公开(公告)号：US08304664B2

公开(公告)日：2012-11-06

申请号：US12777605

申请日：2010-05-11

Applicant: Tsuyoshi Kobayashi ,  Michio Horiuchi ,  Yukio Shimizu ,  Yasue Tokutake

Inventor： Tsuyoshi Kobayashi ,  Michio Horiuchi ,  Yukio Shimizu ,  Yasue Tokutake

IPC: H05K1/11

CPC classification number: H05K3/325 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15724 ,  H01L2924/15788 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/305 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.

Abstract translation: 一种电子部件（芯片）安装结构，包括具有端子的芯片，具有与芯片的端子电连接的端子的布线板以及设置在芯片和布线板之间的插入板，并且具有包括绝缘基底 材料具有在其厚度方向上穿透绝缘基材的大量丝状导体。 芯片的端子通过设置在插入板中的多个丝状导体电连接到布线板的端子。

公开(公告)号：US20110117357A1

公开(公告)日：2011-05-19

申请号：US13003231

申请日：2009-07-07

Applicant: Yusuke Hatanaka ,  Shinya Suzuki

Inventor： Yusuke Hatanaka ,  Shinya Suzuki

IPC: B32B3/26 ,  C25D5/02

CPC classification number: H05K3/323 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29076 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/3011 ,  H05K2201/0116 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/1189 ,  Y10T428/24997 ,  Y10T428/24998 ,  H01L2924/00

Abstract: A microstructure which has excellent long-term stability and is capable of simple joining by thermocompression bonding at a high joint strength is provided. The microstructure includes an insulating base in which through micropores with a pore size of 10 to 500 nm are disposed at a density of 1×106 to 1×1010 micropores/mm2. The through micropores are filled with a metal at a filling ratio of at least 30% and a polymer layer is formed on at least one surface of the insulating base.

Abstract translation: 提供了具有优异的长期稳定性并且能够以高接合强度通过热压接而简单接合的微结构。 微结构包括绝缘基底，其中孔径为10〜500nm的细孔以1×10 6〜1×10 10个微孔/ mm 2的密度配置。 贯通微孔以填充率至少为30％的金属填充，并且在绝缘基底的至少一个表面上形成聚合物层。

公开(公告)号：US20090288697A1

公开(公告)日：2009-11-26

申请号：US12439576

申请日：2007-05-28

Applicant: Takehiro Shimizu ,  Kaoru Okaniwa ,  Naoki Fukushima

Inventor： Takehiro Shimizu ,  Kaoru Okaniwa ,  Naoki Fukushima

IPC: H01L31/042 ,  B32B5/16

CPC classification number: H05K3/323 ,  H01L31/0512 ,  H01L31/18 ,  H05K2201/09945 ,  Y02E10/50 ,  Y10T428/25

Abstract: The conductive adhesive film of the invention is a conductive adhesive film for electrical connection between photovoltaic cell surface electrodes and wiring members, which comprises an insulating adhesive 2 and conductive particles 1 and has a (t/r) value in the range of 0.75-17.5, where r (μm) is the mean particle size of the conductive particles 1 and t (μm) is the thickness of the conductive adhesive film, wherein the content of the conductive particles 1 is 1.7-15.6 vol % based on the total volume of the conductive adhesive film.

Abstract translation: 本发明的导电性粘接膜是在光电池用表面电极与布线部件之间进行电连接的导电性粘合膜，其包含绝缘性粘合剂2和导电性粒子1，（t / r）的值在0.75〜17.5的范围内 ，其中r（mum）是导电颗粒1的平均粒度，t（mum）是导电粘合剂膜的厚度，其中导电颗粒1的含量相对于导电性颗粒1的总体积为1.7-15.6体积％ 导电胶膜。

公开(公告)号：US20090208731A1

公开(公告)日：2009-08-20

申请号：US12370477

申请日：2009-02-12

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: B32B5/16 ,  B05D5/12

CPC classification number: H05K3/323 ,  H01L2924/0002 ,  H05K3/361 ,  H05K2201/09945 ,  H05K2203/0425 ,  Y10T428/254 ,  H01L2924/00

Abstract: A conductive adhesive film includes an insulating adhesive material and a plurality of conductive particles dispersed in the insulating adhesive material, wherein the conductive particles are arranged in the insulating adhesive material at a predetermined pitch.

Abstract translation: 导电性粘合膜包括绝缘性粘合剂材料和分散在绝缘性粘合剂材料中的多个导电性粒子，其中，导电性粒子以预定的间距配置在绝缘性粘接材料中。

公开(公告)号：US07408263B2

公开(公告)日：2008-08-05

申请号：US11417860

申请日：2006-05-03

Applicant: Jeffrey Scott Meth

Inventor： Jeffrey Scott Meth

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09945 ,  Y10T29/49126

Abstract: Anisotropic conductive coatings and electronic devices made using the coatings are provided. The anisotropic conductive coatings are particularly useful in electronic devices that contain flexible substrates.

Abstract translation: 提供各向异性导电涂层和使用涂层制成的电子器件。 各向异性导电涂层在包含柔性基底的电子器件中特别有用。

公开(公告)号：US20060249301A1

公开(公告)日：2006-11-09

申请号：US11417860

申请日：2006-05-03

Applicant: Jeffrey Meth

Inventor： Jeffrey Meth

IPC: H05K1/11 ,  H01L23/52

CPC classification number: H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09945 ,  Y10T29/49126

Abstract: Anisotropic conductive coatings and electronic devices made using the coatings are provided. The anisotropic conductive coatings are particularly useful in electronic devices that contain flexible substrates.

Abstract translation: 提供各向异性导电涂层和使用涂层制成的电子器件。 各向异性导电涂层在包含柔性基底的电子器件中特别有用。

公开(公告)号：US20030155656A1

公开(公告)日：2003-08-21

申请号：US10346288

申请日：2003-01-17

Inventor： Cindy Chia-Wen Chiu ,  David Hsein-Pin Chen ,  Philip Yi Zhi Chu ,  Hsiao Ken Chuang ,  H. Paul Barker

IPC: H01L023/48

CPC classification number: H01L23/49827 ,  H01L2224/11334 ,  H01L2224/16237 ,  H05K3/323 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2201/10378

Abstract: An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.

Abstract translation: 用于提供电子部件之间的电互连的各向异性导电结构以及制造这种各向异性导电结构的方法。 各向异性导电结构包括具有基本上均匀厚度的介电矩阵; 穿过矩阵的通孔阵列; 多个导电元件，其中单个通孔包含至少一个导电元件; 粘附到基质的第一主表面上的第一粘合剂层; 以及可选地，粘附到基质的第二主表面的第二粘合剂层。

公开(公告)号：US20030068877A1

公开(公告)日：2003-04-10

申请号：US10225907

申请日：2002-08-21

Inventor： Larry D. Kinsman

IPC: H01L021/44

CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09945 ,  H01L2924/00

Abstract: The present invention is directed to an apparatus and method for connecting integrated circuits placed on opposite sides of a circuit board through utilization of conduction elements embedded in the circuit board and extending from one surface of the board to the other. Conductive traces extend along the surface of the circuit board from the conduction elements to the integrated circuits. The conductive traces may be formed from multiple conductive layers.

公开(公告)号：US06270363B1

公开(公告)日：2001-08-07

申请号：US09315373

申请日：1999-05-18

Applicant: Peter J. Brofman ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: H01R458

CPC classification number: H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/81101 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01R12/52 ,  H01R13/2414 ,  H01R43/0256 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0272 ,  H05K2201/0284 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A compressible interposer comprising an interposer sheet having a plurality of apertures filled with a dielectric material having a substantially uniform suspension of conductive particles therein forming a plurality of conductive sites. Preferably, the number of conductive sites on the interposer are greater in number than the number of contact pads on the electronic components such that precise alignment of the interposer between the electronic components is not required. The apertures of the interposer sheet confine the conductive particles within the dielectric material such that during compression of the interposer between the electronic components, z-axis conductive pathways are formed without shorting in the x and y directions. Preferably, the interposer sheet comprises polyimide. Preferably, the dielectric material comprises polyimide-siloxane. Preferably, the conductive particles have a diameter of about 2 to about 20 &mgr;m and comprise of a material selected from the group consisting of copper, gold, silver, nickel, palladium, platinum, and alloys thereof. The particles may also be coated with an additional conductive material such as solder having a lower melting temperature. Most preferably, the conductive particles comprise solder coated copper particles. The conductive particles are present in an amount of about 30 to about 90 wt. % of the total weight of the conductive particles and the dielectric material.

Abstract translation: 一种可压缩插入件，其包括插入片，所述插入片具有填充有形成多个导电部位的导电粒子的基本均匀悬浮液的电介质材料的多个孔。 优选地，内插器上的导电位置的数量大于电子部件上的接触焊盘的数量，使得不需要电子部件之间的插入器的精确对准。 插入片的孔径将导电粒子限制在电介质材料内，使得在电子部件之间的插入件压缩期间，在x和y方向上形成z轴传导路径而不会短路。 优选地，插入片包括聚酰亚胺。 优选地，电介质材料包括聚酰亚胺 - 硅氧烷。 优选地，导电颗粒的直径为约2至约20μm，并且包括选自铜，金，银，镍，钯，铂及其合金的材料。 颗粒也可以涂覆有另外的导电材料，例如具有较低熔融温度的焊料。 最优选地，导电颗粒包括焊料涂覆的铜颗粒。 导电颗粒的存在量为约30至约90wt。 导电颗粒和电介质材料的总重量的百分比。

公开(公告)号：US6042894A

公开(公告)日：2000-03-28

申请号：US890342

申请日：1997-07-09

Applicant: Yasushi Goto ,  Isao Tsukagoshi ,  Tomohisa Ohta

Inventor： Yasushi Goto ,  Isao Tsukagoshi ,  Tomohisa Ohta

IPC: C08J5/00 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H01R13/24 ,  H05K3/10 ,  H05K3/32 ,  C08J7/04 ,  B05D5/00 ,  B05D1/36

CPC classification number: H01R13/2414 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/11003 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09945 ,  H05K2203/0307 ,  H05K2203/0338 ,  H05K3/102

Abstract: An isotropically electroconductive resin film material produced by sticking electroconductive particles to a sticking layer formed on a support and fixing therein, and filling a film-forming resin incompatible with the sticking material among the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

Abstract translation: 通过将导电颗粒粘附到形成在支撑体上并固定在其中的粘着层并且填充与导电颗粒之间的粘合材料不相容的成膜树脂而产生的各向同性导电树脂薄膜材料仅通过该导电颗粒在膜厚度方向上具有导电性 导电颗粒在平面方向上均匀分散，并且适用于电连接多个电子部件的相对放置的电路和精细电极，并用于测试电子部件。