公开(公告)号：US07080445B2

公开(公告)日：2006-07-25

申请号：US10284414

申请日：2002-10-31

Applicant: Toshihiro Miyake ,  Kazuyuki Deguchi ,  Yoshitaro Yazaki ,  Hiroaki Maeda ,  Mitsutoshi Miyazaki ,  Makoto Totani ,  Akinari Higashida ,  Hiroki Miyagawa

Inventor： Toshihiro Miyake ,  Kazuyuki Deguchi ,  Yoshitaro Yazaki ,  Hiroaki Maeda ,  Mitsutoshi Miyazaki ,  Makoto Totani ,  Akinari Higashida ,  Hiroki Miyagawa

IPC: H05K3/36

CPC classification number: H05K3/363 ,  H05K2201/0129 ,  H05K2201/0191 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/10772 ,  H05K2201/2009 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/065 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.

公开(公告)号：US06765805B2

公开(公告)日：2004-07-20

申请号：US09970355

申请日：2001-10-03

Applicant: Takumi Naruse ,  Kenichi Kozaki ,  Kazuhiro Eguchi ,  Katsumi Sasaki

Inventor： Takumi Naruse ,  Kenichi Kozaki ,  Kazuhiro Eguchi ,  Katsumi Sasaki

IPC: H05K111

CPC classification number: H01R12/57 ,  H01P1/00 ,  H01P1/2053 ,  H01R12/52 ,  H01R12/718 ,  H01R12/721 ,  H05K3/3405 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/10386 ,  H05K2201/10757 ,  H05K2201/10772 ,  Y02P70/613

Abstract: A circuit component comprising a circuit board and a terminal for mounting the circuit board on a second circuit board. A length of the circuit board is 10 mm-80 mm, a difference in a coefficient of thermal expansion between the circuit board and the second circuit board is 0.2×10−5/° C. or greater. The terminal is made of an elastic material, and comprised of a first connection section, a second connection section and an elastic section disposed between the first and second connection sections, and the terminal separates the circuit board from the second circuit board by 0.3 mm-5 mm. In the circuit components of the present invention, deterioration in the conduction between the circuit board and the second circuit board due to heat cycles can be prevented. Thus, a circuit component having stable operating characteristics for a long period of time is obtained.

Abstract translation: 一种电路部件，包括电路板和用于将电路板安装在第二电路板上的端子。 电路板的长度为10mm-80mm，电路板和第二电路板之间的热膨胀系数的差为0.2×10 -5 /℃或更高。 端子由弹性材料制成，包括第一连接部分，第二连接部分和布置在第一和第二连接部分之间的弹性部分，并且端子将电路板与第二电路板分开0.3mm- 5毫米。 在本发明的电路部件中，可以防止由于热循环导致的电路板和第二电路板之间的导通性的恶化。 因此，获得长时间具有稳定的工作特性的电路部件。

公开(公告)号：US20030079341A1

公开(公告)日：2003-05-01

申请号：US10284414

申请日：2002-10-31

Inventor： Toshihiro Miyake ,  Kazuyuki Deguchi ,  Yoshitaro Yazaki ,  Hiroaki Maeda ,  Mitsutoshi Miyazaki ,  Makoto Totani ,  Akinari Higashida ,  Hiroki Miyagawa

IPC: H05K003/36 ,  H05K003/20

CPC classification number: H05K3/363 ,  H05K2201/0129 ,  H05K2201/0191 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/10772 ,  H05K2201/2009 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/065 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.

Abstract translation: 第一印刷电路板包括基本上由热塑性树脂制成的第一绝缘板和第一导电图案。 第二印刷电路板包括第二绝缘板和第二导电图案。 第一和第二印刷电路板重叠。 第一和第二印刷电路板的重叠部分被热压以将第一和第二印刷电路板与热压工具连接，同时第一绝缘板在与由热压工具压制的区域相邻的区域处被冷却 。 通过热压，第一和第二焊盘电连接，并且热塑性树脂软化和塑性变形，以将第一绝缘板接合到第二绝缘板。 优选通过冷却将第一绝缘板的厚度控制在热压区域和与热压区域相邻的区域。

公开(公告)号：US06375494B2

公开(公告)日：2002-04-23

申请号：US09767974

申请日：2001-01-23

Applicant: Ulrika Renmark ,  Christian Axelsson

Inventor： Ulrika Renmark ,  Christian Axelsson

IPC: H01R300

CPC classification number: H05K3/301 ,  H05K3/341 ,  H05K2201/10772 ,  Y02P70/613

Abstract: A component carrier for an electronic component, said component carrier being made in one piece of a metal sheet material and provided with means for surface mounting on a printed circuit board (PCB) and with holding flanges (2a, 2b) for holding an electronic component. The component carrier has a base (1) provided with a central soldering platform for surface mounting on the PCB. The holding flanges (2a, 2b) extend from the base (1) and are connected to the base (1) via tongues (4a-4d) of the metal sheet material, said tongues (4a-4d) extending in a plane parallel with the base (1).

Abstract translation: 一种用于电子部件的部件载体，所述部件载体制成一片金属片材料，并且具有用于表面安装在印刷电路板（PCB）上的装置和用于保持电子部件的保持凸缘（2a，2b） 。 组件载体具有设置有用于表面安装在PCB上的中心焊接平台的基座（1）。 保持凸缘（2a，2b）从底座（1）延伸并通过金属片材的舌片（4a-4d）连接到基座（1）上，所述舌片（4a-4d）在平行于 基座（1）。

公开(公告)号：US20010051458A1

公开(公告)日：2001-12-13

申请号：US09767974

申请日：2001-01-23

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： Ulrika Renmark ,  Christian Axelsson

IPC: H01R003/00

CPC classification number: H05K3/301 ,  H05K3/341 ,  H05K2201/10772 ,  Y02P70/613

Abstract: A component carrier for an electronic component, said component carrier being made in one piece of a metal sheet material and provided with means for surface mounting on a printed circuit board (PCB) and with holding flanges (2a, 2b) for holding an electronic component. The component carrier has a base (1) provided with a central soldering platform for surface mounting on the PCB. The holding flanges (2a, 2b) extend from the base (1) and are connected to the base (1) via tongues (4a-4d) of the metal sheet material, said tongues (4a-4d) extending in a plane parallel with the base (1).

Abstract translation: 一种用于电子部件的部件载体，所述部件载体制成一片金属片材料，并且具有用于表面安装在印刷电路板（PCB）上的装置和用于保持电子部件的保持凸缘（2a，2b） 。 组件载体具有设置有用于表面安装在PCB上的中心焊接平台的基座（1）。 保持凸缘（2a，2b）从底座（1）延伸并通过金属片材的舌片（4a-4d）连接到基座（1）上，所述舌片（4a-4d）在平行于 基座（1）。

公开(公告)号：US06246548B1

公开(公告)日：2001-06-12

申请号：US09258011

申请日：1999-02-25

Applicant: Stephen P. Williams

Inventor： Stephen P. Williams

IPC: G11B548

CPC classification number: G11B5/4846 ,  G11B5/4853 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/091 ,  H05K2201/10772 ,  H05K2201/2036 ,  Y10T29/49144

Abstract: Mechanically formed standoffs in a disk drive integrated circuit interconnect reduces the cost of manufacturing and improves the reliability of the electrical interconnections thereof. Connection pads defined along the interconnect are bonded with bonding pads of a signal producing source and a signal processing source. The standoffs provide mechanical stops during the bonding process, enabling sufficient bonding material to form between bonding areas. The standoffs are mechanically formed with a punch and die assembly either directly through a bonding pad predefined along traces on the interconnect or adjacent the bonding pad. The standoffs formed through the bonding pads are covered with solder or other electrically conductive bonding material.

Abstract translation: 在磁盘驱动器集成电路互连中机械地形成的支座降低了制造成本并提高了其电互连的可靠性。 沿着互连件限定的连接焊盘与信号产生源和信号处理源的焊盘接合。 在接合过程中，间隙提供机械停止，使得能够在接合区域之间形成足够的接合材料。 该支座通过冲头和模具组件机械地形成，该冲头和模具组件可以直接通过沿着互连线上的迹线预定的接合焊盘，或者与焊盘相邻。 通过焊盘形成的支座被焊料或其它导电粘合材料覆盖。

公开(公告)号：US5420461A

公开(公告)日：1995-05-30

申请号：US225420

申请日：1994-04-07

Applicant: Debendra Mallik ,  Bidyut K. Bhattacharyya

Inventor： Debendra Mallik ,  Bidyut K. Bhattacharyya

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34 ,  H01L23/48 ,  H01L23/02 ,  H01L23/12 ,  H01L29/40

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49861 ,  H05K3/3426 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/10772 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: An integrated circuit device having an array of flexible leads attached to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality of slots are punched into the sheet, such that there is formed a plurality of beams. The beams are then bent into a spring shape. The sheet is placed over an integrated circuit package which has an array of contact pads extending across a bottom surface of the package. The beams are aligned and attached to the contact pads. The beams are then cut and separated from the remainder of the sheet. The sheet is removed, wherein there is constructed an integrated circuit package that has a two dimensional array of flexible leads.

Abstract translation: 一种具有附接到集成电路封装的底部的柔性引线阵列的集成电路器件。 提供了一块导电材料。 多个槽被冲压成片材，使得形成多个梁。 然后将梁弯曲成弹簧形状。 片材放置在集成电路封装上，该集成电路封装具有穿过封装的底表面延伸的接触焊盘阵列。 梁对准并连接到接触垫。 然后将梁切割并与片材的其余部分分离。 去除片材，其中构建了具有柔性引线的二维阵列的集成电路封装。

公开(公告)号：US5210939A

公开(公告)日：1993-05-18

申请号：US870542

申请日：1992-04-17

Applicant: Debendra Mallik ,  Bidyut K. Bhattacharyya

Inventor： Debendra Mallik ,  Bidyut K. Bhattacharyya

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49861 ,  H05K3/3426 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/10772 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: A method for attaching an array of flexible leads to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality of slots are punched into the sheet, such that there is formed a plurality of beams. The beams are then bent into a spring shape. The sheet is placed over an integrated circuit package which has an array of contact pads extending across a bottom surface of the package. The beams are aligned and attached to the contact pads. The beams are then cut and separated from the remainder of the sheet. The sheet is removed, wherein there is constructed an integrated circuit package that has a two dimensional array of flexible leads.

Abstract translation: 一种用于将柔性引线阵列附接到集成电路封装的底部的方法。 提供了一块导电材料。 多个槽被冲压成片材，使得形成多个梁。 然后将梁弯曲成弹簧形状。 片材放置在集成电路封装上，该集成电路封装具有穿过封装的底表面延伸的接触焊盘阵列。 梁对准并连接到接触垫。 然后将梁切割并与片材的其余部分分离。 去除片材，其中构建了具有柔性引线的二维阵列的集成电路封装。

公开(公告)号：KR100776905B1

公开(公告)日：2007-11-19

申请号：KR1020040054597

申请日：2004-07-14

Applicant: 산요덴키가부시키가이샤 ,  간또 산요 세미컨덕터즈 가부시끼가이샤

Inventor： 가메야마고우지로 ,  미따기요시

IPC: H01L23/48

CPC classification number: H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10772 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: 본 발명은 외부 단자에 용착시키는 접합재에의 시인성을 향상시킨다. 반도체 소자와 상기 반도체 소자에 전기적으로 접속된 전극이 절연성을 갖는 밀봉재에 의해서 밀봉되고, 외부의 실장 기판과 접합재를 개재하여 접합되는 실장면 주위에 상기 전극을 노출시켜 이루어지는 반도체 장치로서, 상기 전극은 상기 실장면이 상기 접합재를 개재하여 상기 실장 기판에 접합된 상태에서, 상기 실장면을 둘러싼 측면측에서 상기 접합재를 시인할 수 있는 형상을 나타낸다.
밀봉재, 접합재, 블레이드, 금속 세선, 본딩 패드

Abstract translation: 工业实用性本发明提高了待焊接到外部端子的接合材料的可视性。 一种半导体器件，包括：半导体元件和电极，所述电极与所述半导体元件电连接，所述电极通过具有绝缘特性的密封材料密封并且使所述电极经由接合材料暴露于与外部安装基板接合的安装表面上， 并且，在安装面经由接合材料接合于安装基板的状态下，能够在包围安装面的侧面侧看到接合材料。

公开(公告)号：KR1019930002813B1

公开(公告)日：1993-04-10

申请号：KR1019900006388

申请日：1990-05-07

Applicant: 가부시끼가이샤 히다치 세이사꾸쇼

Inventor： 기따노마꼬또 ,  니시무라아사오 ,  야구찌아끼히로 ,  가와이스에오 ,  호시아끼오 ,  시미즈이찌오

IPC: H01L23/48 ,  H01L23/50

CPC classification number: H01L23/49582 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: 내용 없음.