公开(公告)号：US08897032B2

公开(公告)日：2014-11-25

申请号：US13114875

申请日：2011-05-24

Applicant: Abraham Hartenstein

Inventor： Abraham Hartenstein

IPC: H05K7/14 ,  H01R12/73 ,  H05K3/36 ,  H01R13/02 ,  H05K1/11

CPC classification number: H01Q9/045 ,  H01R12/737 ,  H01R13/02 ,  H05K1/117 ,  H05K1/14 ,  H05K3/366 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/10098 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49018 ,  Y10T29/49126

Abstract: A method and system for connecting a vertical printed circuit board with a horizontal printed circuit board where a contact device is biased in a first position when not contacting a vertical printed circuit board and is biased in a second position when the vertical printed circuit is coupled to the horizontal printed circuit board.

Abstract translation: 一种用于将垂直印刷电路板与水平印刷电路板连接的方法和系统，其中当垂直印刷电路连接到垂直印刷电路时，接触装置在不接触垂直印刷电路板时被偏置在第一位置并被偏置在第二位置 水平印刷电路板。

公开(公告)号：US08810457B2

公开(公告)日：2014-08-19

申请号：US13489568

申请日：2012-06-06

Applicant: Javier Ruben Flores-Cuadras ,  Jose Eleazar Zuniga-Juarez

Inventor： Javier Ruben Flores-Cuadras ,  Jose Eleazar Zuniga-Juarez

IPC: H01Q1/38

CPC classification number: H01Q9/42 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q9/0421 ,  H05K1/117 ,  H05K1/14 ,  H05K1/165 ,  H05K2201/09172

Abstract: Described herein are antenna designs and configurations that provide flexible solutions for creating compact antennas with multiple-band capabilities. For example, a hybrid PIFA-monopole antenna configuration and design is described. As another example, non-planar (e.g., orthogonal) and composite radiating structures incorporating various radiating element and ground plane configurations are described. Connective structures are also described for providing physical rigidity and ground plane connectivity to composite radiation elements. In embodiments described herein of composite radiating structures, multiple antennas may be included through passive radiating elements potentially combined with active circuitry. Composite radiating structures with multiple antennas may be used in multiple-in and multiple-out (MIMO) antenna applications. For example, multiple different antennas within the composite radiating structures may be created using radiating elements on one or more of the vertical and/or horizontal portions of the composite radiating structure.

Abstract translation: 这里描述的是提供用于创建具有多频带能力的紧凑天线的灵活解决方案的天线设计和配置。 例如，描述了混合PIFA单极天线配置和设计。 作为另一示例，描述了包括各种辐射元件和接地平面配置的非平面（例如，正交）和复合辐射结构。 还描述了连接结构，用于提供与复合辐射元件的物理刚性和接地平面连接。 在这里描述的复合辐射结构的实施例中，可以通过潜在地与有源电路组合的无源辐射元件来包括多个天线。 具有多个天线的复合辐射结构可用于多输入多输出（MIMO）天线应用。 例如，可以使用复合辐射结构的一个或多个垂直和/或水平部分上的辐射元件来创建复合辐射结构内的多个不同的天线。

公开(公告)号：US08674489B2

公开(公告)日：2014-03-18

申请号：US12912203

申请日：2010-10-26

Applicant: Sebastien Bolis ,  Fabrice Jacquet ,  Damien Saint-Patrice

Inventor： Sebastien Bolis ,  Fabrice Jacquet ,  Damien Saint-Patrice

IPC: H01L23/02

CPC classification number: B81B7/0006 ,  B81B2203/0353 ,  B81B2207/012 ,  B81B2207/07 ,  H01L23/481 ,  H01L23/5389 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/183 ,  H05K3/403 ,  H05K3/4697 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09645 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An interconnect device is disclosed including a support in which at least one hole is formed, the hole having walls forming a closed contour and being formed by a cavity and one or several slots communicating with the cavity. The slots extend in a direction making a non-zero angle with the main plane of the support. Several conducting elements are positioned on at least one wall of the hole and pass through the hole. The conducting elements are each intended to connect conducting areas to each other that are situated on either side of the support. At least one of the slots separates two of the conducting elements from each other.

Abstract translation: 公开了一种互连装置，其包括其中形成有至少一个孔的支撑件，所述孔具有形成封闭轮廓的壁，并且由空腔和与腔体连通的一个或多个槽形成。 狭槽在与支撑件的主平面成非零角度的方向上延伸。 几个导电元件位于孔的至少一个壁上并穿过该孔。 导电元件各自旨在将位于支撑体两侧的导电区域彼此连接。 至少一个槽将两个导电元件彼此分开。

公开(公告)号：US20130301207A1

公开(公告)日：2013-11-14

申请号：US13466682

申请日：2012-05-08

Applicant: Sungjun Chun ,  Brian J. Connolly

Inventor： Sungjun Chun ,  Brian J. Connolly

IPC: G06F1/16 ,  H05K1/11

CPC classification number: H05K1/117 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/09172 ,  H05K2201/10159

Abstract: An embodiment is a memory card including a rectangular printed circuit card having a first side and a second side, a first length of between 151.35 and 161.5 millimeters, and first and second ends having a second length smaller than the first length. The memory card also includes a first plurality of pins on the first side extending along a first edge of the rectangular printed circuit card that extends along a length of the rectangular printed circuit card, a second plurality of pins on the second side extending on the first edge of the rectangular printed circuit card, and a positioning key having its center positioned on the first edge of the rectangular printed circuit card and located between 94.0 and 95.5 millimeters from the first end of the rectangular printed circuit card.

Abstract translation: 一个实施例是一种存储卡，其包括具有第一侧和第二侧的矩形印刷电路卡，第一长度在151.35和161.5毫米之间，第一和第二端的第二长度小于第一长度。 存储卡还包​​括沿着矩形印刷电路卡的沿着矩形印刷电路卡的长度延伸的第一边沿第一侧延伸的第一多个销，第二侧上延伸的第二多个销在第一侧上延伸 矩形印刷电路卡的边缘，以及定位键，其中心位于矩形印刷电路卡的第一边缘上，并且距离矩形印刷电路卡的第一端位于94.0和95.5毫米之间。

公开(公告)号：US20130264103A1

公开(公告)日：2013-10-10

申请号：US13858955

申请日：2013-04-09

Applicant: TPK TOUCH SOLUTIONS (XIAMEN) INC.

Inventor： Huilin Ye ,  Jing Yu ,  Hua Luo ,  Zongke Chiu ,  Yau-Chen Jiang ,  Jianbin Yan ,  Defa Wu

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K1/0213 ,  H05K1/0277 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K3/38 ,  H05K2201/09172 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/099

Abstract: The present disclosure discloses a bonding structure, wherein a plurality of first bonding pads is located on a first substrate. A second substrate is disposed to partially face first substrate. A plurality of second bonding pads is located on second substrate with one side, and partially overlapped with the first bonding pads with the other side to form a bonding region and a peripheral region located in the periphery of the bonding region. An anisotropic conductive film is disposed between first bonding pads and second bonding pads. The anisotropic conductive film includes a plurality of conductive particles. At least one move structure is disposed in the periphery region. When the conductive particles of the anisotropic conductive film are moving during the bonding process, the groove structure can accommodate the conductive particles moved hereto. Accordingly, short circuit caused by accumulation of the conductive particles in the bonding process can be avoided.

Abstract translation: 本公开公开了一种接合结构，其中多个第一接合焊盘位于第一基板上。 第二基板设置成部分地面对第一基板。 多个第二接合焊盘位于具有一侧的第二基板上，并且与第一接合焊盘与另一侧部分地重叠以形成接合区域和位于接合区域周边的周边区域。 各向异性导电膜设置在第一接合焊盘和第二接合焊盘之间。 各向异性导电膜包括多个导电颗粒。 至少一个移动结构设置在周边区域中。 当各向异性导电膜的导电颗粒在接合过程中移动时，沟槽结构可以容纳移动到其上的导电颗粒。 因此，可以避免在接合过程中由导电性粒子的积聚引起的短路。

公开(公告)号：US20130186678A1

公开(公告)日：2013-07-25

申请号：US13578965

申请日：2011-01-06

Applicant: Eiji Koike ,  Yukihiro Sumida ,  Toshiteru Nakawaki

Inventor： Eiji Koike ,  Yukihiro Sumida ,  Toshiteru Nakawaki

IPC: H05K1/14 ,  H05K3/00

CPC classification number: H05K1/144 ,  G02F1/13452 ,  G02F2001/133612 ,  H05K1/11 ,  H05K1/118 ,  H05K3/00 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09063 ,  H05K2201/09172 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49126

Abstract: Provided is a highly accurately alignable substrate set, the cost of which is kept low. In the substrate set, a light source FPC substrate (11) has a notch (16), and an anode pad (13) and a cathode pad (14) that are disposed so as to sandwich the notch (16) therebetween, and a panel FPC substrate (21) has a plus terminal (23) and a minus terminal (24) that are disposed so as to be in contact with the anode pad (13) and the cathode pad (14), and an opening (26) that is sandwiched between the plus terminal (23) and the minus terminal (24).

Abstract translation: 提供了一种高精度对准的基板组，其成本保持较低。 在基板组中，光源FPC基板（11）具有凹口（16）和布置成夹在其间的凹口（16）的阳极垫（13）和阴极垫（14），并且 面板FPC基板（21）具有设置成与阳极焊盘（13）和阴极焊盘（14）接触的正端子（23）和负端子（24），以及开口（26） 夹在正极端子（23）和负极端子（24）之间。

公开(公告)号：US20110121849A1

公开(公告)日：2011-05-26

申请号：US12948713

申请日：2010-11-17

Applicant: Leonard A. ROLAND ,  Kathleen F. ULLOM ,  Ira G. POLLOCK ,  James E. SPINAR

Inventor： Leonard A. ROLAND ,  Kathleen F. ULLOM ,  Ira G. POLLOCK ,  James E. SPINAR

IPC: G01R1/067 ,  H01R43/16

CPC classification number: H05K3/403 ,  G01R1/06772 ,  G01R1/06788 ,  G01R3/00 ,  H05K1/092 ,  H05K1/167 ,  H05K3/245 ,  H05K2201/0367 ,  H05K2201/09172 ,  H05K2203/1476 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49204

Abstract: The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Abstract translation: 具有印刷尖端的探针由具有连接到其端部边缘的多个探针尖端的基底组成，多个测试路径，每个连接到探针尖端中的一个并且沿着基底延伸，并且至少一个测试路径包括 与测试路径的探针尖端相邻的电气部件。 电气部件可以是电阻器。 探针尖端的宽度可以等于衬底的厚度。 探针尖端可以由多个探针尖端层组成。 本发明还包括一种探测通过目标板上的目标传输线传输的信号的方法。 本公开还包括制造所要求保护的发明的方法。

公开(公告)号：US20110014818A1

公开(公告)日：2011-01-20

申请号：US12935241

申请日：2009-04-29

Applicant: Michael Albert Carter ,  Scott David Lee

Inventor： Michael Albert Carter ,  Scott David Lee

IPC: H05K1/02 ,  H01R24/00

CPC classification number: H05K1/0228 ,  H01R9/03 ,  H01R12/721 ,  H01R13/6461 ,  H01R13/6474 ,  H01R13/6658 ,  H05K1/0239 ,  H05K1/165 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09236 ,  H05K2201/10189 ,  Y10S439/941

Abstract: The invention relates to a circuit board (100) for an electrical connector (400), comprising a plurality of pairs of first contacts (110) disposed at a first end (112) of the circuit board (100) and a plurality of pairs of second contacts (120) disposed at a second end (122), wherein each first contact (110) is connected to a second contact (120) by way of first conductors (115.1-115.8), wherein the first conductors (115.1-115.8) are disposed at least on a first side (104) of the circuit board (110), wherein second conductors (125.2, 125.4, 125.6, 125.8; 135.1, 135.3, 135.5, 135.7) are disposed on a further side (106) of the circuit board (100) and connected to a first contact (110) or a second contact (120), wherein a second conductor (135.1, 135.3, 135.5, 135.7) is associated with a first contact (110.1, 110.3, 110.5, 110.7) of each pair of first contacts (110), wherein the adjacent second conductors (135.1, 135.3, 135.5, 135.7) of the first contacts (110) comprise segments at least partially parallel to each other, and said second conductors are associated with a second contact (120.2, 120.4, 120.6, 120.8) of each pair of second contacts (120), wherein the adjacent second conductors (125.2, 125.4, 125.6, 125.8) of the second contacts comprise segments at least partially parallel to each other, wherein the first contacts (110.1, 110.3, 110.5, 110.7) connected to the second conductors (135.1, 135.3, 135.5, 135.7) are not connected to the second contacts (120.2, 120.4, 120.6, 120.8), which are connected to the second conductors (125.2., 125.4, 125.6, 125.8), wherein the second conductors (135.1, 135.3, 135.5, 135.7) form first coupling regions at the first contacts (110) and the second conductors (125.2, 125.4, 125.6, 125.8) form second coupling regions at the second contacts (120), and to an electrical connector.

公开(公告)号：US20100243308A1

公开(公告)日：2010-09-30

申请号：US12411847

申请日：2009-03-26

Applicant: DONG YOU KIM ,  Yong Tae Kyeon ,  Ja Yong Ku

Inventor： DONG YOU KIM ,  Yong Tae Kyeon ,  Ja Yong Ku

IPC: H05K1/11 ,  H05K1/00

CPC classification number: H05K1/117 ,  H05K1/0298 ,  H05K3/403 ,  H05K2201/09172 ,  H05K2201/0919

Abstract: The present invention relates to a semiconductor memory module and an electronic component socket for coupling with the same. A printed circuit board of the semiconductor memory module includes three signal pad arrays longitudinally formed in a row on one sides of a first surface, a second surface and a third surface thereof. Each signal pad array includes a plurality of signal pads. An electronic component socket for coupling with the printed circuit board includes thee pin arrays. Thus, an increased number of the signal pads can be provided while retaining the size of the memory module and the electronic component socket.

Abstract translation: 本发明涉及半导体存储器模块和与其耦合的电子元件插座。 半导体存储器模块的印刷电路板包括在第一表面，第二表面和第三表面的一侧纵向形成为一排的三个信号垫阵列。 每个信号焊盘阵列包括多个信号焊盘。 用于与印刷电路板耦合的电子元件插座包括引脚阵列。 因此，可以在保持存储器模块和电子部件插座的尺寸的同时提供增加数量的信号焊盘。

公开(公告)号：US20090151156A1

公开(公告)日：2009-06-18

申请号：US11954419

申请日：2007-12-12

Applicant: Xiao YAN ,  Thomas J. BERGHERR

Inventor： Xiao YAN ,  Thomas J. BERGHERR

IPC: H05K3/00

CPC classification number: H05K3/366 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/10446 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A method of manufacturing a circuit board assembly for a controller. The method includes providing first and second printed circuit boards wherein the first printed circuit board has a plurality of copper pads containing slots therein that correspond to a plurality of power tabs in the second printed circuit board. The power tabs are then slid into the slots and the tabs are flooded with copper. At this time the power tabs are soldered within the slots to provide an electrical connection between the first and second printed circuit boards that allows for the transfer of current between the boards of more than three amps.

Abstract translation: 一种制造用于控制器的电路板组件的方法。 该方法包括提供第一印刷电路板和第二印刷电路板，其中第一印刷电路板具有多个包含槽的铜焊盘，其对应于第二印刷电路板中的多个电源接头。 电源接头然后滑入插槽中，并且接头被铜淹没。 此时，电源接头焊接在插槽内，以在第一和第二印刷电路板之间提供电连接，允许电路板之间的电流传输超过3安培。