公开(公告)号：US06387205B1

公开(公告)日：2002-05-14

申请号：US09489724

申请日：2000-01-24

Applicant: Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

Inventor： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

IPC: B32B3126

CPC classification number: C08J3/243 ,  B29B15/125 ,  B29C70/08 ,  B29C70/086 ,  B29C70/088 ,  B29C70/22 ,  B29C70/543 ,  B29C2791/001 ,  B29K2063/00 ,  B29K2101/10 ,  B29K2105/0809 ,  B29K2105/24 ,  B29K2105/243 ,  B29K2105/256 ,  B29K2705/00 ,  B29L2009/00 ,  B29L2031/3425 ,  B32B15/14 ,  B32B27/04 ,  B32B27/38 ,  B32B37/0038 ,  B32B2305/18 ,  B32B2311/12 ,  B32B2457/08 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C03C25/50 ,  C08J3/244 ,  C08J3/245 ,  C08J5/04 ,  C08J5/24 ,  C08J2363/00 ,  D06N3/0022 ,  D06N2205/20 ,  H01L23/145 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/2857 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2025 ,  Y10T442/2041 ,  Y10T442/2049 ,  Y10T442/2057 ,  Y10T442/2098 ,  H01L2924/00

Abstract: A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaining at least some of the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to between about 70% and 90% of full cure. The coated fiberglass with partially cured resin thereon is then given a second coating of either the same or different thermosetting resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating past 80% full cure and results in an impregnated fiberglass cloth structure for use as sticker sheets. During lamination, the first coating acts like an impenetrable insulating sheet, preventing resin displacement and, therefore, preventing glass fiber contact with the conductive planes. The second coating is fluid enough to fill in spaces in the planes and to form the adhesive bond to cores and conductive layers. The structure reduces the tendency of the resin to flake and produce dust during subsequent processing operations.

Abstract translation: 提供了一种用热固性树脂涂布布尤其是玻璃纤维片并得到结构的方法。 涂层分两步进行。 在第一步骤中，玻璃纤维的基本上所有的股线都涂覆有树脂/溶剂混合物，同时保持至少一些间隙或开口基本上不含溶剂混合物。 然后将该第一涂层部分固化至完全固化的约70％至90％之间。 然后将其上具有部分固化的树脂的涂覆的玻璃纤维给予相同或不同的热固性树脂混合物的第二涂层，所述热固性树脂混合物涂覆第一涂层并填充纤维之间的间隙。 然后将该第二涂层部分固化，这使得第一涂层的固化达到80％全固化，并且导致浸渍的玻璃纤维布结构用作贴纸。 在层压期间，第一涂层的作用类似于不可渗透的绝缘片，防止树脂移位，因此防止玻璃纤维与导电平面接触。 第二涂层是足够流体以填充平面中的空间并形成与芯和导电层的粘合剂粘合剂。 该结构降低了在随后的加工操作期间树脂剥落并产生灰尘的倾向。

公开(公告)号：US20020011348A1

公开(公告)日：2002-01-31

申请号：US09912492

申请日：2001-07-26

Applicant: SONY CHEMICALS CORP.

Inventor： Masanori Takeuchi

IPC: H05K001/00

CPC classification number: H05K3/4617 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K3/002 ,  H05K3/06 ,  H05K3/202 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Flexible wiring boards showing a small electrical resistance and yet having a small width. The flexible wiring board according to the invention has a first wiring film and a second wiring film. Since the first wiring film has a larger thickness than the second wiring film, the sectional area and electrical resistance of the first wiring film can be enlarged because of the larger film thickness even in a case where the first and second wiring films have almost the same width. Therefore, a high current can flow through the first wiring film, though the wiring film has a small width. As a result, a high density of the flexible wiring board can be easily achieved.

Abstract translation: 灵活的布线板显示出小的电阻并且具有小的宽度。 根据本发明的柔性布线板具有第一布线膜和第二布线膜。 由于第一布线膜的厚度大于第二布线膜的厚度，所以即使在第一布线膜和第二布线膜几乎相同的情况下，由于较大的膜厚也能够扩大第一布线膜的截面积和电阻 宽度。 因此，尽管布线膜的宽度小，但是高电流可以流过第一布线膜。 结果，可以容易地实现柔性布线板的高密度化。

公开(公告)号：US06312864B1

公开(公告)日：2001-11-06

申请号：US09557089

申请日：2000-04-21

Applicant: Hiroyuki Tokai ,  Kazunobu Fukushima ,  Osamu Kawana ,  Nobuyuki Suzuki ,  Hideaki Kojima ,  Tsuyoshi Mitani ,  Kouichi Takagi

Inventor： Hiroyuki Tokai ,  Kazunobu Fukushima ,  Osamu Kawana ,  Nobuyuki Suzuki ,  Hideaki Kojima ,  Tsuyoshi Mitani ,  Kouichi Takagi

IPC: H01J924

CPC classification number: B32B38/10 ,  H01J9/02 ,  H01J2211/38 ,  H01J2217/49207 ,  H05K1/092 ,  H05K3/02 ,  H05K3/1291 ,  H05K2201/0166 ,  H05K2203/0264 ,  H05K2203/0514 ,  H05K2203/1126

Abstract: Disclosed is a method for producing a patterned calcined inorganic film such as an electroconducting or insulating (non-conductive) film, particularly a plasma display panel, embracing a calcining step. To produce a patterned calcined inorganic film without inducing warpage, shrinkage of line width, or breakage of patterned lines, a patterned film formed on a substrate with a composition containing a heat decomposable binder and particles of an inorganic material is covered, prior to the calcining step, with a coating film of a heat decomposable resin composition capable of hardening or drying at a temperature lower than the temperature at which the heat decomposable binder is thermally decomposed and further capable of being burned off below the highest temperature of the calcining profile and thereafter the calcining step is performed.

Abstract translation: 公开了一种制造图案化煅烧无机膜的方法，例如导电或绝缘（非导电）膜，特别是包括煅烧步骤的等离子体显示面板。 为了产生图案化的煅烧无机膜而不引起翘曲，线宽的收缩或图案线的断裂，在煅烧之前覆盖在具有含有可热分解粘合剂和无机材料的颗粒的组合物的基材上形成的图案化膜 使用能够在比可热分解粘合剂热分解的温度低的温度下硬化或干燥的可热分解树脂组合物的涂膜，并且可以在煅烧曲线的最高温度之下进一步燃烧 进行煅烧步骤。

公开(公告)号：US6071559A

公开(公告)日：2000-06-06

申请号：US274666

申请日：1999-03-23

Applicant: Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

Inventor： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

IPC: B29B15/12 ,  B29C70/08 ,  B29C70/22 ,  B29C70/54 ,  B32B15/14 ,  B32B27/04 ,  B32B27/38 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C03C25/50 ,  C08J3/24 ,  C08J5/04 ,  C08J5/24 ,  D06N7/00 ,  H01L23/14 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02 ,  B32B3/00

CPC classification number: C08J3/243 ,  B29C70/08 ,  B29C70/086 ,  B29C70/088 ,  B29C70/22 ,  B29C70/543 ,  B32B15/14 ,  B32B27/04 ,  B32B27/38 ,  B32B37/0038 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C03C25/50 ,  C08J3/244 ,  C08J3/245 ,  C08J5/04 ,  C08J5/24 ,  D06N3/0022 ,  H01L23/145 ,  H01L23/49894 ,  H05K1/0366 ,  B29B15/125 ,  B29C2791/001 ,  B29K2063/00 ,  B29K2101/10 ,  B29K2105/0809 ,  B29K2105/24 ,  B29K2105/243 ,  B29K2105/256 ,  B29K2705/00 ,  B29L2009/00 ,  B29L2031/3425 ,  B32B2305/18 ,  B32B2311/12 ,  B32B2457/08 ,  C08J2363/00 ,  D06N2205/20 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  H05K3/022 ,  Y10S428/901 ,  Y10T428/2857 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2025 ,  Y10T442/2041 ,  Y10T442/2049 ,  Y10T442/2057 ,  Y10T442/2098

Abstract: A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaining at least some of the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to between about 70% and 90% of full cure. The coated fiberglass with partially cured resin thereon is then given a second coating of either the same or different thermosetting resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating past 80% full cure and results in an impregnated fiberglass cloth structure for use as sticker sheets. During lamination, the first coating acts like an impenetrable insulating sheet, preventing resin displacement and, therefore, preventing glass fiber contact with the conductive planes. The second coating is fluid enough to fill in spaces in the planes and to form the adhesive bond to cores and conductive layers. The structure reduces the tendency of the resin to flake and produce dust during subsequent processing operations.

公开(公告)号：US5705082A

公开(公告)日：1998-01-06

申请号：US378525

申请日：1995-01-26

Applicant: David Hinson

Inventor： David Hinson

IPC: C23F1/02 ,  C23F1/26 ,  H05K3/38 ,  C23F1/00

CPC classification number: H05K3/383 ,  C23F1/02 ,  C23F1/26 ,  H05K2201/0116 ,  H05K2201/0166 ,  H05K2201/0373 ,  H05K2203/0769

Abstract: A process for roughening a metal surface is provided comprising applying a coating to the metal surface wherein the coating is a temporary barrier to an etchant attacking the metal surface and the coating is susceptible to the etchant gradually removing the coating, and then etching the coated metal surface with an aqueous bath containing the etchant effective to produce a roughened metal surface.

Abstract translation: 提供了一种使金属表面粗糙化的方法，包括将涂层涂覆到金属表面上，其中涂层是临时阻挡侵蚀金属表面的蚀刻剂，并且涂层易于蚀刻剂逐渐去除涂层，然后蚀刻涂覆的金属 具有含有蚀刻剂的水浴的表面有效地产生粗糙的金属表面。

公开(公告)号：US5302547A

公开(公告)日：1994-04-12

申请号：US14609

申请日：1993-02-08

Applicant: Robert J. Wojnarowski ,  Herbert S. Cole ,  Richard J. Saia ,  Thomas B. Gorczyca ,  Ernest W. Balch

Inventor： Robert J. Wojnarowski ,  Herbert S. Cole ,  Richard J. Saia ,  Thomas B. Gorczyca ,  Ernest W. Balch

IPC: H01L23/12 ,  H01L21/268 ,  H01L21/302 ,  H01L21/311 ,  H01L21/48 ,  H01L21/768 ,  H01L23/538 ,  H05K1/03 ,  H05K3/00 ,  H01L21/283 ,  H01L21/306

CPC classification number: H05K3/0041 ,  H01L21/31138 ,  H01L21/486 ,  H01L21/76802 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1147 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K1/036 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K3/0032 ,  Y10S438/94 ,  Y10S438/945

Abstract: A differentiable ablation approach to patterning dielectrics which are not of the same absorbance uses an absorbant dielectric at a specified laser wavelength over a non-absorbant dielectric at that wavelength. The absorbant dielectric may be laser-patterned and become an integral mask enabling plasma etching of the underlying non-absorbant dielectric. If the patterning of the absorbant dielectric involves vias, polymer ridges formed around via surfaces during laser patterning may be removed at the same time the underlying non-absorbant dielectric is etched using a transparent, oxygen plasma resistant mask. Alternatively, an inert mask may be used instead of the absorbant dielectric to allow plasma etching of the non-absorbant dielectric.

Abstract translation: 对于不相同吸光度的电介质图案的可微分消融方法，在该波长处的非吸收性电介质上使用指定的激光波长的吸收介质。 吸收介质可以是激光图案化的，并且成为能够对下面的非吸收性电介质进行等离子体蚀刻的整体掩模。 如果吸收介质的图案化涉及通孔，则可以在激光图案化期间在通孔表面周围形成的聚合物脊在同时使用透明的耐氧等离子体掩模蚀刻下面的非吸收性电介质。 或者，可以使用惰性掩模来代替吸收介质，以允许对非吸收性介质的等离子体蚀刻。

公开(公告)号：US5225315A

公开(公告)日：1993-07-06

申请号：US762416

申请日：1991-09-19

Applicant: Gary V. Grosclaude ,  Andrew G. Bachmann

Inventor： Gary V. Grosclaude ,  Andrew G. Bachmann

IPC: B05D1/32 ,  B23K35/22 ,  C09D4/00 ,  C09D5/00 ,  C09D5/20 ,  C09D7/12 ,  G03F7/027 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/305 ,  B05D1/327 ,  B23K35/224 ,  C09D4/00 ,  G03F7/027 ,  H05K3/0076 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/0769 ,  H05K2203/0773 ,  H05K2203/0786 ,  H05K3/3452 ,  Y02P70/613

Abstract: A water-soluble coating or other deposit is produced from a formulation that is comprised of a curable liquid substance and a dispersed particulate effervescing agent. The formulation is particularly useful as a solder resist in the manufacture of PCBs, and the preferred composition contains n-vinyl-2-pyrrolidone, N,N-dimethylacrylamide, and polyvinylpyrrolidone.

Abstract translation: 由可固化液体物质和分散颗粒起泡剂组成的制剂产生水溶性涂层或其它沉积物。 该制剂在PCBs制造中作为阻焊剂特别有用，优选的组合物含有N-乙烯基-2-吡咯烷酮，N，N-二甲基丙烯酰胺和聚乙烯吡咯烷酮。

公开(公告)号：US5219787A

公开(公告)日：1993-06-15

申请号：US840428

申请日：1992-02-24

Applicant: David H. Carey ,  Douglass A. Pietila ,  David M. Sigmond

Inventor： David H. Carey ,  Douglass A. Pietila ,  David M. Sigmond

IPC: H01L21/311 ,  H01L21/48 ,  H01L21/768 ,  H01L23/485 ,  H05K3/00 ,  H05K3/10 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L21/76808 ,  H01L21/31144 ,  H01L21/486 ,  H01L21/76804 ,  H01L23/485 ,  H05K3/0032 ,  H05K3/0041 ,  H05K3/005 ,  H01L2221/1026 ,  H01L2221/1031 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/0166 ,  H05K2201/09563 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/0574 ,  H05K2203/107 ,  H05K2203/1189 ,  H05K3/0023 ,  H05K3/0035 ,  H05K3/107 ,  H05K3/388 ,  H05K3/4076 ,  H05K3/422 ,  H05K3/4644 ,  H05K3/4661

Abstract: Trenching techniques for forming a channel partially through and a via completely through the insulating layer of a substrate are disclosed. With additional steps the channel can form an electrically conductive line, an electrode of an integrated capacitor, or an optical waveguide.

Abstract translation: 公开了用于通过完全穿过衬底的绝缘层形成通道和通孔的沟槽的沟槽技术。 通过附加步骤，通道可以形成导电线，集成电容器的电极或光波导。

公开(公告)号：US5090120A

公开(公告)日：1992-02-25

申请号：US488632

申请日：1990-03-05

Applicant: Masuo Matsumoto

Inventor： Masuo Matsumoto

IPC: H05K3/28

CPC classification number: H05K3/28 ,  H05K2201/0166 ,  H05K2201/09881 ,  H05K2203/0588 ,  Y10T29/49155

Abstract: A process of forming solder lands in a printed wiring board manufacturing method is disclosed. The process comprises a step of forming a wiring circuit of a required pattern by a copper foil provided on an electrical insulating sheet, a step of forming required solder resists on the wiring circuit, a preprinting step for leveling the surface of the wiring circuit and a step of printing required solder resist on the wiring circuit.

Abstract translation: 公开了一种在印刷线路板制造方法中形成焊盘的工艺。 该方法包括通过设置在电绝缘片上的铜箔形成所需图案的布线电路的步骤，在布线电路上形成所需的阻焊剂的步骤，用于使布线电路的表面平整的预打印步骤和 在布线电路上印刷所需的阻焊剂的步骤。

公开(公告)号：US5039472A

公开(公告)日：1991-08-13

申请号：US343745

申请日：1989-04-27

Applicant: George A. Salensky ,  Thomas S. Thoman

Inventor： George A. Salensky ,  Thomas S. Thoman

IPC: C08J5/18 ,  C08J7/02 ,  C08J7/04 ,  C08L71/00 ,  C09J5/02 ,  H05K1/09 ,  H05K3/20 ,  H05K3/28 ,  H05K3/34 ,  H05K3/38

CPC classification number: C08L71/00 ,  C08J7/02 ,  H05K3/207 ,  H05K3/3452 ,  H05K3/381 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2203/0537 ,  H05K2203/0783 ,  H05K3/28

Abstract: This invention relates to an adhesion promoting composition and method for its use for promoting adhesion of printed circuits on thermoplastic substrates. The composition includes isopropanol with either methylene chloride or resorcinol. An added ingredient includes polycyclohexanone. The preferred substrate is polyarylsulfone.

Abstract translation: 本发明涉及粘合促进组合物及其用于促进印刷电路在热塑性基材上的粘附的方法。 该组合物包括异丙醇与二氯甲烷或间苯二酚。 添加成分包括聚环己酮。 优选的底物是聚芳基砜。