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    EPOXY RESIN COMPOSITION
    131.
    发明专利
    EPOXY RESIN COMPOSITION 失效

    公开(公告)号：JPH04202520A

    公开(公告)日：1992-07-23

    申请号：JP33972190

    申请日：1990-11-30

    Applicant: TORAY INDUSTRIES

    Inventor： SAWAMURA TAIJI ,  TESHIBA TOSHIHIRO ,  TANAKA MASAYUKI

    IPC: C08K3/00 ,  C08G59/00 ,  C08G59/20 ,  C08G59/24 ,  C08K3/36 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

    Abstract: PURPOSE:To provide the subject composition containing a specified epoxy resin, a curing agent and a specified amount of a filler composed of a specified fused silica and excellent in soldering heat resistance, moldability and moisture resistance reliability. CONSTITUTION:An objective composition containing (A) epoxy resins essentially composed of an epoxy resin (e.g. 1,5-diglycidylnaphthalene) of the formula (R to R are H, halogen or 1-4C alkyl), (B) a curing agent (e.g. phenolic novolak resin) preferably in an amount of 2-15wt.% and (C) 75-90wt.%, preferably 77-88wt.% filler composed of 99-50wt.%, preferably 97-70wt.% crushed fused silica having

    EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
    133.
    发明专利
    EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR 失效

    公开(公告)号：JPH0459862A

    公开(公告)日：1992-02-26

    申请号：JP17351390

    申请日：1990-06-29

    Applicant: TORAY INDUSTRIES

    Inventor： SAWAMURA TAIJI ,  KAYABA KEIJI ,  TANAKA MASAYUKI

    IPC: C08K3/00 ,  C08G59/00 ,  C08G59/20 ,  C08K5/54 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

    Abstract: PURPOSE:To provide an epoxy resin composition having excellent soldering heat resistance, moisture resistant reliability and moldability free of burr and having good thermal hardness and useful for sealing semiconductors by compounding an epoxy resin, a curing agent, a filler and a polyfunctional silane coupling agent. CONSTITUTION:An epoxy resin preferably containing biphenyl epoxy resin having a skeleton of the formula (R -R are H, 1-4C alkyl or halogen) in an amount of >=30wt.% based on the whole epoxy resin, (B) a curing agent (preferably a novolak resin) in a A:B chemical equivalent ratio of 1:(0.5-0.6), especially 0.8-1.3, (C) 5-90wt.% or a filler (preferably molted silica), (D) a polyfunctional silane coupling agent in an amount of 0.1-5 pts.wt., preferably 0.2-3 pts.wt., per 100 pts.wt. of the component C and, if necessary, a curing agent, a flame retardant, etc., the component C being surface-treated with the component D, are melted and kneaded with each other to provide the objective resin composition.

    EPOXY RESIN COMPOSITION
    135.
    发明专利
    EPOXY RESIN COMPOSITION 失效

    公开(公告)号：JPH02218735A

    公开(公告)日：1990-08-31

    申请号：JP4105789

    申请日：1989-02-20

    Applicant: TORAY INDUSTRIES

    Inventor： SAWAMURA TAIJI ,  KAYABA KEIJI ,  TANAKA MASAYUKI

    IPC: C08K3/00 ,  C08G59/00 ,  C08K5/54 ,  C08K5/544 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

    Abstract: PURPOSE:To obtain the title composition which has excellent moldability and prevents the sealing resin from cracking in the soldering process by using a specific epoxy resin, a curing agent, a filler and an amino group-containing silane coupling agent. CONSTITUTION:The subject composition comprises (A) an epoxy resin containing, as an essential component, an epoxy resin having a skeleton of the formula (R to R are 1-4C alkyl, halogen) such as 4,4'-bis(2,3-epoxypropoxy) biphenyl, (B) a curing agent such as a phenol novolak resin, (C) a filler, preferably a fused silica which is composed of 90 to 40wt.% of fused and crushed silica of less than 12mum average particle size and 10 to 80wt.% of spherical fused silica of less than 40mum average particle size, and (D) an amino group, preferably secondary amino group-containing silane coupling agent.

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