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    METHOD AND STRUCTURE OF THREE DIMENSIONAL CMOS TRANSISTORS WITH HYBRID CRYSTAL ORIENTATIONS
    124.
    发明申请
    METHOD AND STRUCTURE OF THREE DIMENSIONAL CMOS TRANSISTORS WITH HYBRID CRYSTAL ORIENTATIONS 有权
    具有混合晶体取向的三维CMOS晶体管的方法与结构

    公开(公告)号：US20150270180A1

    公开(公告)日：2015-09-24

    申请号：US14218633

    申请日：2014-03-18

    Applicant: XIAO (CHARLES) YANG

    Inventor： XIAO (CHARLES) YANG

    IPC: H01L21/8238 ,  H01L29/04

    CPC classification number: H01L21/823878 ,  A61B5/14514 ,  B81B2201/025 ,  B81B2201/055 ,  B81C1/00246 ,  G01L9/0042 ,  G01L9/0054 ,  G01P15/0802 ,  G01P15/125 ,  H01L21/76254 ,  H01L21/8221 ,  H01L25/0657 ,  H01L27/0688 ,  H01L29/045 ,  H01L2924/0002 ,  H03H3/0073 ,  H01L2924/00

    Abstract: A method for fabricating a three-dimensional integrated circuit device includes providing a first substrate having a first crystal orientation, forming at least one or more PMOS devices overlying the first substrate, and forming a first dielectric layer overlying the one or more PMOS devices. The method also includes providing a second substrate having a second crystal orientation, forming at least one or more NMOS devices overlying the second substrate, and forming a second dielectric layer overlying the one or more NMOS devices. The method further includes coupling the first dielectric layer to the second dielectric layer to form a hybrid structure including the first substrate overlying the second substrate.

    Abstract translation: 一种制造三维集成电路器件的方法包括提供具有第一晶体取向的第一衬底，形成覆盖在第一衬底上的至少一个或多个PMOS器件，以及形成覆盖该一个或多个PMOS器件的第一介电层。 该方法还包括提供具有第二晶体取向的第二衬底，形成覆盖第二衬底的至少一个或多个NMOS器件，以及形成覆盖该一个或多个NMOS器件的第二电介质层。 该方法还包括将第一电介质层耦合到第二电介质层以形成包括覆盖在第二衬底上的第一衬底的混合结构。

    Out-of plane microneedle manufacturing process
    125.
    发明授权
    Out-of plane microneedle manufacturing process 有权
    平面微针制造工艺

    公开(公告)号：US08999177B2

    公开(公告)日：2015-04-07

    申请号：US12808334

    申请日：2008-10-17

    Applicant: Astrid Cachemaille ,  Francois Cannehan

    Inventor： Astrid Cachemaille ,  Francois Cannehan

    IPC: C25F3/00 ,  B44C1/22 ,  C03C15/00 ,  B81C1/00 ,  A61M37/00

    CPC classification number: A61M37/0015 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C1/00111 ,  Y10T29/49826 ,  Y10T428/24479

    Abstract: Out-of-plane microneedle manufacturing process comprising the simultaneous creation of a network of microneedles and the creation of a polygonal shaped hat (2) above each microneedle (1) under formation, said process comprising the following steps: providing bridges (3) between the hats (3), maintaining the bridges (3) during the remaining microneedle manufacturing steps, removing the bridges (3), together with the hats (2), when the microneedles (1) are formed.

    Abstract translation: 面外微型制造工艺包括同时创建微针网络并在形成每个微针（1）上方形成多边形帽（2），所述方法包括以下步骤：提供桥 （3），在剩余的微针制造步骤期间保持桥（3），当形成微针（1）时，与帽子（2）一起移除桥（3）。

    Method of coating microneedle
    128.
    发明授权
    Method of coating microneedle 有权
    涂抹微针的方法

    公开(公告)号：US08771781B2

    公开(公告)日：2014-07-08

    申请号：US12599394

    申请日：2007-10-18

    Applicant: Seiji Tokumoto ,  Toshiyuki Matsudo ,  Tetsuji Kuwahara

    Inventor： Seiji Tokumoto ,  Toshiyuki Matsudo ,  Tetsuji Kuwahara

    IPC: A61M3/00 ,  B05D1/18

    CPC classification number: A61M37/0015 ,  A61K9/0021 ,  A61M2037/0053 ,  B81B2201/055 ,  B81B2203/0361 ,  B81C1/00206

    Abstract: The present invention provides a method of coating microneedles by which the microneedles mounted on a microneedle device are coated accurately and easily in a mass-producible manner. In this method, a microneedle device (22) with a plurality of microneedles (21) is mounted on a table (23), while a mask plate (25) with a plurality of apertures (24) is fixed to a frame member (26), and a coating solution (27) is drawn in the direction of arrow A on the mask plate (25) using a spatula (28) to fill the apertures (24) with the coating solution. The microneedles (21) are inserted in the apertures (24) before or after the filling of the apertures (24) with the coating solution (27) to coat the microneedles (21).

    Abstract translation: 本发明提供了一种涂布微针的方法，通过该方法，安装在微针装置上的微针以可批量生产的方式精确且容易地被涂布。 在该方法中，将具有多个微针（21）的微针装置（22）安装在工作台（23）上，同时具有多个孔（24）的掩模板（25）固定到框架构件（26） ），并且使用刮刀（28）在掩模板（25）上沿箭头A的方向将涂布溶液（27）用涂布溶液填充孔（24）。 在用涂布溶液（27）填充孔（24）之前或之后，将微针（21）插入孔（24）中以涂覆微针（21）。

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