公开(公告)号：KR1020090021976A

公开(公告)日：2009-03-04

申请号：KR1020070086924

申请日：2007-08-29

Applicant: 성균관대학교산학협력단

Inventor： 이호영 ,  서수정 ,  염광섭 ,  박인수 ,  이용호

IPC: H05K3/06

CPC classification number: H05K3/184 ,  H05K1/118 ,  H05K3/0079 ,  H05K3/188

Abstract: A manufacturing method of flexible printed circuit board is provided to prevent generation of harmful residual product due to etching of a metal film by selectively forming the metal film on a base substrate through a removal of a mask film. A mask film(12) is formed on a base substrate, and is a photosensitive film. A part of the base substrate is exposed. A seed metal film(16) is formed on an exposed base substrate and the mask film by a metal deposition method, and is a composite metal film or an alloy film. A metal film(18) is formed on the seed metal film by a copper electroplating or a copper electroless plating. The mask film is removed. The seed metal film and the metal film of the mask film are removed. A conductive pattern is formed on the base substrate, and is made of the seed metal film and the metal film.

Abstract translation: 提供柔性印刷电路板的制造方法，以通过去除掩模膜在基底基板上选择性地形成金属膜来防止由于金属膜的蚀刻而产生的有害残留物。 掩模膜（12）形成在基底基板上，并且是感光膜。 露出基底衬底的一部分。 通过金属沉积法在暴露的基底基板和掩模膜上形成种子金属膜（16），并且是复合金属膜或合金膜。 通过铜电镀或铜化学镀在种子金属膜上形成金属膜（18）。 去除掩模膜。 除去种子金属膜和掩模膜的金属膜。 在基底基板上形成导电图案，由种子金属膜和金属膜构成。

公开(公告)号：KR100878947B1

公开(公告)日：2009-01-19

申请号：KR1020070078745

申请日：2007-08-06

Applicant: 삼성전기주식회사 ,  성균관대학교산학협력단

Inventor： 김호진 ,  서수정 ,  김장현 ,  박인수 ,  이용호 ,  나성훈 ,  백용호 ,  최영식

IPC: H01L21/60 ,  H01L23/48

CPC classification number: H01L2224/11 ,  H01L2924/00012

Abstract: A solder bump and manufacturing method thereof are provided to draw crack propagation route by shear stress by expanding contact dimension of copper post and solder. A solder bump includes a metal post(2) of clobber shape having rounding shape formed on a metal layer(6) of electronic component. A solder ball(4) of ball shape totally surrounding the metal post is formed on the metal post. The metal post is formed on the metal layer of the electronic component through an electro-plating process. The metal layer is a circuit pattern formed in a wafer level package or printed circuit board. A gold plating layer(12) is formed on the metal layer to protect the metal layer.

Abstract translation: 提供了一种焊料凸块及其制造方法，通过扩大铜柱和焊料的接触尺寸，通过剪切应力拉伸裂纹扩展路径。 焊料凸块包括形成在电子部件的金属层（6）上的具有圆形形状的金属柱（2）。 在金属柱上形成完全围绕金属柱的球形的焊球（4）。 金属柱通过电镀工艺形成在电子部件的金属层上。 金属层是形成在晶片级封装或印刷电路板中的电路图案。 在金属层上形成镀金层（12）以保护金属层。