公开(公告)号：US20160154070A1

公开(公告)日：2016-06-02

申请号：US14512469

申请日：2014-10-13

Applicant: InSighTech, LLC

Inventor： Biao Zhang ,  Tao Ju

IPC: G01R33/09 ,  G01C19/5712

CPC classification number: G01P15/105 ,  B81B5/00 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/038 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5776 ,  G01P15/125 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098

Abstract: A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism on a magnetic sensor wafer and a magnetic source on a MEMS wafer that further comprises a proof-mass. The magnetic sensor wafer and MEMS wafer are bonded through a bonding mechanism that comprises a hearting mechanism.

Abstract translation: 本文公开了一种MEMS陀螺仪，其中MEMS陀螺仪包括磁传感器晶片上的磁感测机构和进一步包括校验质量的MEMS晶片上的磁源。 磁传感器晶片和MEMS晶片通过包括心脏机构的接合机构结合。

公开(公告)号：US09331048B2

公开(公告)日：2016-05-03

申请号：US14605486

申请日：2015-01-26

Applicant: Maxim Integrated Products, Inc.

Inventor： Quanbo Zou ,  Uppili Sridhar ,  Amit S. Kelkar ,  Xuejun Ying

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  B81C3/00 ,  C25D7/12 ,  C25D17/00 ,  H01L25/00

CPC classification number: H01L24/83 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/035 ,  C25D7/123 ,  C25D17/001 ,  C25D17/005 ,  C25D17/007 ,  H01L23/481 ,  H01L24/13 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/13144 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01068 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/30101 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method including: providing a first wafer stack; applying a first bonding layer on the first wafer stack; providing a second wafer stack, where the second wafer stack includes vias; and applying a second bonding layer to the second wafer stack. The vias extend through the second wafer stack and to the second bonding layer. The second bonding layer is bonded to the first bonding layer. A seed layer is applied on a side of the second wafer stack opposite the second bonding layer such that a material of the seed layer (i) contacts the vias, and (ii) extends over and past ends of the second wafer stack and onto the first bonding layer.

Abstract translation: 一种方法，包括：提供第一晶片叠层; 在第一晶片叠层上施加第一粘结层; 提供第二晶片堆叠，其中第二晶片堆叠包括通孔; 以及将第二结合层施加到所述第二晶片堆叠。 通孔延伸穿过第二晶片堆叠并延伸到第二结合层。 第二接合层与第一接合层接合。 将种子层施加在与第二接合层相对的第二晶片堆叠的一侧上，使得种子层（i）的材料接触通孔，并且（ii）延伸到第二晶片堆叠的上部和末端，并且延伸到 第一粘结层。

公开(公告)号：US20160002028A1

公开(公告)日：2016-01-07

申请号：US14752718

申请日：2015-06-26

Applicant: InvenSense, Inc.

Inventor： Peter SMEYS

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81B7/02 ,  B81C1/00246 ,  B81C2201/0197 ,  B81C2203/0792

Abstract: A method of providing a CMOS-MEMS structure is disclosed. The method comprises patterning a first top metal on a MEMS actuator substrate and a second top metal on a CMOS substrate. Each of the MEMS actuator substrate and the CMOS substrate include an oxide layer thereon. The method includes etching each of the oxide layers on the MEMS actuator substrate and the base substrate, utilizing a first bonding step to bond the first patterned top metal of the MEMS actuator substrate to the second patterned top metal of the base substrate. Finally the method includes etching an actuator layer into the MEMS actuator substrate and utilizing a second bonding step to bond the MEMS actuator substrate to a MEMS handle substrate.

Abstract translation: 公开了一种提供CMOS-MEMS结构的方法。 该方法包括将MEMS致动器基板上的第一顶部金属和CMOS基板上的第二顶部金属图案化。 MEMS致动器基板和CMOS基板中的每一个在其上包括氧化物层。 该方法包括利用第一结合步骤将MEMS致动器基板的第一图案化顶部金属与基底基板的第二图案化顶部金属结合来蚀刻MEMS致动器基板和基底基板上的每个氧化物层。 最后，该方法包括将致动器层蚀刻到MEMS致动器基板中，并利用第二结合步骤将MEMS致动器基板结合到MEMS手柄基板。

公开(公告)号：US20150033856A1

公开(公告)日：2015-02-05

申请号：US14518665

申请日：2014-10-20

Applicant: InSigh Tech, LLC

Inventor： BIAO ZHANG ,  TAO JU

IPC: G01C19/5712 ,  G01P15/105

CPC classification number: G01P15/105 ,  B81B5/00 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/038 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5776 ,  G01P15/125 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098

Abstract: A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a driving mechanism, a magnetic sensing mechanism and a magnetic source that is formed at the proof-mass. The MEMS gyroscope is enclosed in a package that further comprises a magnet for providing bias magnetic field.

Abstract translation: 本文公开了一种MEMS陀螺仪，其中所述MEMS陀螺仪包括形成在所述证明质量下的驱动机构，磁感测机构和磁源。 MEMS陀螺仪封装在一个封装中，该封装还包括用于提供偏置磁场的磁体。

公开(公告)号：US20150033855A1

公开(公告)日：2015-02-05

申请号：US14518651

申请日：2014-10-20

Applicant: InSighTech, LLC

Inventor： Biao ZHANG ,  Tao JU

IPC: G01C19/5712 ,  G01P15/105

CPC classification number: G01P15/105 ,  B81B5/00 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/038 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5776 ,  G01P15/125 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098

Abstract: A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism and a magnetic source that is associated with the proof-mass. The magnetic sensing mechanism comprises multiple magnetic field sensors that are designated for sensing the magnetic field from a magnetic source so as to mitigate the problems caused by fabrication.

Abstract translation: 本文公开了一种MEMS陀螺仪，其中MEMS陀螺仪包括与检测质量相关联的磁感测机构和磁源。 磁感测机构包括多个磁场传感器，其被指定用于感测来自磁源的磁场，以便减轻由制造引起的问题。

公开(公告)号：US08667673B2

公开(公告)日：2014-03-11

申请号：US12840763

申请日：2010-07-21

Applicant: Takayuki Yamada ,  Kazuaki Tabata

Inventor： Takayuki Yamada ,  Kazuaki Tabata

IPC: H05K3/02 ,  H05K3/10

CPC classification number: C25D5/12 ,  B32B3/085 ,  B32B15/00 ,  B32B15/04 ,  B32B15/043 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2457/00 ,  B81C99/008 ,  B81C99/009 ,  B81C2201/0191 ,  B81C2201/0197 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  C25D5/022 ,  C25D5/16 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T428/12493 ,  Y10T428/12882 ,  Y10T428/24917 ,  Y10T428/24983

Abstract: A method for fabricating a laminated structure includes (i) preparing a first substrate having electroconductivity, (ii) forming a first electroconductive film having a prescribed hardness on the first substrate by an electroforming, (iii) forming a second electroconductive film having a hardness that is lower than the prescribed hardness on the first electroconductive film by an electroforming, (iv) patterning the first electroconductive film and the second electroconductive film to a prescribed pattern to form a plurality of electroconductive film patterns, and (v) subjecting the first substrate and a second substrate repeatedly to pressure contact and release to transfer sequentially the plurality of electroconductive film patterns on the first substrate onto the second substrate.

Abstract translation: 一种层叠结构体的制造方法，其特征在于，具备：（i）制备具有导电性的第一基板，（ii）通过电铸在所述第一基板上形成具有规定硬度的第一导电膜，（iii）形成具有硬度的第二导电膜， 通过电铸，比第一导电膜上的规定硬度低，（iv）将第一导电膜和第二导电膜图案化为规定图案以形成多个导电膜图案，（v）使第一基板和 重复第二衬底以压力接触和释放以顺序地将第一衬底上的多个导电膜图案转印到第二衬底上。

公开(公告)号：US20140004374A1

公开(公告)日：2014-01-02

申请号：US14017510

申请日：2013-09-04

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen

IPC: C25D1/00 ,  C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US08603316B2

公开(公告)日：2013-12-10

申请号：US13167451

申请日：2011-06-23

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02 ,  C25D5/10

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US20130279307A1

公开(公告)日：2013-10-24

申请号：US13917975

申请日：2013-06-14

Applicant: Nivarox-FAR S.A.

Inventor： Jean-Charles Fiaccabrino ,  Marco Verardo ,  Thierry Conus ,  Jean-Philippe Thiebaud ,  Jean-Bernard Peters

IPC: F16H55/06 ,  G04B13/02

CPC classification number: F16H55/06 ,  B81B2201/035 ,  B81C99/0095 ,  B81C2201/0197 ,  C25D1/08 ,  C25D5/02 ,  C25D5/10 ,  G04B13/02 ,  G04B13/022 ,  G04B19/042 ,  Y10T74/1987

Abstract: The invention relates to a method (1) of manufacturing a silicon-metal composite micromechanical component (51) combining DRIE and LIGA processes. The invention also relates to a micromechanical component (51) including a layer wherein one part (53) is made of silicon and another part (41) of metal so as to form a composite micromechanical component (51). The invention concerns the field of timepiece movements.

Abstract translation: 本发明涉及一种制造组合DRIE和LIGA工艺的硅 - 金属复合微机械部件（51）的方法（1）。 本发明还涉及一种包括其中一部分（53）由硅制成的层和金属的另一部分（41）的层的微机械部件（51），以便形成复合微机械部件（51）。 本发明涉及钟表运动领域。

公开(公告)号：US20130121892A1

公开(公告)日：2013-05-16

申请号：US13811800

申请日：2011-08-01

Applicant: Gerda Fuhrmann ,  Gabriele Nelles ,  Silvia Rosseli ,  Nikolaus Knorr ,  Alfred Paris ,  Maria Kaufmann ,  Georg Bauer

Inventor： Gerda Fuhrmann ,  Gabriele Nelles ,  Silvia Rosseli ,  Nikolaus Knorr ,  Alfred Paris ,  Maria Kaufmann ,  Georg Bauer

IPC: B81B1/00

CPC classification number: B81B1/00 ,  B01L3/502707 ,  B01L2300/16 ,  B01L2300/161 ,  B05D1/62 ,  B81C1/00206 ,  B81C3/00 ,  B81C2201/0197 ,  C08J7/04 ,  C08J7/047 ,  C08J7/06 ,  C08J7/123 ,  C08J2383/04 ,  C08L83/04 ,  C23C16/045 ,  Y02P20/582 ,  Y10T156/10

Abstract: The present invention relates to a polymeric substrate having a glass-like surface, in particular an etched-glass-like surface and to a chip made of at least one such polymeric substrate. The present invention also relates to a method of providing a polymeric substrate with an etched-glass-like surface. Moreover, the present invention relates to a kit for manufacturing a chip using such polymeric substrate. Moreover, the present invention relates to the use of a polymeric substrate having a glass-like surface, in particular an etched-glass-like surface for manufacturing a chip.

Abstract translation: 本发明涉及具有玻璃状表面，特别是蚀刻玻璃状表面的聚合物基材和由至少一种这样的聚合物基材制成的芯片。 本发明还涉及提供具有蚀刻玻璃状表面的聚合物基材的方法。 此外，本发明涉及使用这种聚合物基材制造芯片的套件。 此外，本发明涉及具有玻璃状表面的聚合物基材，特别是用于制造芯片的蚀刻玻璃状表面的用途。