MICRONEEDLE STRUCTURES AND CORRESPONDING PRODUCTION METHODS EMPLOYING A BACKSIDE WET ETCH
    141.
    发明申请
    MICRONEEDLE STRUCTURES AND CORRESPONDING PRODUCTION METHODS EMPLOYING A BACKSIDE WET ETCH 审中-公开
    麦克风结构和相应的生产方法

    公开(公告)号:US20090011158A1

    公开(公告)日:2009-01-08

    申请号:US12050209

    申请日:2008-03-18

    Abstract: A method for forming a hollow microneedle structure includes processing the front side of a wafer to form at least one microneedle projecting from a substrate with a first part of a through-bore, formed by a dry etching process, passing through the microneedle and through a part of a thickness of the substrate. The backside of the wafer is also processed to form a second part of the through-bore by a wet etching process.

    Abstract translation: 一种用于形成中空微针结构的方法包括处理晶片的前侧,以形成至少一个从基底突出的微针,该微针具有通过干蚀刻工艺形成的通孔的第一部分,穿过微针并通过 基板厚度的一部分。 晶片的背面也被处理以通过湿蚀刻工艺形成通孔的第二部分。

    Methods of fabricating microneedles with bio-sensory functionality
    143.
    发明申请
    Methods of fabricating microneedles with bio-sensory functionality 审中-公开
    制造具有生物感官功能的微针的方法

    公开(公告)号:US20080097352A1

    公开(公告)日:2008-04-24

    申请号:US11520526

    申请日:2006-09-12

    Abstract: A method of fabricating a microneedle is disclosed. The method includes forming at least one recess in a substrate, the at least one recess comprising an apex, forming an electrically seed layer on the substrate including the at least one recess, forming at least one electrically nonconductive pattern on a portion of the seed layer, the at least one nonconductive pattern being a pattern for a sensory area, plating an electrically conductive material on the seed layer to create a plated layer with an opening that exposes a portion of the nonconductive pattern and separating the plated layer from the seed layer and the at least one nonconductive pattern to release a hollow microneedle comprising a tip and at least one sensory area.

    Abstract translation: 公开了一种制造微针的方法。 该方法包括在衬底中形成至少一个凹部,所述至少一个凹部包括顶点,在衬底上形成包括所述至少一个凹部的电晶种层,在种子层的一部分上形成至少一个非导电图案 所述至少一个非导电图案是用于感觉区域的图案,在所述种子层上镀覆导电材料以产生具有暴露所述非导电图案的一部分并将所述镀层与所述种子层分离的开口的镀层,以及 所述至少一个非导电图案以释放包括尖端和至少一个感觉区域的中空微针。

    Wet etch processing
    144.
    发明申请
    Wet etch processing 失效
    湿式蚀刻处理

    公开(公告)号:US20070134829A1

    公开(公告)日:2007-06-14

    申请号:US11637020

    申请日:2006-12-12

    Abstract: A method of wet etching produces high-precision microneedle arrays for use in medical applications. The method achieves precise process control over microneedle fabrication, at single wafer or batch-level, using wet etching of silicon with potassium hydroxide (KOH) solution by accurately identifying the etch time endpoint. Hence, microneedles of an exactly required height, shape, sharpness and surface quality are achieved. The outcome is a reliable, reproducible, robust and relatively inexpensive microneedle fabrication process. Microneedles formed by KOH wet etching have extremely smooth surfaces and exhibit superior mechanical and structural robustness to their dry etched counterparts. These properties afford extra reliability to such silicon microneedles, making them ideal for medical applications. The needles can also be hollowed. Wet etched silicon microneedles can then be employed as masters to replicate the improved surface and structural properties in other materials (such as polymers) by moulding.

    Abstract translation: 湿蚀刻的方法产生用于医疗应用的高精度微针阵列。 该方法通过精确地识别蚀刻时间终点,通过使用氢氧化钾(KOH)溶液对硅进行湿蚀刻,在单晶片或批次水平上实现了微针制造的精确过程控制。 因此,实现了精确要求的高度,形状,锐度和表面质量的微针。 结果是可靠,可重现,稳健且相对便宜的微针制作工艺。 通过KOH湿蚀刻形成的微针具有非常光滑的表面,并且对其干蚀刻的对应物表现出优异的机械和结构坚固性。 这些性能为这种硅微针提供了额外的可靠性,使其成为医疗应用的理想选择。 针也可以是中空的。 湿法蚀刻的硅微针可用作主机,通过模制复制其他材料(如聚合物)中改进的表面和结构性能。

    Method of fabricating micro-needle array
    146.
    发明申请
    Method of fabricating micro-needle array 失效
    微针阵列制作方法

    公开(公告)号:US20060172541A1

    公开(公告)日:2006-08-03

    申请号:US11327463

    申请日:2006-01-09

    Inventor: Chang-seung Lee

    Abstract: A method of fabricating a micro-needle array is provided. The method of fabricating a micro-needle array having a substrate having a first surface and a second surface spaced in a predetermined interval apart from the first surface, includes patterning on the first surface, thereby forming a shape of micro-needle bodies. Further, micro-passageways are formed that penetrate the first surface of the substrate from the second surface by a porous silicon process, and integrates the micro-passageways, thereby forming the bodies and channels of micro-needles.

    Abstract translation: 提供一种制造微针阵列的方法。 制造具有第一表面和与第一表面隔开预定间隔的第二表面的基底的微针阵列的方法包括在第一表面上的图案化,从而形成微针体的形状。 此外,通过多孔硅工艺形成从第二表面穿透基板的第一表面的微通道,并且将微通道整合,从而形成微针的主体和通道。

    Microneedles for minimally invasive drug delivery
    148.
    发明授权
    Microneedles for minimally invasive drug delivery 失效
    用于微创药物递送的微针

    公开(公告)号:US06980855B2

    公开(公告)日:2005-12-27

    申请号:US10767485

    申请日:2004-01-29

    Applicant: Steve T. Cho

    Inventor: Steve T. Cho

    Abstract: The present invention provides a microneedle incorporating a base that is broad relative to a height of the microneedle, to minimize breakage. The microneedle further includes a fluid channel and a beveled non-coring tip. Preferably arrays of such microneedles are fabricated utilizing conventional semiconductor derived micro-scale fabrication techniques. A dot pattern mask is formed on an upper surface of a silicon substrate, with each orifice of the dot pattern mask corresponding to a desired location of a microneedle. Orifices are formed that pass completely through the substrate by etching. A nitride pattern mask is formed to mask all areas in which a nitride layer is not desired. A nitride layer is then deposited on the bottom of the silicon substrate, on the walls of the orifice, and on the top of the silicon substrate around the periphery of the orifice. The nitride layer around the periphery of the orifice is offset somewhat, such that one side of the orifice has a larger nitride layer. Anisotropic etching is used to remove a substantial portion of the substrate, creating a plurality of angular, blunt, and generally pyramidal-shaped microneedles. A subsequent removal of the nitride layer, followed by an isotropic etching step, softens and rounds out the blunt angular microneedles, providing generally conical-shaped microneedles. The uneven nitride layer adjacent the orifice ensures that the microneedles will include a beveled tip. Such microneedle arrays are preferably incorporated into handheld diagnostic and drug delivery systems.

    Abstract translation: 本发明提供了一种结合了相对于微针的高度宽的基底的微针,以使破损最小化。 微针还包括流体通道和倾斜的非取心尖端。 优选地,使用常规的半导体衍生的微尺度制造技术制造这种微针的阵列。 在硅基板的上表面上形成点阵图案掩模,点图案掩模的每个孔口对应于微针的期望位置。 形成通过蚀刻完全通过基板的孔。 形成氮化物图案掩模以掩盖不需要氮化物层的所有区域。 然后将氮化物层沉积在硅衬底的底部,孔的壁上,以及围绕孔的周边的硅衬底的顶部上。 围绕孔的周边的氮化物层稍微偏移,使得孔的一侧具有较大的氮化物层。 使用各向异性蚀刻去除基本部分的大部分,产生多个角,钝,通常为锥形的微针。 随后去除氮化物层,随后进行各向同性的蚀刻步骤,软化和圆化钝角微针,提供大致锥形的微针。 邻近孔口的不均匀氮化物层确保了微针将包括一个倾斜尖端。 这种微针阵列优选并入手持诊断和药物输送系统中。

    Orientation coating method of the top of micro tip
    149.
    发明申请
    Orientation coating method of the top of micro tip 审中-公开
    微尖顶方向涂层方法

    公开(公告)号:US20050163931A1

    公开(公告)日:2005-07-28

    申请号:US10508128

    申请日:2002-07-12

    CPC classification number: B81C1/00111 B81B2201/055 B82Y30/00

    Abstract: This invention relates to a method for locally depositing coatings on microtip apex. The technical procedures are listed as following. (1) Using parting layer to cover the tip body and only leave the apex protruded A parting layer was deposited on the entire microtip sample surface. The film thickness is thicker than the height of microtip. By thinning the parting layer, the tip apex was exposed, but the body remains being covered. The height of the exposed tip apex can be controlled by adjusting the thinning parameters. (2) Surface cleaning and passivation treatment Surface cleaning and passivation treatment are performed on the apex of the microtip according to actual needs. (3) Coating Based on actual needs, a selected functional thin film is coated on the microtip sample. (4) Remove the parting layer to form the locally coated tip By using an etchant that only react with the parting layer but not the microtip and the coated material, the parting layer can selectively removed, leave a locally coated microtip. Using the aforementioned method, it is able to perform surface cleaning and locally thin film depositing on microtip apex.

    Abstract translation: 本发明涉及一种在微尖端上局部沉积涂层的方法。 技术手续如下。 (1)使用分离层覆盖顶端体并且只留下顶点突出的A分离层沉积在整个微尖端样品表面上。 膜厚比微尖的厚度厚。 通过使分离层变薄,尖端尖端被暴露,但是身体保持被覆盖。 可以通过调整稀化参数来控制暴露顶端顶点的高度。 (2)表面清洁和钝化处理根据实际需要,在微尖端上进行表面清洁和钝化处理。 (3)涂层根据实际需要,在微尖端样品上涂覆选定的功能性薄膜。 (4)去除分层以形成局部涂覆的尖端通过使用仅与分离层反应但不与微尖端和涂覆材料反应的蚀刻剂,可以选择性地除去分层,留下局部涂覆的微尖端。 使用上述方法,能够在微尖端上进行表面清洁和局部薄膜沉积。

    Silicon micro-machined projection with duct
    150.
    发明授权
    Silicon micro-machined projection with duct 有权
    硅微加工突起与导管

    公开(公告)号:US06815360B1

    公开(公告)日:2004-11-09

    申请号:US09744152

    申请日:2001-02-08

    Abstract: A method of providing a microprojection (180) on the surface of a first material, the microprojection having a base portion adjacent the first material and a remote, or a tip portion, and a duct (182) at least in a region of the tip portion and the method comprising micro-machining the first material to provide the micro-projection duct. Various uses of the microprojection are also disclosed including light guides and cuvettes from micro-analytical systems, microneedles for transdermal fluid delivery or the like.

    Abstract translation: 一种在第一材料的表面上提供微喷射体(180)的方法,所述微喷射体具有与所述第一材料相邻的基部和至少在所述尖端的区域中的远端或尖端部分和管道(182) 部分,并且该方法包括微加工第一材料以提供微投影管。 还公开了微喷射体的各种用途,包括来自微分析系统的光导和比色皿,用于透皮流体输送的微针等。

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