公开(公告)号：US20160068964A1

公开(公告)日：2016-03-10

申请号：US14943861

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qing GONG ,  Wei ZHOU ,  Weifeng MIAO

IPC: C23C18/16 ,  C23C18/38 ,  C23C18/28 ,  C09D11/03 ,  C08K3/22

CPC classification number: C23C18/1608 ,  B29C37/0025 ,  B29C2035/0838 ,  B29C2035/0872 ,  B29C2035/0877 ,  C01G19/006 ,  C01G19/02 ,  C01G30/002 ,  C01G31/00 ,  C01G39/00 ,  C01P2002/50 ,  C01P2002/52 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2255 ,  C09D11/03 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/285 ,  C23C18/38 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %.

Abstract translation: 本公开的实施方案涉及掺杂的氧化锡。 掺杂的氧化锡包括氧化锡和掺杂元素的至少一种氧化物。 掺杂元素包括钒和钼中的至少一种。 掺杂的氧化锡包括氧化锡的量为90mol％至99mol％，并且至少一种氧化物的量为1mol％至10mol％。

公开(公告)号：US09208931B2

公开(公告)日：2015-12-08

申请号：US12638360

申请日：2009-12-15

Applicant: Lex Kosowsky ,  Robert Fleming ,  Junjun Wu ,  Pragnya Saraf ,  Thangamani Ranganathan

Inventor： Lex Kosowsky ,  Robert Fleming ,  Junjun Wu ,  Pragnya Saraf ,  Thangamani Ranganathan

IPC: H01B1/22 ,  H01C7/108 ,  H01B1/20 ,  H01B1/24 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01C7/108 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0218 ,  H05K2201/0738 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A composition of voltage switchable dielectric (VSD) material that comprises a concentration of core shelled particles that individually comprise a conductor core and a conductor shell, so as to form a conductor-on-conductor core shell particle constituent for the VSD material.

Abstract translation: 可变压电介质（VSD）材料的组合物，其包含单独包含导体芯和导体壳的芯壳颗粒的浓度，以形成用于VSD材料的导体导体芯壳颗粒成分。

公开(公告)号：US20150107765A1

公开(公告)日：2015-04-23

申请号：US14512535

申请日：2014-10-13

Applicant: SunRay Scientific LLC

Inventor： S. Kumar Khanna

IPC: C09J9/02 ,  H05K3/30 ,  H05K13/04 ,  C09J9/00

CPC classification number: C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/01 ,  C09J9/00 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/75253 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/8393 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/2064 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

Abstract translation: 公开了各向异性导电粘合剂（ACA）和相关方法的说明性实施方案。 在一个说明性实施方案中，ACA可以包括可使用UV光固化的粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层的铁磁材料。 当ACA在经受磁场后用UV光固化时，导电材料可以形成导电和隔离的平行路径。

公开(公告)号：US20150024120A1

公开(公告)日：2015-01-22

申请号：US14359958

申请日：2012-11-26

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida

IPC: H01B13/00 ,  C09D11/52

CPC classification number: H01B13/003 ,  C09D11/037 ,  C09D11/52 ,  C09D17/00 ,  H01B1/22 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0218 ,  H05K2201/0257

Abstract: Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.

Abstract translation: 提供一种导电图案形成方法和通过光照射或微波加热形成导电图案的组合物，其能够增加导电图案的导电性。 通过制备形成导电图案的组合物形成导电图案，所述组合物包括在其整个或部分表面上各自具有氧化铜薄膜的铜颗粒，氧化铜颗粒，还原剂如多元醇， 羧酸或聚亚烷基二醇，和粘合剂树脂; 使用该用于形成导电图案的组合物在基板上形成具有任何选定形状的印刷图案; 并对印刷图案进行光照射或微波加热以产生铜烧结体。

公开(公告)号：US20140183733A1

公开(公告)日：2014-07-03

申请号：US14082339

申请日：2013-11-18

Applicant: Yong Cheol CHU ,  Hyun Kyu LEE ,  Jung Ug KWAK ,  Seung Jin LEE ,  Sang Ho JEON ,  Yong Sik CHOI

Inventor： Yong Cheol CHU ,  Hyun Kyu LEE ,  Jung Ug KWAK ,  Seung Jin LEE ,  Sang Ho JEON ,  Yong Sik CHOI

IPC: B23K35/02 ,  H01L23/34 ,  H01L23/00

CPC classification number: B23K35/0244 ,  B23K35/282 ,  B23K35/286 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K2101/36 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/81447 ,  H01L2924/3656 ,  H05K3/3478 ,  H05K2201/0218 ,  H05K2203/041 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01012 ,  H01L2924/01013

Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 μm, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.

Abstract translation: 公开了一种具有改善导热性的金属芯焊球，包括直径为40〜600μm的金属芯，形成在金属芯的外表面上的第一镀层和形成在金属芯的外表面上的第二镀层 第一镀层。

公开(公告)号：US20140134350A1

公开(公告)日：2014-05-15

申请号：US14157450

申请日：2014-01-16

Applicant: Lockheed Martin Corporation

Inventor： Alfred A. Zinn

IPC: C23C24/08

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract translation: 组合物可以具有直径为20纳米或更小并具有小于约220℃的熔化温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

公开(公告)号：US08383016B2

公开(公告)日：2013-02-26

申请号：US13416534

申请日：2012-03-09

Applicant: Nana Enomoto ,  Kunihiko Akai

Inventor： Nana Enomoto ,  Kunihiko Akai

IPC: H01B1/02 ,  H01B1/22 ,  B05D7/00 ,  B32B5/16

CPC classification number: H01B1/02 ,  H05K3/321 ,  H05K2201/0218 ,  Y10T428/2991

Abstract: Conductive fine particles have core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface. The phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt % of the entire region A. The phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt % of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt % or greater.

Abstract translation: 导电性微粒具有涂覆有含镍和磷的金属镀覆膜层的核心颗粒表面和包含钯层作为外表面的多层导电层。 金属镀膜层的区域A中的磷含量为不大于核心颗粒表面的整个金属镀覆膜层的厚度的20％以下的距离，为7-15重量％ 在金属镀覆膜层的区域B中的磷含量，距金属镀层表面的整个金属镀膜层的厚度不大于10％的距离 钯层侧的涂膜层为整个区域B的0.1〜3重量％，整个金属镀膜层的磷含量为7重量％以上。

公开(公告)号：US20120106111A1

公开(公告)日：2012-05-03

申请号：US12916569

申请日：2010-10-31

Applicant: JOSEPH MAZZOCHETTE ,  Sarwan Kumar Khanna

Inventor： JOSEPH MAZZOCHETTE ,  Sarwan Kumar Khanna

IPC: H05K7/00 ,  H01F1/00 ,  H01F1/26 ,  C09K5/00 ,  H01F1/04 ,  B82Y99/00 ,  B82Y30/00

CPC classification number: H05K3/323 ,  B82Y30/00 ,  H01F1/26 ,  H01F1/37 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29388 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/83887 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/3011 ,  H05K2201/0218 ,  H05K2201/0266 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A composition of matter comprising a plurality of nanoparticles in a non-conductive binder, wherein, the type of nanoparticles form isolated parallel electrically and thermally conductive columns when cured in the presence of the magnetic field. Also wherein the plurality of nanoparticles are Paramagnetic or Ferromagnetic magnetic. Wherein the nano particles are coated, and of a particular shape. Wherein the particles are selected from the group consisting of; Al, Pt, Cr, Mn, crown glass, Fe, Ni, and Co, Ni—Fe/SiO2, Co/SiO2, Fe—Co/SiO2, Fe/nickel-ferrite, Ni—Zn-ferrite/SiO2, Fe—Ni/polymer, Co/polymer, ferrites, iron oxide and any combination and alloy thereof, and the Binder selected from the group consisting of; epoxies, polyurethanes, polyimides, polymeric materials, silicones, adhesives, acrylates, the UV curable modifier and any combination thereof.

Abstract translation: 一种在非导电粘合剂中包含多个纳米颗粒的物质组合物，其中当在磁场存在下固化时，纳米颗粒的类型形成隔离的平行的导电和导热柱。 而且其中多个纳米颗粒是顺磁性或铁磁性的。 其中纳米颗粒被涂覆并且具有特定形状。 其中颗粒选自： Al，Pt，Cr，Mn，冠状玻璃，Fe，Ni和Co，Ni-Fe / SiO2，Co / SiO2，Fe-Co / SiO2，Fe /镍铁氧体，Ni-Zn-铁素体/ Ni /聚合物，Co /聚合物，铁氧体，氧化铁及其任何组合和合金，以及选自以下的粘合剂： 环氧树脂，聚氨酯，聚酰亚胺，聚合物材料，硅酮，粘合剂，丙烯酸酯，UV可固化改性剂及其任何组合。

公开(公告)号：US20120090882A1

公开(公告)日：2012-04-19

申请号：US13332555

申请日：2011-12-21

Applicant: Tomoyuki ISHIMATSU ,  Yuta Araki

Inventor： Tomoyuki ISHIMATSU ,  Yuta Araki

IPC: H05K1/09 ,  B32B3/00 ,  H01B13/00 ,  B22F1/02

CPC classification number: H05K3/323 ,  B22F1/02 ,  C22C5/02 ,  C22C19/03 ,  H01B1/02 ,  H05K2201/0218 ,  Y10T428/12181 ,  Y10T428/12944 ,  Y10T428/256 ,  Y10T428/287 ,  Y10T428/2991

Abstract: To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.

Abstract translation: 提供导电颗粒，其包含：核心颗粒; 以及形成在所述芯粒子的表面上的导电层，其中所述芯粒子为镍粒子，所述导电层为表面的磷浓度为10质量％以下的镀镍层， 导电层的平均厚度为1nm〜10nm。

公开(公告)号：US08089151B2

公开(公告)日：2012-01-03

申请号：US11500018

申请日：2006-08-07

Applicant: Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

Inventor： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

IPC: H01L23/48

CPC classification number: H05K3/323 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29444 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K2201/0218 ,  H05K2201/0233 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

Abstract translation: 本发明的实施方案包括导电颗粒，其包含在聚合物树脂颗粒的表面上形成的具有小于约1.5重量％的磷含量的导电镍/金（Ni / Au）复合金属层。 也包括其形成方法。 具有小于约1.5重量％的磷的Ni / Au复合金属层的导电颗粒可以具有相对高的导电性，同时提供Ni / Au金属层对聚合物树脂颗粒的相对良好的粘附。 本发明的其它实施方案提供了包含根据本发明实施方案的导电颗粒的各向异性粘合剂组合物。