Flexible wiring boards and processes for producing flexible wiring board
    132.
    发明申请
    Flexible wiring boards and processes for producing flexible wiring board 失效
    灵活的布线板和生产柔性布线板的工艺

    公开(公告)号:US20020011348A1

    公开(公告)日:2002-01-31

    申请号:US09912492

    申请日:2001-07-26

    Abstract: Flexible wiring boards showing a small electrical resistance and yet having a small width. The flexible wiring board according to the invention has a first wiring film and a second wiring film. Since the first wiring film has a larger thickness than the second wiring film, the sectional area and electrical resistance of the first wiring film can be enlarged because of the larger film thickness even in a case where the first and second wiring films have almost the same width. Therefore, a high current can flow through the first wiring film, though the wiring film has a small width. As a result, a high density of the flexible wiring board can be easily achieved.

    Abstract translation: 灵活的布线板显示出小的电阻并且具有小的宽度。 根据本发明的柔性布线板具有第一布线膜和第二布线膜。 由于第一布线膜的厚度大于第二布线膜的厚度,所以即使在第一布线膜和第二布线膜几乎相同的情况下,由于较大的膜厚也能够扩大第一布线膜的截面积和电阻 宽度。 因此,尽管布线膜的宽度小,但是高电流可以流过第一布线膜。 结果,可以容易地实现柔性布线板的高密度化。

    Methods for production of patterned calcined inorganic film
    133.
    发明授权
    Methods for production of patterned calcined inorganic film 有权
    生产图案化煅烧无机膜的方法

    公开(公告)号:US06312864B1

    公开(公告)日:2001-11-06

    申请号:US09557089

    申请日:2000-04-21

    Abstract: Disclosed is a method for producing a patterned calcined inorganic film such as an electroconducting or insulating (non-conductive) film, particularly a plasma display panel, embracing a calcining step. To produce a patterned calcined inorganic film without inducing warpage, shrinkage of line width, or breakage of patterned lines, a patterned film formed on a substrate with a composition containing a heat decomposable binder and particles of an inorganic material is covered, prior to the calcining step, with a coating film of a heat decomposable resin composition capable of hardening or drying at a temperature lower than the temperature at which the heat decomposable binder is thermally decomposed and further capable of being burned off below the highest temperature of the calcining profile and thereafter the calcining step is performed.

    Abstract translation: 公开了一种制造图案化煅烧无机膜的方法,例如导电或绝缘(非导电)膜,特别是包括煅烧步骤的等离子体显示面板。 为了产生图案化的煅烧无机膜而不引起翘曲,线宽的收缩或图案线的断裂,在煅烧之前覆盖在具有含有可热分解粘合剂和无机材料的颗粒的组合物的基材上形成的图案化膜 使用能够在比可热分解粘合剂热分解的温度低的温度下硬化或干燥的可热分解树脂组合物的涂膜,并且可以在煅烧曲线的最高温度之下进一步燃烧 进行煅烧步骤。

    Roughening of metal surfaces
    135.
    发明授权
    Roughening of metal surfaces 失效
    金属表面粗化

    公开(公告)号:US5705082A

    公开(公告)日:1998-01-06

    申请号:US378525

    申请日:1995-01-26

    Applicant: David Hinson

    Inventor: David Hinson

    Abstract: A process for roughening a metal surface is provided comprising applying a coating to the metal surface wherein the coating is a temporary barrier to an etchant attacking the metal surface and the coating is susceptible to the etchant gradually removing the coating, and then etching the coated metal surface with an aqueous bath containing the etchant effective to produce a roughened metal surface.

    Abstract translation: 提供了一种使金属表面粗糙化的方法,包括将涂层涂覆到金属表面上,其中涂层是临时阻挡侵蚀金属表面的蚀刻剂,并且涂层易于蚀刻剂逐渐去除涂层,然后蚀刻涂覆的金属 具有含有蚀刻剂的水浴的表面有效地产生粗糙的金属表面。

    Process for forming solder lands in a printed wiring board manufacturing
method
    139.
    发明授权
    Process for forming solder lands in a printed wiring board manufacturing method 失效
    用于在印刷线路板制造方法中形成焊盘的工艺

    公开(公告)号:US5090120A

    公开(公告)日:1992-02-25

    申请号:US488632

    申请日:1990-03-05

    Inventor: Masuo Matsumoto

    Abstract: A process of forming solder lands in a printed wiring board manufacturing method is disclosed. The process comprises a step of forming a wiring circuit of a required pattern by a copper foil provided on an electrical insulating sheet, a step of forming required solder resists on the wiring circuit, a preprinting step for leveling the surface of the wiring circuit and a step of printing required solder resist on the wiring circuit.

    Abstract translation: 公开了一种在印刷线路板制造方法中形成焊盘的工艺。 该方法包括通过设置在电绝缘片上的铜箔形成所需图案的布线电路的步骤,在布线电路上形成所需的阻焊剂的步骤,用于使布线电路的表面平整的预打印步骤和 在布线电路上印刷所需的阻焊剂的步骤。

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