first substrate 1a becoming the periphery of the hole 5 by solder 7. In the annular electrode land 6, a partial annular portion is opened. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供具有两级结构的包装基板，其中金属销可靠地接合到第一基板，并提供使用该封装基板的晶体振荡器。 解决方案：在具有两级结构的封装衬底中，通过金属销4将第二衬底1b支撑在具有安装电极的第一衬底1a上，外部底表面上的金属销4的尖端 插入到设置在第一基板1a的表面上的孔5中，用于通过焊料7固定到设置在第一基板1a的表面上的环形电极焊盘6上。在环形电极焊盘6中， 打开部分环形部分。 版权所有（C）2008，JPO＆INPIT

    FIXING STRUCTURE OF CIRCUIT BOARD AND DISPLAY MODULE COMPRISING THE SAME
    120.
    发明授权
    FIXING STRUCTURE OF CIRCUIT BOARD AND DISPLAY MODULE COMPRISING THE SAME 无效
    电路板的固定结构和包含该电路板的显示模块

    公开(公告)号：KR100708749B1

    公开(公告)日：2007-04-11

    申请号：KR20060035747

    申请日：2006-04-20

    Applicant: SAMSUNG SDI CO LTD

    Inventor： BANG WON KYU ,  KIM MYOUNG KON

    IPC: H01J17/16 ,  H01J17/49

    CPC classification number: H05K1/116 ,  H05K1/0213 ,  H05K1/0215 ,  H05K1/119 ,  H05K7/142 ,  H05K2201/09463 ,  H05K2201/09854 ,  H05K2201/10863 ,  Y10S439/947

    Abstract: 본 발명은: 섀시 베이스와; 상기 섀시 베이스에 상측으로 돌출되도록 장착된 본체부와, 상기 본체부에 연장 형성된 것으로 상기 본체부보다 작은 단면적을 가지는 끼움부와, 상기 끼움부에 연장 현성된 것으로 상기 끼움부보다 큰 단면적을 가지는 덮개부를 구비하는 적어도 하나의 기판 장착부재와; 상기 기판 장착부재의 덮개부보다 큰 단면적을 가지고 있어서 상기 덮개부가 삽입될 수 있는 가이드 홀부와, 상기 기판 장착부재의 끼움부가 끼워지는 끼움 홀부를 구비하는 적어도 하나의 기판 장착 홀;을 구비한 회로 기판을 구비하는 회로 기판 고정 구조를 제공한다.

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