Abstract:
Methods of fabricating a lanthanum oxide layer, and methods of fabricating a MOSFET and/or a capacitor especially adapted for semiconductor applications using such a lanthanum oxide layer are disclosed. The methods include a preliminary step of disposing a semiconductor substrate into a chamber. Tris(bis(trimethylsilyl)amino)Lanthanum as a lanthanum precursor is then injected into the chamber such that the lanthanum precursor is chemisorbed on the semiconductor substrate. Then, after carrying out a first purge of the chamber, at least one oxidizer is injected into the chamber such that the oxidizer is chemisorbed with the lanthanum precursor on the semiconductor substrate. Then, the chamber is purged a second time. The described steps of injecting the lanthanum precursor into the chamber, first-purging the chamber, injecting an oxidizer into the chamber, and second-purging the chamber may be sequentially and repeatedly performed to form a lanthanum oxide layer of a desired thickness having enhanced semiconductor characteristics.
Abstract:
신호의 품질 결정 장치 및 그 방법이 개시된다. 본 발명에 의한 신호 품질 결정 장치는, RF 신호로부터 얻은 이진 데이터를 이용하여 상기 RF 신호의 각각의 샘플 값에 대응하는 레벨을 결정한 후 상기 결정된 레벨에 대응하는 선택신호를 생성하는 신호 추정부; 상기 선택신호에 따라 상기 각각의 샘플 값을 상기 레벨별로 분류한 후 각 레벨별 샘플 값들의 평균값을 구하는 채널 식별부; 및 상기 채널 식별부로부터 출력된 상기 각각의 샘플 값과, 상기 각 레벨별 샘플 값들의 평균값을 이용하여 상기 RF 신호의 품질을 나타내는 신호 품질 값을 출력하는 품질 연산부를 포함하는 것을 특징으로 한다. 본 발명에 따르면, RF 신호의 품질을 보다 정확하게 결정할 수 있고, 결정된 신호 품질을 이용하여 포커스 보정, 틸트 보정, detrack 및 기록 신호 최적화 등을 수행할 수 있다.
Abstract:
PURPOSE: A showerhead for chemical vapor reactor in which a source is uniformly emitted from an outlet of the showerhead is provided. CONSTITUTION: The showerhead(100) for chemical vapor reactor is characterized in that first, second and third circular plates(110,120,150) are sequentially laid up and formed in such a way that the side surface of the first, second and third circular plates is sealed, at least two of 'n' source injection holes(114) arranged on a concentric circle separated from the central axis in a certain distance with the 'n' source injection holes being spaced apart from each other in an equal gap, and a reaction gas injection hole(112) penetrating the first circular plate are formed on the first circular plate, a reaction gas passing hole(122) corresponding to the reaction gas injection hole, and 'n' sectors uniformly split centering around the source injection holes are formed on the second circular plate, first groove(126) formed with respectively spaced apart from the central axis and outer circumference in a certain distance at a line extended to the source injection holes from the central axis, a plurality of second grooves(128) formed with extended from the first groove to a position that is spaced apart from a boundary line of the sectors in a certain distance, and a plurality of source dispersion holes(130) at the lower part of the second grooves are formed in the sectors, and a source passing hole(152) formed correspondingly to the source dispersion holes so that a source passing the source dispersion holes passes through the third circular plate, third groove(154) separated from the source passing hole in a certain distance and opened to the reaction gas injection hole so that the third groove becomes a diffusion path of the reaction gas, and a plurality of reaction gas injection holes at the lower part of the third groove are formed on the third circular plate.
Abstract:
An atomic layer deposition (ALD) method, whereby an organometallic complex with a beta-diketone ligand is chemically adsorbed onto a substrate and oxidized by activated oxygen radicals to deposit an atomic metal oxide layer on the substrate, uses reactive oxygen radicals generated using plasma and an organometallic complex having a beta-diketone ligand as a precursor, which could not be used in a thermal ALD method using oxygen or water as an oxidizing agent, to address and solve the problem of the removal of organic substances using organometallic complexes with beta-diketone ligands, thereby enabling diversification of the precursors for ALD and formation of excellent oxide films at low temperatures.
Abstract:
PURPOSE: A precursor for forming an HfO2 layer and a method for forming the HfO2 layer using the same are provided to be capable of improving electrical characteristics while a low temperature depositing process is carried out, and improving deposition speed and step coverage. CONSTITUTION: A precursor for forming an HfO2 layer is formed by coupling HfCl4 and nitrogen compound. Preferably, the nitrogen compound is one selected from a group consisting of pyridine based nitrogen compound, amine based nitrogen compound, and nitride based nitrogen compound. Preferably, the amine based nitrogen compound is the compound formed by the first chemical equation of 'NR1R2R3'. At this time, the 'R1', 'R2', 'R3' are predetermined alkyl radicals, respectively.
Abstract:
PURPOSE: A reaction chamber for forming an atomic layer is provided to reduce a deposition time for the atomic layer, prevent undesired generation of particles, and reduce a staying time of chemicals in the reaction chamber. CONSTITUTION: A wafer stage(42) is formed on a bottom of a housing(40). An exhaust hole(44) is formed around the wafer stage(42). A heating portion(46) and an upper plate(48) of predetermined thickness are installed on an upper portion of the wafer stage(42). A barrier rib(49) is formed between the housing(40) and the upper plate(48). A space between the housing(40) and the upper plate(48) is divided into two parts by the barrier rib(49). A gas supply tube(50) is connected with the housing(40). A precursor is supplied through the gas supply tube(50). An atomic layer is formed on a surface of a wafer by the supplied precursor. A gas supply tube(54) has an injection nozzle(52). An electrode plate(58) is installed at a bottom face of the upper plate(48). The electrode plate(58) is connected with an RF power source(56). A shower head(60) is installed under the upper plate(48). A plurality of holes(62) is formed in the shower head(60). A heating portion(64) is formed in the shower head(60).
Abstract:
PURPOSE: A cooling apparatus having a micro cooling fin is provided to improve heat transfer capacity by preventing a heat boundary layer formed on a smooth surface of the board to reduce heat transfer resistance. CONSTITUTION: A plurality of vibrating cooling fins(12) are extended from a board(10). An air blower blows air to the board to cool the board and the cooling fin, and supplies vibrating power to the vibrating cooling fin. The vibrating cooling fin is extended in a plane direction of the board, and has a cavity part under the vibrating cooling fin.
Abstract:
고속 위상 동기 루프와 그의 로킹 방법이 개시된다. 본 발명에 따른 고속 위상 동기 루프는 전압 제어 발진 수단, 발진 신호 분주 수단, 기준 신호 분주 수단, 주파수/위상 검출 수단 및 저역 통과 필터와 디지털/아날로그 변환 수단, 버퍼 및 스위치로 구성된 초기 제어 전압 발생 수단 및 제어 수단으로 구성되는 것을 특징으로 하며, 전압 제어 발진부가 기준 신호의 주파수에 근접한 주파수로 자주 발진 하도록 초기 제어 전압을 미리 설정하므로 위상 동기 루프의 로킹을 더욱 빨리 할 수 있는 효과가 있다.
Abstract:
이 고안은 디스플레이모니터와 같은 전자제품에서 그라운드용으로 사용되는 접지플레이트가 구비하는 탄성어스편부를 상호 교차되는 X자형으로 구성시켜 접지되도록 함으로써 보다 확실한 접지효과를 갖도록 개선된 전자제품용 접지플레이트에 관한 것으로서, 접지물에 고정되는 고정부와 상기 고정부로부터 절곡되어 피접지물과 접촉되는 한쌍의 탄성어스편부를 갖는 접지플레이트로서, 상기 한쌍의 탄성어스편부가 상호 X자형으로 교차되도록 형성하여 1,2차텐션력이 피접지물에 작용되도록 함에 따라 확실한 접지가 도모되는 효과가 있도록 한것이다.
Abstract:
미세 패턴을 형성할 수 있으며, 동시에 그 패턴 크기가 감소되지 않는 마스크에 대하여 설명한다. 본 발명은 투명한 기판과, 상기 투명한 기판 위에 형성된 차광막 패턴과, 상기 차광막 패턴 사이에 하프톤으로 형성된 더미 패턴을 가지는 마스크이다. 따라서, 동일한 디자인 롤에서 본 발명의 마스크를 사용하여 포토레지스트 패턴을 형성하는 경우 근접 효과에 의해서 포토레지스트 패턴의 크기가 감소되는 것을 방지할 수 있다.