公开(公告)号：US07174632B2

公开(公告)日：2007-02-13

申请号：US10754416

申请日：2004-01-09

Applicant: Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

Inventor： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

IPC: H01K3/10

CPC classification number: H05K3/4626 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

Abstract: A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle. Thereby, it is possible to make the insulating layer of the circuit board securing the interlayer electrically connection by an inner via hole including a conductive paste to be homogenized and ultra-thin and improve the reliability of the connection of the inner via hole.

Abstract translation: 包括所需数量的电绝缘层和交替层叠的布线层的电路板，以及用于通过压缩和硬化包括导电颗粒和树脂的导电膏来固定布线层之间的电连接的内通孔。 在电绝缘层中，多孔片材至少在一个表面上设置有树脂片，多孔片材至少在中心部分不浸渍树脂。 在电绝缘层的厚度方向贯通电绝缘层的贯通孔填充有包含导电性粒子和树脂的导电性糊剂，并且在多孔质片材内存在的孔填充有层叠树脂。 多孔片内的孔的平均孔径可以小于导电性粒子的平均粒径。 由此，可以使电路基板的绝缘层通过包括导电浆料的内部通孔来确保层间电连接，从而均匀化并且超薄，并提高内部通孔连接的可靠性。

公开(公告)号：US20040142161A1

公开(公告)日：2004-07-22

申请号：US10754416

申请日：2004-01-09

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

IPC: H05K001/11 ,  B32B003/26

CPC classification number: H05K3/4626 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

Abstract: A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle. Thereby, it is possible to make the insulating layer of the circuit board securing the interlayer electrically connection by an inner via hole including a conductive paste to be homogenized and ultra-thin and improve the reliability of the connection of the inner via hole.

Abstract translation: 包括所需数量的电绝缘层和交替层叠的布线层的电路板，以及用于通过压缩和硬化包括导电颗粒和树脂的导电膏来固定布线层之间的电连接的内通孔。 在电绝缘层中，多孔片材至少在一个表面上设置有树脂片，多孔片材至少在中心部分不浸渍树脂。 在电绝缘层的厚度方向贯通电绝缘层的贯通孔填充有包含导电性粒子和树脂的导电性糊剂，并且在多孔质片材内存在的孔填充有层叠树脂。 多孔片内的孔的平均孔径可以小于导电性粒子的平均粒径。 由此，可以使电路基板的绝缘层通过包含导电性糊剂的内部通路孔进行层间电连接，使其均匀化，超薄化，提高内部通孔连接的可靠性。

公开(公告)号：US06673190B2

公开(公告)日：2004-01-06

申请号：US09826718

申请日：2001-04-04

Applicant: David Haas ,  Chengzeng Xu ,  Mavyn McAuliffe ,  Scott Zimmerman ,  Laura Miller ,  Meifang Qin ,  Baopei Xu ,  Richard Pommer

Inventor： David Haas ,  Chengzeng Xu ,  Mavyn McAuliffe ,  Scott Zimmerman ,  Laura Miller ,  Meifang Qin ,  Baopei Xu ,  Richard Pommer

IPC: B32B3100

CPC classification number: H05K3/4626 ,  B29C70/885 ,  B32B7/06 ,  B32B15/08 ,  B32B17/04 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/10378 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T428/1476 ,  Y10T428/24917 ,  Y10T428/2839 ,  Y10T442/2861 ,  Y10T442/2992 ,  Y10T442/60 ,  Y10T442/615 ,  Y10T442/616 ,  Y10T442/623 ,  Y10T442/674 ,  Y10T442/697

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

Abstract translation: 本发明涉及包括非织造增强材料和至少一种树脂材料的可激光粘合层材料。 本发明还包括使用本发明的粘合层来制造高密度多层印刷线路板的方法。

公开(公告)号：US06558512B2

公开(公告)日：2003-05-06

申请号：US09441135

申请日：1999-11-17

Applicant: Hiroyoshi Ueno ,  Yoshihisa Kato ,  Isao Ichioka ,  Takekazu Adachi ,  Mamoru Murata ,  Hirokazu Hiraoka ,  Manabu Ochida ,  Masayuki Noda

Inventor： Hiroyoshi Ueno ,  Yoshihisa Kato ,  Isao Ichioka ,  Takekazu Adachi ,  Mamoru Murata ,  Hirokazu Hiraoka ,  Manabu Ochida ,  Masayuki Noda

IPC: B32B3120

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B15/14 ,  B32B15/20 ,  B32B37/00 ,  B32B37/10 ,  B32B38/0036 ,  B32B38/16 ,  B32B38/164 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2305/28 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  D21H13/26 ,  D21H17/52 ,  D21H21/18 ,  D21H25/06 ,  D21H27/30 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/249925 ,  Y10T428/249998 ,  Y10T428/31725 ,  Y10T428/31728 ,  Y10T442/20 ,  Y10T442/2951 ,  Y10T442/60 ,  Y10T442/696 ,  Y10T442/697 ,  Y10T442/699

Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.

公开(公告)号：US06543258B1

公开(公告)日：2003-04-08

申请号：US09555401

申请日：2000-05-30

Applicant: Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

Inventor： Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

IPC: C03B37083

CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

Abstract: A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.

公开(公告)号：US20030045164A1

公开(公告)日：2003-03-06

申请号：US09506318

申请日：2000-02-17

Inventor： Fumio Echigo ,  Yoshihiro Kawakita

IPC: B32B005/16 ,  B32B027/02

CPC classification number: D21H13/20 ,  B29C70/12 ,  D04H1/587 ,  D04H1/60 ,  D04H1/64 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/015 ,  H05K2201/0175 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/27 ,  Y10T442/2861 ,  Y10T442/2902

Abstract: The present invention provides a nonwoven fabric material prepared from short fibers including thermal-resistant synthetic fibers bound with an inorganic binder, a prepreg and a circuit board using the same. The circuit board has an excellent dimensional stability even at a high temperature, and the circuit board is prevented from warping or being damaged by moisture absorption or the like. The inorganic binder is a residue formed from a low melting point glass solution or a water-dispersible colloidal solution including at least either fibers or particles of low melting point glass dispersed therein. When the binder is used, a chemical covalent bonding by a siloxane bonding is formed.

Abstract translation: 本发明提供一种由短纤维制成的无纺布材料，包括与无机粘合剂结合的耐热合成纤维，预浸料和使用其的电路板。 电路板即使在高温下也具有优异的尺寸稳定性，并且防止电路板翘曲或被吸湿等损坏。 无机粘合剂是由低熔点玻璃溶液或至少包含分散在其中的至少一种纤维或低熔点玻璃颗粒的水分散性胶体溶液形成的残留物。 当使用粘合剂时，形成通过硅氧烷键合的化学共价键合。

公开(公告)号：US20030000081A1

公开(公告)日：2003-01-02

申请号：US10107112

申请日：2002-03-26

Applicant: International Business Machines Corporation

Inventor： Lawrence Robert Blumberg ,  Robert Maynard Japp ,  William John Rudik ,  John Frank Surowka

IPC: B32B005/02 ,  B32B027/04 ,  B32B027/12 ,  B32B017/02 ,  B32B017/04 ,  B32B005/26 ,  H05K003/30

CPC classification number: B32B5/26 ,  B32B5/02 ,  B32B5/28 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/20 ,  B32B2553/00 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10T29/4913 ,  Y10T442/2361 ,  Y10T442/2992 ,  Y10T442/3537 ,  Y10T442/3569 ,  Y10T442/3577 ,  Y10T442/3585 ,  Y10T442/3602 ,  Y10T442/3659

Abstract: A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. One embodiment of the reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0.05% to 0.3%, preferably from about 0.08% to 0.10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The method for making reduced CTE laminate and laminate structures comprises the following steps: providing non-woven quartz mat; providing a prepreg, preferably B-stage cured to not more than about 40%, preferably not more than 30% of full cure; sandwiching the non-woven quartz mat between two layers of prepreg, and reflowing the resin of the prepreg into the quartz mat.

Abstract translation: 提供了一种简单，便宜，可钻，减少的CTE层压板和包括减小的CTE层压板的电路结构。 还原的CTE层压体的一个实施方案包括：约40％至75％，优选约55％至65％的树脂; 约0.05％至0.3％，优选约0.08％至0.10％的固化剂; 约25％至60％，优选约30％至40％的织布; 约1％至15％，优选约5％至10％体积的无纺石英垫。 制造减薄的CTE层压板和层压结构的方法包括以下步骤：提供无纺石英垫; 提供预浸料，优选B阶固化至不超过完全固化的约40％，优选不超过30％; 将无纺石英垫夹在两层预浸料之间，并将预浸料坯的树脂回流到石英垫中。

公开(公告)号：US06426310B1

公开(公告)日：2002-07-30

申请号：US09405037

申请日：1999-09-24

Applicant: Shigeru Kurumatani ,  Hirokazu Hiraoka ,  Masayuki Noda ,  Tomoyuki Terao ,  Setsuo Toyoshima ,  Yoshihisa Kato ,  Hiroyoshi Ueno

Inventor： Shigeru Kurumatani ,  Hirokazu Hiraoka ,  Masayuki Noda ,  Tomoyuki Terao ,  Setsuo Toyoshima ,  Yoshihisa Kato ,  Hiroyoshi Ueno

IPC: D04H140

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2457/08 ,  C08J5/04 ,  D21H13/26 ,  D21H17/52 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T442/2475 ,  Y10T442/60 ,  Y10T442/692 ,  Y10T442/696 ,  Y10T442/697 ,  H01L2924/00

Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.

Abstract translation: 一种无纺布，其包含通过粘合剂彼此粘合的对位芳族聚酰胺纤维剁的主要组分，对位芳族聚酰胺纤维剁具有（a）聚对亚苯基-3,4'-二苯基醚 - 对苯二甲酰胺 纤维和（b）聚对苯二甲酰对苯二胺纤维，其重量比（a）/（b）= 10/90〜90/10，优选（a）/（b）= 30/70〜 70/30。

公开(公告)号：US06168855A

公开(公告)日：2001-01-02

申请号：US09418443

申请日：1999-10-15

Applicant: Yachin Cohen ,  Dmitry Rein ,  Lev Vaykhansky

Inventor： Yachin Cohen ,  Dmitry Rein ,  Lev Vaykhansky

IPC: B32B300

CPC classification number: B32B27/02 ,  B32B7/12 ,  B32B2323/043 ,  B32B2323/046 ,  B32B2457/08 ,  C08J5/04 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24628 ,  Y10T428/24917 ,  Y10T428/249941 ,  Y10T428/249942 ,  Y10T428/2938 ,  Y10T428/31649 ,  Y10T428/31681

Abstract: A polyolefin composite for a printed circuit board or antenna base material, a base material including the composite and electronic modules including the base material. The base material includes at least one dielectric layer including a polyolefin composite and at least one electroconductive layer including an electroconductive material, the dielectric and electroconductive layers being intimately bonded to one another.

Abstract translation: 用于印刷电路板或天线基材的聚烯烃复合材料，包括复合材料的基材和包括基材的电子模块。 所述基材包括至少一个包括聚烯烃复合材料的介电层和至少一个包含导电材料的导电层，所述电介质层和导电层彼此紧密结合。

公开(公告)号：US6045897A

公开(公告)日：2000-04-04

申请号：US178852

申请日：1998-10-26

Applicant: Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

Inventor： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

IPC: B32B15/14 ,  C08J5/04 ,  C09D5/25 ,  D04H1/00 ,  D04H1/42 ,  D04H1/58 ,  D21H13/26 ,  D21H17/52 ,  H05K1/02 ,  H05K1/03 ,  D21H13/02

CPC classification number: H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

Abstract: A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan .delta.) peak value at 30-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

Abstract translation: 一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基板的预浸料坯和印刷线路板。