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    Electronic control apparatus
    111.
    发明授权
    Electronic control apparatus 有权
    电子控制装置

    公开(公告)号：US07751193B2

    公开(公告)日：2010-07-06

    申请号：US11764331

    申请日：2007-06-18

    Applicant: Tsutomu Tominaga ,  Masahiro Kimata ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Tadayuki Fujimoto

    Inventor： Tsutomu Tominaga ,  Masahiro Kimata ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Tadayuki Fujimoto

    IPC: H05K7/20 ,  F28F7/00 ,  H01L23/34 ,  H01B9/06

    CPC classification number: H05K7/20509 ,  H01L2924/0002 ,  H05K3/308 ,  H05K3/32 ,  H05K3/328 ,  H05K7/20854 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2201/10962 ,  H01L2924/00

    Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.

    Abstract translation: 电子控制装置的尺寸和成本可以通过消除诸如电源板等的某些部件而减小。该装置包括壳体，散热器，具有端子并安装在散热器上的半导体开关元件，布置在电路板上的电路板 与散热器相对，连接在电路板和半导体开关元件之间的导电板，以及与散热器协作接收半导体开关元件和电路板的盖。 导电板的压配端子部分压配合到电路板的通孔中，并且各个导电板沿着半导体开关元件的各个端子引出的引出方向排列，并且是 绑定到各个终端。

    STUD, CIRCUIT BOARD DEVICE USING THE STUD, AND METHOD OF MOUNTING THE CIRCUIT BOARD DEVICE
    112.
    发明申请
    STUD, CIRCUIT BOARD DEVICE USING THE STUD, AND METHOD OF MOUNTING THE CIRCUIT BOARD DEVICE 审中-公开
    STUD，使用STUD的电路板装置以及安装电路板装置的方法

    公开(公告)号：US20100128452A1

    公开(公告)日：2010-05-27

    申请号：US12624563

    申请日：2009-11-24

    Applicant: KAZUHITO YOKOUCHI

    Inventor： KAZUHITO YOKOUCHI

    IPC: H05K1/14 ,  H05K1/00 ,  H05K3/00

    CPC classification number: H05K1/18 ,  H05K1/181 ,  H05K3/308 ,  H05K3/341 ,  H05K2201/10318 ,  H05K2201/10409 ,  H05K2201/105 ,  Y02P70/611 ,  Y10T29/49124

    Abstract: A stud is a structure for supporting, on a printed circuit board, a mounting component such as another printed circuit board or a device. This structure is surface-mounted on the printed circuit board by soldering or press-fitting. The structure is a constituted by a columnar-shaped structure and the like. One end of the columnar-shaped structure is surface-mounted on the printed circuit board, and the other end thereof is fixed to the mounting component.

    Abstract translation: 螺柱是用于在印刷电路板上支撑诸如另一印刷电路板或装置的安装部件的结构。 该结构通过焊接或压配合表面安装在印刷电路板上。 该结构由柱状结构等构成。 柱状结构的一端表面安装在印刷电路板上，另一端固定在安装部件上。

    ENGINE STARTER SWITCH DEVICE
    113.
    发明申请
    ENGINE STARTER SWITCH DEVICE 有权
    发动机起动开关装置

    公开(公告)号：US20100051425A1

    公开(公告)日：2010-03-04

    申请号：US12550824

    申请日：2009-08-31

    Applicant: Toshiaki Imai ,  Koji Suzuki

    Inventor： Toshiaki Imai ,  Koji Suzuki

    IPC: H01H9/28

    CPC classification number: H05K3/306 ,  F02N11/0803 ,  H05K3/3447 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/105

    Abstract: A coil bobbin to which an immobilizer coil is mounted, coil connecting terminals to which ends of the coil are connected, a fixed contact, a terminal for the fixed contact and connector terminals are integrally formed by resin molding into a coil bobbin integrated type insulator. Then, the coil connecting terminals, the terminal for the fixed contact, and the connector terminals are respectively soldered to a wiring board. All of them are incorporated in a body. In this manner, stress exerted on the soldered areas between the coil connecting terminals and the wiring board can be moderated to the substantially same extent as stress exerted on the soldered areas between the terminal for the fixed contact and the connector terminals, and the wiring board.

    Abstract translation: 安装有防盗线圈的线圈架，连接有线圈的线圈连接端子，固定触点，固定触点用端子和连接器端子通过树脂模制一体地形成为线圈架一体型绝缘体。 然后，将线圈连接端子，固定接点端子和连接器端子分别焊接到布线板。 所有这些都被并入身体。 以这种方式，施加在线圈连接端子和布线板之间的焊接区域上的应力可以被调节到与施加在用于固定触头的端子与连接器端子之间的焊接区域上的应力大致相同的程度，并且布线板 。

    Combination of a Main Carrier and a Printed Circuit Board with Components
    114.
    发明申请
    Combination of a Main Carrier and a Printed Circuit Board with Components 失效
    主载波和印刷电路板与组件的组合

    公开(公告)号：US20090284936A1

    公开(公告)日：2009-11-19

    申请号：US12466976

    申请日：2009-05-15

    Applicant: Klaus BACKHAUS

    Inventor： Klaus BACKHAUS

    IPC: H05K1/00

    CPC classification number: H05K5/006 ,  H05K1/0271 ,  H05K1/18 ,  H05K1/189 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/105

    Abstract: A combination of a main carrier and a printed circuit board. Light and heavy electrical and/or electronic components are fixed on the printed circuit board, wherein at least one heavy component is mechanically fixedly connected to the main carrier and electrically conductively connected to conductor tracks of a first section of the printed circuit board. The first section of the printed circuit board is electrically conductively connected to a second section of the printed circuit board and decoupled from the second section of the printed circuit board with regard to mechanical vibrations by means of a decoupling device. The decoupling device may be, for example, a flexible section or a recess formed in said printed circuit board.

    Abstract translation: 主载体和印刷电路板的组合。 轻和重的电气和/或电子部件被固定在印刷电路板上，其中至少一个重的部件机械地固定地连接到主载体上并与导电连接到印刷电路板的第一部分的导体轨道。 印刷电路板的第一部分导电地连接到印刷电路板的第二部分，并且借助于去耦装置与印刷电路板的第二部分相关的机械振动解耦。 去耦装置可以是例如在所述印刷电路板中形成的柔性部分或凹部。

    PROTECTIVE STRUCTURE FOR A CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
    115.
    发明申请
    PROTECTIVE STRUCTURE FOR A CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME 失效
    电路板的保护结构及其制造方法

    公开(公告)号：US20090277682A1

    公开(公告)日：2009-11-12

    申请号：US12406710

    申请日：2009-03-18

    Applicant: Keiichiro BUNGO

    Inventor： Keiichiro BUNGO

    IPC: H05K5/00 ,  B23P11/00

    CPC classification number: H05K3/284 ,  H05K5/064 ,  H05K2201/105 ,  H05K2203/1316 ,  Y10T29/49826

    Abstract: In a protective structure for a circuit board (1) that includes a casing (3) for receiving the circuit board, the casing is provided with a recess (11) for receiving a large component part protruding from the circuit board therein, and potting material (6) is filled in a space defined between the large component part and a surrounding wall of the recess. Typically, the potting material is filled in a gap between the large component part and the surrounding wall of the recess without substantially extending out of the recess. Because the large component part is not only supported by the circuit board but also by the casing via the cured potting material, the stress acting on a connection part that connects the large component part to the circuit board is minimized, and this enhances the mechanical integrity of the circuit board assembly. Because the use of the potting material is limited to the recess, the required amount of the potting material can be minimized, and this means a lower material cost and a reduced weight. Reducing the amount of the potting material means a shorter period of time required for curing it, and this improves the production efficiency of the circuit board assembly. If the protection of the component parts from intrusion of moisture is desired, protective coating may be additionally applied to the circuit board.

    Abstract translation: 在包括用于接收电路板的壳体（3）的电路板（1）的保护结构中，壳体设置有用于容纳从其中的电路板突出的大部件的凹部（11），以及灌封材料 （6）填充在大部件与凹部的周围壁之间的空间中。 通常，灌封材料填充在大部件和凹部的周围壁之间的间隙中，而基本上不延伸出凹部。 由于大部件不仅由电路板支撑，而且通过固化灌封材料由壳体支撑，所以作用在连接大部件与电路板的连接部分上的应力最小化，从而提高了机械完整性 的电路板组件。 因为灌封材料的使用被限制在凹槽中，所以灌封材料的所需量可以最小化，这意味着较低的材料成本和减轻的重量。 减少灌封材料的量意味着固化所需的较短时间，这提高了电路板组件的生产效率。 如果需要保护组件免受潮湿侵入，则可以向电路板额外施加保护涂层。

    Device including a conductor truck foil
    116.
    发明授权
    Device including a conductor truck foil 失效
    装置包括导向卡车箔

    公开(公告)号：US5345040A

    公开(公告)日：1994-09-06

    申请号：US967498

    申请日：1992-10-28

    Applicant: Horst Stade ,  Helmut Deringer

    Inventor： Horst Stade ,  Helmut Deringer

    IPC: H01R12/04 ,  B60T8/36 ,  H05K1/00 ,  H05K1/11 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K13/04

    CPC classification number: B60T8/3675 ,  H05K13/0482 ,  H05K3/326 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/1003 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2203/0165 ,  H05K2203/1189 ,  H05K3/281 ,  H05K3/306 ,  H05K3/3447 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T83/748

    Abstract: A device including a conductor track foil with contact pins of an electrical component. The conductor track foil includes two insulating layers with an intervening conducting layer with lands in the upper layer for soldering the conductive layer to the contact pins of the electrical component. The conductor track foil is lowered, positionally correctly, onto the electrical component by use of a mounting device. The bottom insulating layer and the conducting layer of the soldering lands, which are free of an insulating layer on the top, are pierced by the contact pins extending at right angles to the conductor track foil. The conductor track foil is released by the mounting apparatus. A soldered connection is made between the lands and the contact pins. As a result, a device including an electrically reliably gap free conducting connection is attained even if the contact pins are eccentrically associated with the soldering lands.

    Abstract translation: 一种包括具有电气部件的接触销的导体轨道箔的装置。 导体轨道箔包括两个绝缘层，其中间导电层具有上层中的焊盘，用于将导电层焊接到电气部件的接触引脚上。 通过使用安装装置将导体轨迹箔位置正确地下降到电气部件上。 在顶部没有绝缘层的焊盘的底部绝缘层和导电层被与导体轨道箔成直角延伸的接触销刺穿。 导线轨道箔由安装装置释放。 在焊盘和接触针之间形成焊接连接​​。 结果，即使接触针偏心地与焊接区相关联，也可以获得包括电气可靠的无间隙导电连接的装置。

    Apparatus for joining a conductor track foil to an electrical component
    117.
    发明授权
    Apparatus for joining a conductor track foil to an electrical component 失效
    用于将导体轨道箔连接到电气部件的装置

    公开(公告)号：US5289629A

    公开(公告)日：1994-03-01

    申请号：US68070

    申请日：1992-10-28

    Applicant: Horst Stade ,  Helmut Deringer

    Inventor： Horst Stade ,  Helmut Deringer

    IPC: H01R12/04 ,  B60T8/36 ,  H05K1/00 ,  H05K1/11 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K13/04 ,  B23P19/04 ,  B26D7/02

    CPC classification number: B60T8/3675 ,  H05K13/0482 ,  H05K3/326 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/1003 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2203/0165 ,  H05K2203/1189 ,  H05K3/281 ,  H05K3/306 ,  H05K3/3447 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T83/748

    Abstract: A mounting apparatus for attaining a tolerance-insensitive connection of a conductor track foil with contact pins of an electrical component. The conductor track foil includes two insulating layers with an intervening conducting layer with lands in the upper layer for soldering the conductive layer to the contact pins of the electrical component. The conductor track foil is lowered, positionally correctly, onto the electrical component by use of a mounting device. The bottom insulating layer and the conducting layer of the soldering lands, which are free of an insulating layer on the top, are pierced by the contact pins extending at right angles to the conductor track foil. The conductor track foil is released by the mounting apparatus. A soldered connection is made between the lands and the contact pins. As a result, an electrically reliably gap free conducting connection is attainable even if the contact pins are eccentrically associated with the soldering lands.

    Abstract translation: 一种用于实现导体轨迹箔与电气部件的接触销的公差不敏感连接的安装装置。 导体轨道箔包括两个绝缘层，其中间导电层具有上层中的焊盘，用于将导电层焊接到电气部件的接触引脚上。 通过使用安装装置将导体轨迹箔位置正确地下降到电气部件上。 在顶部没有绝缘层的焊盘的底部绝缘层和导电层被与导体轨道箔成直角延伸的接触销刺穿。 导线轨道箔由安装装置释放。 在焊盘和接触针之间形成焊接连接​​。 结果，即使接触针偏心地与焊接区相关联，也可以实现电气可靠的无间隙的导电连接。

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