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131.发明公开ELECTRODE STRUCTURE, WIRING BODY, ADHESIVE CONNECTION STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING SAME 审中-公开电极的结构，布线元件接合连接结构，电子器件及其制造方法
公开(公告)号：EP2437582A1
公开(公告)日：2012-04-04
申请号：EP10780370.2
申请日：2010-04-13
Inventor： YAMAMOTO, Masamichi , NAKATSUGI, Kyouichirou , YAMAGUCHI, Takashi , KAWAKAMI, Shigeki , KIMURA, Michihiro
CPC classification number: H05K3/282 , H01L2924/0002 , H05K1/148 , H05K3/305 , H05K3/323 , H05K3/361 , H05K3/363 , H05K2201/0248 , H05K2201/0373 , H05K2201/083 , H05K2201/10977 , H05K2203/104 , Y10T29/49213 , H01L2924/00
Abstract: There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.
Abstract translation: 有通过被键合到其上的主要成分为热固性树脂的各向异性导电粘接剂设置在电极结构，以电连接到连接导体，包括对电极使用于粘合剂连接的电极结构，所述电极被布置在基体材料 ，并在有机薄膜用作到被配置为覆盖所述电极的表面，使用于粘合剂连接，其中，所述有机膜具有比要进行热处理的最高温度更高的分解温度氧化防止电影。 一种布线体和设置在一连接使用结构粘合剂是如此。
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公开(公告)号：EP2422589A2
公开(公告)日：2012-02-29
申请号：EP09755896.9
申请日：2009-11-17
Applicant: AGC Glass Europe
Inventor： LUIJCKX, Antoine
CPC classification number: H05K3/325 , B32B17/10018 , B32B17/10055 , B32B17/10761 , H05K1/0203 , H05K1/0306 , H05K1/183 , H05K2201/0108 , H05K2201/083 , H05K2201/10106 , H05K2201/10553
Abstract: The invention relates to a lighting electronic structure, comprising ♦ a substrate (7) carrying at least an electrically conductive path (2a, 2b) on a first side, wherein at least a portion of said substrate is transparent or translucent, ♦ at least one module (11) comprising an electronic component (12), said electronic component being electrically connected to one of said electrically conductive path, wherein each of said module has its electronic component facing a transparent or translucent portion of said substrate, wherein at least one of said modules is a light emitting module, ♦ a thermally conductive cover layer for dissipating heat generated by said electronic component, said thermally conductive cover layer facing said first side of said substrate (7), said thermally conductive cover layer being in thermal contact with said electronic components (12) of said module, and ♦ an electrically insulating spacer separating said electrically conductive path from said thermally conductive cover layer; the invention further relates to the use of such an electronic structure, such a module (11), such a panel (1) and methods for producing such an electronic structure, panel (1) and module (11).
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公开(公告)号：EP2272308A1
公开(公告)日：2011-01-12
申请号：EP09738510.8
申请日：2009-04-22
Applicant: Koninklijke Philips Electronics N.V.
Inventor： VAN PIETERSON, Liesbeth , BHATTACHARYA, Rabin , VAN OS, Koen
CPC classification number: H05K1/0269 , H05K1/0266 , H05K1/038 , H05K1/189 , H05K3/303 , H05K2201/0281 , H05K2201/029 , H05K2201/083 , H05K2201/09918 , H05K2201/10106 , H05K2203/166 , Y02P70/613
Abstract: The invention relates to a textile (1) for mounting a first electronic component at a first designated position (121) on the textile, and for mounting a second electronic component at a second designated position (122) on the textile, the textile comprising a first marker pattern (111, 112) associated with the first designated position, and a second marker pattern (113, 114) associated with the second designated position. With the textile according to the invention, an electronic textile can be reliably manufactured using conventional equipment known from the electronics assembly industry, such as a pick-and-plaσe apparatus, whereby the electronic components are properly provided at their respective designated positions on the textile.
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公开(公告)号：EP1973119A3
公开(公告)日：2009-12-30
申请号：EP07291508.5
申请日：2007-12-12
Applicant: Toray Saehan Inc.
Inventor： Sim, Chang-Hoon , Jun, Hae-Sang , Moon, Ki-Jeong
CPC classification number: H01B1/22 , H05K3/323 , H05K2201/083 , H05K2203/104
Abstract: The invention concerns an anisotropic conductive film used for adhering IC, e.g., LCD displays, etc. The conductive film is characterized by comprising a thermosetting adhesive, super-paramagnetic metal oxide nano-particles, and conductive particles, the super-paramagnetic metal oxide nano-particles and the conductive particles being dispersed in a thermosetting composition. With such a configuration in the invention, it is advantageous that low temperature curing is implemented by means of high frequencies and positions of particles can be controlled by means of a magnetic field in adhering IC, e.g., LCD displays, so that high connection reliability is achieved for connection electrodes of fine pitches.
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135.发明公开Apparatus and method for arranging magnetic solder balls 审中-公开Vorrichtung und Verfahren zur Anordnung magnetischerLötkugeln
公开(公告)号：EP2019422A2
公开(公告)日：2009-01-28
申请号：EP08161117.0
申请日：2008-07-24
Applicant: Shinko Electric Industries Co., Ltd.
Inventor： Sakaguchi, Hideaki , Iida, Kiyoaki
IPC: H01L21/60 , H01L23/485 , B23K3/06
CPC classification number: H01L24/742 , B23K3/0623 , B23K2201/36 , H01L21/4853 , H01L24/13 , H01L2224/05567 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/13147 , H01L2224/1319 , H01L2224/13561 , H01L2224/1358 , H01L2224/13582 , H01L2224/136 , H01L2224/13655 , H01L2224/81192 , H01L2924/00014 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/3025 , H05K3/3478 , H05K2201/083 , H05K2201/10234 , H05K2203/041 , H05K2203/0557 , H05K2203/104 , H01L2924/014 , H01L2224/05599
Abstract: An apparatus 100 for arranging magnetic solder balls 20 includes: a stage 102 for placing and fixing a substrate 10 thereon; a magnet 104 which is incorporated in the stage 102 and is movable in parallel with a lower surface of the placed and fixed substrate 10 so as to cause a magnetic force to act in an upward direction of the stage; and a mask 106 frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. Further, an apparatus for arranging magnetic solder 20 balls includes: a stage 102 for placing and fixing the substrate 10 thereon; a mask frame 106 capable of being positioned above the stage 102; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage (not shown). An arranging method using this arranging apparatus is also provided.
Abstract translation: 用于布置磁性焊球20的装置100包括：用于在其上放置和固定衬底10的平台102; 磁体104，其结合在载物台102中，并且能够与放置固定基板10的下表面平行移动，从而使磁力向载物台向上方移动; 以及能够定位在舞台上方的掩模106框架。 还提供了使用该布置装置的布置方法。 此外，用于布置磁性焊料20球的设备包括：用于在其上放置和固定衬底10的平台102; 能够定位在平台102上方的面罩框架106; 以及可在掩模框架上方移动并使磁力作用在台架（未示出）上的磁性发生器。 还提供了使用该布置装置的布置方法。
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Patent Agency Ranking136.发明公开
公开(公告)号：EP1807219A1
公开(公告)日：2007-07-18
申请号：EP05787693.0
申请日：2005-09-21
Applicant: ATOTECH Deutschland GmbH
Inventor： RICKERT, Christoph , KRESS, Jürgen , PROBST, Michel
IPC: B05D1/28
CPC classification number: H05K3/4626 , B05D1/24 , B05D1/28 , B05D3/0254 , B05D3/14 , B05D2252/02 , H05K2201/0358 , H05K2201/083 , H05K2203/105 , H05K2203/1355
Abstract: The invention relates to a process for the mixing and gentle transport and the transfer of powders to substrates wherein the powder particles are first charged by friction in the presence of magnetic particles and then transported by means of a fluidized bed and optionally one or more mixing rolls and then transferred and applied to a substrate by means of an electric field between a brush drum and a substrate drum carrying said substrate, characterized in that the mixing and the transport of the powder particles and the magnetic particles are carried out by means of a boiling bed.
Abstract translation: 公开的是用于混合和温和运输和粉末转移至基材的方法。
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公开(公告)号：EP1576205A1
公开(公告)日：2005-09-21
申请号：EP03780561.1
申请日：2003-12-23
Inventor： BRUNET, Magali , CONNELL, Andrew, Mark , MCCLOSKEY, Paul , O'DONNELL, Terence , O'REILLY, Stephen , O'MATHUNA, Sean Cian
CPC classification number: C23C26/00 , C23C18/1865 , C23C18/1879 , C25D1/12 , C25D15/00 , G11B5/3143 , H01F17/0006 , H01F27/2804 , H05K1/0219 , H05K1/0233 , H05K3/181 , H05K2201/0236 , H05K2201/083 , H05K2201/09809 , H05K2203/0723 , H05K2203/135
Abstract: An insulating layer (5) and a conductive seed layer (6) are applied to a substrate (1) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer (7) is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.
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138.发明公开
公开(公告)号：EP1465211A2
公开(公告)日：2004-10-06
申请号：EP04075966.4
申请日：2004-03-29
Applicant: Delphi Technologies, Inc.
Inventor： Schroeder, Thaddeus , Chang, Shih-Chia , Rodriguez, Lorenzo Guadalupe
CPC classification number: H05K1/165 , G01D5/145 , H01F41/0273 , H01F41/16 , H05K2201/083 , H05K2203/0568 , H05K2203/104 , Y10T428/12181 , Y10T428/21
Abstract: A process for forming magnetic target tracks for position and speed sensors. The tracks are formed from a paste comprising a magnetic powder material and a hardenable carrier. The tracks can be formed within trenches in a substrate or on the substrate surface.
Abstract translation: 一种用于形成用于位置和速度传感器的磁性目标轨道的过程。 轨迹由包含磁性粉末材料和可硬化载体的糊剂形成。 轨道可以形成在衬底或衬底表面上的沟槽内。
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139.发明授权
公开(公告)号：EP1360885B1
公开(公告)日：2004-06-16
申请号：EP02778172.3
申请日：2002-10-23
Applicant: Nolato Silikonteknik AB
Inventor： MATTSSON, Magnus , JACOBSSON, Mikael
CPC classification number: H05K3/284 , B29C70/62 , B29C70/882 , B29L2031/3061 , H01B1/22 , H05K1/0233 , H05K9/0015 , H05K2201/0215 , H05K2201/083 , Y10T29/49067
Abstract: A method for manufacturing an element (5) for electromagnetic shielding. The method is characterised by the steps of arranging, along a curve corresponding to the extension of the completed element (5), a viscous material (7) in the form of a bead (6), and orienting the particles (9) in the material (7) by applying a magnetic field (10) across said bead 86). The material (7) carries particles (9) with substantial electrical conductivity and also ferromagnetic and/or ferrimagnetic properties. The present invention also concerns a corresponding element for electromagnetic shielding, a device for electromagnetic shielding comprising such an element, use of such an element in a mobile phone and at a base station, and also a mobile phone and a base station comprising such an element.
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140.发明公开
公开(公告)号：EP1360885A1
公开(公告)日：2003-11-12
申请号：EP02778172.3
申请日：2002-10-23
Applicant: Nolato Silikonteknik AB
Inventor： MATTSSON, Magnus , JACOBSSON, Mikael
CPC classification number: H05K3/284 , B29C70/62 , B29C70/882 , B29L2031/3061 , H01B1/22 , H05K1/0233 , H05K9/0015 , H05K2201/0215 , H05K2201/083 , Y10T29/49067
Abstract: A method for manufacturing an element (5) for electromagnetic shielding. The method is characterised by the steps of arranging, along a curve corresponding to the extension of the completed element (5), a viscous material (7) in the form of a bead (6), and orienting the particles (9) in the material (7) by applying a magnetic field (10) across said bead 86). The material (7) carries particles (9) with substantial electrical conductivity and also ferromagnetic and/or ferrimagnetic properties. The present invention also concerns a corresponding element for electromagnetic shielding, a device for electromagnetic shielding comprising such an element, use of such an element in a mobile phone and at a base station, and also a mobile phone and a base station comprising such an element.
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