公开(公告)号：US20080142238A1

公开(公告)日：2008-06-19

申请号：US11612576

申请日：2006-12-19

Applicant: Diane C. Rawlings

Inventor： Diane C. Rawlings

IPC: H02G13/00 ,  H05K1/00 ,  H05K1/16 ,  H05K3/36

CPC classification number: H02G13/00 ,  B64D45/02 ,  H02G13/80 ,  H05K1/0265 ,  H05K1/0393 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09363 ,  Y10T29/49126

Abstract: An appliqué for forming a surface coating to a substrate is disclosed. The appliqué contains a sectioned metal foil that provides a large area electrical circuit for connecting electrical devices. The appliqué may provide additional functions including lightning strike protection. The substrate may be an aircraft surface.

Abstract translation: 公开了一种用于将表面涂层形成基底的贴布。 贴布包含一个分段金属箔，其提供用于连接电气设备的大面积电路。 贴布可以提供额外的功能，包括防雷。 基板可以是飞行器表面。

公开(公告)号：US20070177380A1

公开(公告)日：2007-08-02

申请号：US11669622

申请日：2007-01-31

Applicant: John C. Schultz ,  Andrew J. Ouderkirk ,  Joel S. Peiffer ,  Nelson B. O'Bryan ,  John A. Wheatley ,  Cameron T. Murray

Inventor： John C. Schultz ,  Andrew J. Ouderkirk ,  Joel S. Peiffer ,  Nelson B. O'Bryan ,  John A. Wheatley ,  Cameron T. Murray

IPC: F21V21/00

CPC classification number: H05K1/189 ,  F21K9/00 ,  G02F1/133603 ,  G02F2001/133628 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09363 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.

Abstract translation: 照明组件包括柔性衬底，其包括由电绝缘层分隔开的第一和第二导电箔。 绝缘层包括装载有增强绝缘层导热性的颗粒的聚合物材料。 多个LED管芯设置在第一导电箔上。

公开(公告)号：US20070175655A1

公开(公告)日：2007-08-02

申请号：US11344507

申请日：2006-01-31

Applicant: Jason Swanson ,  Bryan McCoy ,  Arthur Dewyer

Inventor： Jason Swanson ,  Bryan McCoy ,  Arthur Dewyer

IPC: H05K1/00

CPC classification number: H05K1/0206 ,  H05K1/0209 ,  H05K1/0298 ,  H05K2201/09363 ,  H05K2201/09781

Abstract: A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat conductive layers are comprised of thermally conductive material configured as planar sheets, each of these heat conductive layers being coupled to at least one wire to sink heat therefrom, such as via a wire of an input cable and/or output cable. Advantageously, a more compact power converter is realized having improved power output while operating within safety guidelines.

Abstract translation: 一种功率转换器，包括具有多个导热层的印刷电路板（PCB），所述导热层被配置为吸收由所述功率转换器电子器件产生的热量。 这些导热层中的每一个由配置为平面片的导热材料构成，这些导热层中的每一个都耦合到至少一根导线，从而通过输入电缆和/或输出电缆的导线吸收热量。 有利地，在安全准则下操作时，实现了具有改进的功率输出的更紧凑的功率转换器。

公开(公告)号：US06858352B1

公开(公告)日：2005-02-22

申请号：US10019686

申请日：2000-05-07

Applicant: Cyril William Band

Inventor： Cyril William Band

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  G03F9/00 ,  H01B13/00

CPC classification number: H05K3/06 ,  H05K3/0002 ,  H05K3/064 ,  H05K2201/09363 ,  H05K2203/056

Abstract: A mask for producing a printed circuit board is defined in which the conductor elements of the printed circuit pattern are delineated by a constant width etch band (20). This means that all conductors (3a, 3b, 9) are separated from neighboring areas of conductive material (22) by the same distance. Thus etch rates across the printed circuit pattern do not vary according to the separation of the conductors (3a, 3b, 9).

Abstract translation: 定义了用于制造印刷电路板的掩模，其中印刷电路图案的导体元件由恒定宽度的蚀刻带（20）描绘。 这意味着所有导体（3a，3b，9）与导电材料（22）的相邻区域分开相同的距离。 因此，印刷电路图案上的蚀刻速率根据导体（3a，3b，9）的分离而不变化。

公开(公告)号：US4943346A

公开(公告)日：1990-07-24

申请号：US401834

申请日：1989-09-01

Applicant: Antoon Mattelin

Inventor： Antoon Mattelin

IPC: C23F1/00 ,  C23F1/02 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/07

CPC classification number: H05K3/07 ,  C23F1/02 ,  H05K3/061 ,  H05K3/062 ,  B29L2031/3493 ,  H05K2201/0305 ,  H05K2201/09118 ,  H05K2201/09363 ,  H05K2203/0361 ,  H05K2203/072 ,  H05K2203/135 ,  H05K2203/1476 ,  H05K3/0032 ,  H05K3/027 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing printed circuit boards has a double etch process to form interconnection wiring. A metal layer is formed on the substrate. An etch resist layer is applied to the metal layer. The layer is selectively removed to allow for selective etching of the metal layer. A second etch resist layer is applied to the metal layer not previously etched. The side walls of the metal layer are also protected by the resist. The second etch resist layer is then selectively removed to allow for a second etching of the metal layer. After the second etching, the interconnection wiring remains in the desired pattern. The second etch resist layer, which may be tin, can be left on the wiring to improve component soldering.

Abstract translation: 制造印刷电路板的方法具有双重蚀刻工艺以形成互连布线。 在基板上形成金属层。 将抗蚀剂层施加到金属层。 选择性地去除该层以允许金属层的选择性蚀刻。 将第二蚀刻抗蚀剂层施加到未被蚀刻的金属层上。 金属层的侧壁也被抗蚀剂保护。 然后选择性地去除第二蚀刻抗蚀剂层以允许金属层的第二蚀刻。 在第二蚀刻之后，互连布线保持在所需的图案中。 可以将第二蚀刻抗蚀剂层（其可以是锡）留在布线上以改进元件焊接。

公开(公告)号：US4445979A

公开(公告)日：1984-05-01

申请号：US520477

申请日：1983-08-04

Applicant: Joseph P. Lutfy ,  Thaddeus J. Grabowski ,  Robert G. Arnold

Inventor： Joseph P. Lutfy ,  Thaddeus J. Grabowski ,  Robert G. Arnold

IPC: C25D5/02 ,  C25D5/56 ,  H05K3/02 ,  H05K3/10 ,  H05K3/24

CPC classification number: H05K3/108 ,  C25D5/02 ,  C25D5/56 ,  H05K3/241 ,  H05K2201/09363 ,  H05K3/027

Abstract: A process for providing a dielectric substrate with a composite surface comprising a metal plated portion side-by-side an unplated portion. The process includes: depositing a metallic film over the surface of the substrate; removing a narrow band of the film to electrically isolate one portion of the film from another; immersing the substrate in an electroplating bath capable of dissolving the film; cathodizing one of the film portions in the bath to electroplate that portion while the other portion dissolves therein to expose the underlying substrate. The thusly exposed substrate may subsequently be painted.

Abstract translation: 一种用于提供具有复合表面的电介质基底的方法，所述复合表面包括金属电镀部分并排的未镀覆部分。 该方法包括：在衬底的表面上沉积金属膜; 去除薄膜的窄带以使膜的一部分与另一部分电隔离; 将基板浸入能够溶解膜的电镀浴中; 阴极化浴中的一个膜部分以电镀该部分，而另一部分溶解在其中以暴露下面的基底。 随后可以涂上如此曝光的基底。

公开(公告)号：US3531579A

公开(公告)日：1970-09-29

申请号：US3531579D

申请日：1968-10-31

Applicant: ASTRO DYNAMICS INC

Inventor： KATZ LEONHARD

IPC: H05K1/02 ,  H05K7/20 ,  H05K3/02

CPC classification number: H05K1/0209 ,  H05K2201/09363 ,  H05K2201/09781

公开(公告)号：NO961506A

公开(公告)日：1997-10-17

申请号：NO961506

申请日：1996-04-16

Applicant: ELEKTROKONTAKT AS

Inventor： HUSE PER ,  LUNDEGAARD TORE

IPC: H01R13/66 ,  H01R25/00 ,  H05K1/02

CPC classification number: H05K1/0265 ,  H01R13/6658 ,  H01R25/00 ,  H05K2201/09363

公开(公告)号：US10076800B2

公开(公告)日：2018-09-18

申请号：US14954243

申请日：2015-11-30

Applicant: Cree Fayetteville, Inc.

Inventor： Jennifer Stabach ,  Brice McPherson ,  Chad B. O'Neal

IPC: B23K31/02 ,  B23K1/20 ,  B23K1/00 ,  B23K26/362 ,  H01L23/13 ,  H05K3/02 ,  H05K1/02 ,  H05K3/24 ,  H05K3/34

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K26/361 ,  B23K26/362 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/49894 ,  H01L2224/32225 ,  H05K1/0263 ,  H05K3/027 ,  H05K3/243 ,  H05K3/341 ,  H05K2201/09363 ,  H05K2203/0315 ,  H05K2203/1173

Abstract: A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

公开(公告)号：US09391242B2

公开(公告)日：2016-07-12

申请号：US14406331

申请日：2013-04-26

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Toshio Hata ,  Yuhsuke Fujita ,  Kenichi Akamatsu

IPC: H01L33/62 ,  H01L33/48 ,  H01L25/16 ,  H05K1/16 ,  H01L27/15 ,  H01L33/36 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L27/15 ,  H01L33/36 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/167 ,  H05K2201/09363 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A surface mounted light emitting device having superior reliability with a focus on low cost producibility, in which a protective element can be formed without lowering the efficiency of light emission from a light emitting element, is provided.Since, for example, a printed resistance 16, as a protective element, is formed on at least the top surface side, the back surface side, or the inside of an insulating film 2 and, for example, the printed resistance 16, as a protective element, is formed on the rear surface side of the installation surface of a light emitting element 11, light emitted from the light emitting element 11 is not obstructed due to light blocking, light absorption or the like by, for example, the printed resistance 16, as a protective element.

Abstract translation: 提供一种表面安装的发光器件，其具有优异的可靠性，重点是低成本可生产性，其中可以形成保护元件而不降低发光元件的发光效率。 由于例如作为保护元件的印刷电阻16至少形成在绝缘膜2的上表面侧，背面侧或内部，例如印刷电阻16上，作为 保护元件形成在发光元件11的安装表面的后表面侧上，从发光元件11发射的光不被遮光，光吸收等阻挡，例如通过印刷电阻 16，作为保护元件。