公开(公告)号：KR101075688B1

公开(公告)日：2011-10-21

申请号：KR1020100068569

申请日：2010-07-15

Applicant: 삼성전기주식회사

Inventor： 이승섭

IPC: H04N5/232 ,  G03B5/00

CPC classification number: H04N5/23287 ,  H01L27/1203 ,  H01L41/08 ,  H05K2201/09372 ,  H05K2201/10674 ,  H05K2203/049 ,  H05K2203/0548

Abstract: 본 발명은 광학식 손 떨림 보정장치에 관한 것으로, 기판; 상기 기판과 마주하며 상기 기판상에서 수평 가동되고, 상면에 이미지 센서를 실장한 테이블; 상기 기판상에 상기 테이블을 지지하는 지지부재; 상기 테이블과 상기 기판사이에 배치되며, 휨 변형에 의한 마찰력으로 상기 테이블을 가동시키는 스크래치 구동 어레이(Scratch Drive Array); 및 상기 스크래치 구동 어레이의 휨 변형을 발생시키는 압전소자;를 포함하는 광학식 손 떨림 보정장치 및 이의 제조 방법에 관한 것이다.

公开(公告)号：KR1020100051336A

公开(公告)日：2010-05-17

申请号：KR1020080110454

申请日：2008-11-07

Applicant: 에스케이하이닉스 주식회사

Inventor： 김기채 ,  김종현

IPC: H05K1/02

CPC classification number: H05K1/116 ,  H05K3/445 ,  H05K2201/09372

Abstract: PURPOSE: A printed circuit board is provided to reduce time and costs for designing new ball land map by varying the design of the ball land map through a control bar. CONSTITUTION: A printed circuit board(100) comprises a core layer(102), a support bar(118), and a control bar(116). A first circuit wiring and a second circuit wiring are formed in upper side and lower side of the core layer, respectively. The support bar has the cylindrical shape. The support bar is inserted into the penetration hole of the core layer. A first conductive pattern of the support bar is connected to the first circuit wiring. A control bar is rotatably inserted into the support bar. A second conductive pattern of the control bar is connected to the second circuit wiring.

Abstract translation: 目的：提供印刷电路板，以通过控制栏改变球地图的设计，减少设计新球地图的时间和成本。 构成：印刷电路板（100）包括芯层（102），支撑杆（118）和控制杆（116）。 分别在芯层的上侧和下侧形成第一电路布线和第二电路布线。 支撑杆具有圆柱形。 将支撑杆插入到芯层的穿透孔中。 支撑杆的第一导电图案连接到第一电路布线。 控制杆可旋转地插入到支撑杆中。 控制棒的第二导电图案连接到第二电路布线。

公开(公告)号：KR1020090120983A

公开(公告)日：2009-11-25

申请号：KR1020080047053

申请日：2008-05-21

Applicant: 디지털옵틱스 코포레이션

Inventor： 전영선

IPC: H04N5/225 ,  H01L27/146 ,  G03B17/00

CPC classification number: H04N5/2252 ,  B81B7/02 ,  G03B13/32 ,  H01L2924/0665 ,  H05K2201/05 ,  H05K2201/09372

Abstract: PURPOSE: A camera module in which MEMS actuator is applied is provided to flexibly cope with the movement of the lens unit by connecting the pad terminal of lens unit and PCB part through a flexible circuit part. CONSTITUTION: The camera module in which MEMS(MicroElectroMechanical System) actuator is applied includes the camera housing(110), lens unit, PCB part, and flexible circuit part. The lens unit(120) is arranged at the upper part of the camera housing. In the lens unit, the MEMSactuator(122) is included and the pad terminal is formed in one side. The PCB part(130) is arranged at the lower part of the camera housing. In the flexible circuit part(140), the pad terminal and PCB part is electrically connected.

Abstract translation: 目的：提供应用MEMS致动器的相机模块，以通过柔性电路部分连接透镜单元的焊盘端子和PCB部件来灵活应对透镜单元的移动。 构成：应用MEMS（MicroElectroMechanical System）致动器的相机模块包括相机外壳（110），镜头单元，PCB部件和柔性电路部件。 透镜单元（120）布置在照相机外壳的上部。 在透镜单元中，包括MEMS致动器（122），并且焊盘端子形成在一侧。 PCB部件（130）布置在照相机外壳的下部。 在柔性电路部分（140）中，焊盘端子和PCB部分电连接。

公开(公告)号：KR1020090102358A

公开(公告)日：2009-09-30

申请号：KR1020080027748

申请日：2008-03-26

Applicant: (주)캠톤

Inventor： 오형렬

IPC: H04N5/225

CPC classification number: H04N5/2251 ,  H05K5/0026 ,  H05K13/0023 ,  H05K2201/05 ,  H05K2201/09372

Abstract: PURPOSE: A camera module equipping a connector for a multimedia device and a manufacturing method thereof for increasing connecting efficiency are provided to reduce a production cost and increase the coupling efficiency. CONSTITUTION: A camera module equipped with a multimedia connector includes a connecting unit, a camera module(120) and a connector unit(130). The connection unit forms the connection pad to a plurality by the side in which the camera module of the circuit board is installed. The camera module is connected to the connection unit. The camera module forms the image sensor in the charge coupled device. The camera module forms the module PCB. The module PCB sends and receive an image and moving picture of the image sensor. The conduction film layer forms for the module PCB of the camera module by the connection unit of the circuit board.

Abstract translation: 目的：提供一种配备多媒体装置的连接器的相机模块及其制造方法，用于提高连接效率，以降低生产成本并提高耦合效率。 构成：配备有多媒体连接器的相机模块包括连接单元，相机模块（120）和连接器单元（130）。 连接单元在安装电路板的相机模块的一侧形成多个连接垫。 相机模块连接到连接单元。 相机模块在电荷耦合器件中形成图像传感器。 相机模块形成模块PCB。 模块PCB发送和接收图像传感器的图像和运动图像。 通过电路板的连接单元为摄像机模块的模块PCB形成导电膜层。

公开(公告)号：KR1020090099334A

公开(公告)日：2009-09-22

申请号：KR1020080024515

申请日：2008-03-17

Applicant: 삼성전기주식회사

Inventor： 이와나미케이치 ,  신영환

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K3/0026 ,  H05K3/3436 ,  H05K3/421 ,  H05K2201/09372 ,  H05K2201/09509 ,  H05K2201/10659

Abstract: A printed circuit board and a manufacturing method thereof are provided to secure high reliability of electric connection regardless of physical impact by integrating a blind via and a via land. A printed circuit board includes a core substrate(10), a blind via(12), a copper foil(14), a via land(16), a connection unit(18), and a solder ball pad(20). The blind via is formed in one side of the core substrate. An opening is formed in a blind via to one direction of the core substrate. The copper coil is formed in the other side of the core substrate to contact with the blind via. The via land is stacked on the copper foil. The connection unit passes through the copper foil and integrates the blind via and the via land. The solder ball pad contacts with the via land. The solder ball pad is made of nickel and gold.

Abstract translation: 提供一种印刷电路板及其制造方法，以通过集成盲通孔和通孔接地来确保电连接的高可靠性，而不管身体的影响。 印刷电路板包括芯基板（10），盲通孔（12），铜箔（14），通孔焊盘（16），连接单元（18）和焊球垫（20）。 盲通孔形成在芯基板的一侧。 在芯基板的一个方向上的盲孔中形成开口。 铜线圈形成在芯基板的另一侧以与盲孔接触。 通孔焊盘堆叠在铜箔上。 连接单元通过铜箔，并将盲孔和通孔焊盘集成。 焊球焊盘与通孔焊盘接触。 焊球垫由镍和金制成。

公开(公告)号：KR1020090098255A

公开(公告)日：2009-09-17

申请号：KR1020080023505

申请日：2008-03-13

Applicant: 삼성전기주식회사

Inventor： 고민철

IPC: H04N5/225

CPC classification number: H04N5/2251 ,  G02B5/208 ,  H05K13/0023 ,  H05K2201/09372 ,  H05K2203/049

Abstract: A web camera and a manufacturing method thereof are provided to reduce the manufacturing cost by simplifying the structure of the web camera and processes for manufacturing the web camera. A web camera comprises a web cam board(100), an image sensor bare chip(120) and optical units(130, 150). The web cam board is embedded in the main body case of the web camera. Various electronic elements are mounted on the web cam board and an upper-side pad(111) for bonding is formed. An external pad(121) for bonding electrically connected through the upper-side pad and a wire(W) is assembled on an upper side of the image sensor bare chip and a lens(L) is mounted.

Abstract translation: 提供网络摄像机及其制造方法，通过简化网络摄像机的结构和制造网络摄像机的过程来降低制造成本。 网络摄像机包括网络摄像板（100），图像传感器裸芯片（120）和光学单元（130,150）。 网状摄像板嵌入网络摄像机的主体外壳中。 各种电子元件安装在网状物凸轮板上，形成用于接合的上侧焊盘（111）。 用于通过上侧焊盘和线（W）电连接的用于接合的外部焊盘（121）组装在图像传感器裸芯片的上侧，并且安装透镜（L）。

公开(公告)号：KR1020090093630A

公开(公告)日：2009-09-02

申请号：KR1020080019267

申请日：2008-02-29

Applicant: 한국단자공업 주식회사

Inventor： 이성수

IPC: H05K1/09

CPC classification number: H05K1/113 ,  H05K1/116 ,  H05K2201/09372

Abstract: A printed circuit board is provided to prevent a short between pads by inserting a part of soldering into a contact auxiliary hole of a pad unit. A printed circuit board(100) includes a plurality of contact units(101), a plurality of pad units(103) and a plurality of contact auxiliary holes(108). The contact unit contacts the terminal of the electronic component. The pad unit is formed for the contact with the external device. The pad has a semi circular shape. The pad unit includes an upper pad(105) and a lower pad(106). The upper pad and the lower pad are electrically and physically connected. The contact auxiliary hole is formed in an overlap region of the upper pad and the lower pad. The inner surface of the contact auxiliary hole is plated with the copper. The contact auxiliary hole passes through the printed circuit board.

Abstract translation: 提供印刷电路板以通过将焊接部分插入焊盘单元的接触辅助孔来防止焊盘之间的短路。 印刷电路板（100）包括多个接触单元（101），多个垫单元（103）和多个接触辅助孔（108）。 接触单元接触电子部件的端子。 垫单元形成为用于与外部装置的接触。 垫具有半圆形。 垫单元包括上垫（105）和下垫（106）。 上焊盘和下焊盘电连接和物理连接。 接触辅助孔形成在上垫和下垫的重叠区域中。 接触辅助孔的内表面镀铜。 接触辅助孔穿过印刷电路板。

公开(公告)号：KR1020090046293A

公开(公告)日：2009-05-11

申请号：KR1020070112331

申请日：2007-11-05

Applicant: 삼성전기주식회사

Inventor： 김용구

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  H04N5/2252 ,  H05K3/3478 ,  H05K9/0024 ,  H05K13/046 ,  H05K2201/09372

Abstract: 본 발명은 전자파 방해를 차폐하기 위한 카메라 모듈의 조립 공정을 단순화하고 공정 관리를 용이하게 함으로써 제조비용을 절감하고 생산성을 향상하기 위한 것이다.
이를 위해, 본 발명은, 이미지센서가 실장된 모듈기판과, 상기 모듈기판의 상부에 설치되는 광학케이스 및 상기 광학케이스를 둘러싸도록 설치되고 하단부에 표면실장용 접지부가 절곡 형성된 실드케이스(shield case)를 포함하여 이루어진 카메라 모듈; 및 상기 표면실장용 접지부에 대응되는 접지패드가 상면에 형성되어, 상기 표면실장용 접지부가 상기 접지패드에 표면실장기술을 통해 접지됨에 의해 상기 카메라 모듈과 조립되는 외부연결기판;을 포함하는 전자파 방해를 차폐하기 위한 카메라 모듈의 조립구조 및 조립방법을 제공한다.
카메라 모듈, 이미지센서, 모듈기판, 광학케이스, 실드 케이스, 외부연결기판

公开(公告)号：KR100770430B1

公开(公告)日：2007-10-26

申请号：KR1020060094161

申请日：2006-09-27

Applicant: 삼성전기주식회사

Inventor： 이정훈 ,  김영신

IPC: H04N5/225 ,  G03B17/00

CPC classification number: H04N5/2251 ,  H05K1/0306 ,  H05K1/147 ,  H05K3/4007 ,  H05K2201/05 ,  H05K2201/09372 ,  H05K2203/0191

Abstract: A camera module is provided to reduce total height of the camera module by connecting a flexible printed circuit board and a ceramic board in a side surface instead of a lower part of the ceramic board using a conductive film. A camera module comprises the followings: an optical unit composed of a housing(2) coupling a lens barrel with multiple lenses; a ceramic board(21) which is closely connected in a lower part of the housing by mounting a passive component(22) and an image sensor in the up and low surface and has a plurality of pads(23) with the same interval; and a flexible printed circuit board(25) for surrounding at least two surfaces among the sides of the ceramic board.

Abstract translation: 提供一种照相机模块，通过使用导电膜将柔性印刷电路板和陶瓷板连接在陶瓷板的侧面而不是陶瓷板的下部，来降低相机模块的总高度。 相机模块包括以下部件：由将镜筒与多个透镜联接的壳体（2）组成的光学单元; 陶瓷板（21），其通过在上下表面中安装无源部件（22）和图像传感器而紧密地连接在壳体的下部，并且具有相同间隔的多个焊盘（23）; 以及用于围绕陶瓷板的侧面中的至少两个表面的柔性印刷电路板（25）。

公开(公告)号：KR1020070010451A

公开(公告)日：2007-01-24

申请号：KR1020050065022

申请日：2005-07-18

Applicant: 엘지전자 주식회사

Inventor： 이성규 ,  이광태 ,  한준욱

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K1/111 ,  H05K3/3436 ,  H05K2201/09372

Abstract: A pad structure of a printed circuit board and a method for manufacturing the same are provided to prevent damage of coupling between a pad and a solder ball at severe temperatures by reinforcing a pad with a reinforced core and coupling a pad and a solder ball 3-dimensionally. In a pad structure of a printed circuit board, a base(30) is formed on a dielectric layer and is electrically connected to a circuit pattern(25). A coupling part(31) is formed on the base(30) and penetrates through a solder resist. A ball receiving protrusion(32) is formed on the coupling part to receive a solder ball for an electrical connecting to the outside.

Abstract translation: 提供了一种印刷电路板的焊盘结构及其制造方法，用于通过用增强的芯增强焊盘并将焊盘和焊球3连接起来，以防止在严重的温度下焊盘和焊球之间的耦合损坏， 尺寸。 在印刷电路板的焊盘结构中，在电介质层上形成基极（30）并电连接到电路图案（25）。 在基座（30）上形成一个连接部件（31），并穿过阻焊剂。 在接合部上形成球接收突起（32），以接收用于与外部电连接的焊球。