Abstract:
A thermoplastic polymer composite formed article or a thermoplastic polymer composite formed article formed from a thermoplastic polymer or a thermoplastic polymer and a fiber, wherein the fiber is arranged along a first plane and the molecular chains of the thermoplastic polymer or thermoplastic polymer is oriented in the direction intersecting with the first plane, and the molecular chains of the thermoplastic polymer or thermoplastic polymer has a degree (α) of orientation in a range of 0. 5 or more and less than 1.0, and wherein the thermal expansion coefficients of said formed article in the direction along the first plane and in the direction intersecting with the first plane are both 5 × 10 -6 to 50 × 10 -6 (/K), and the difference between the thermal expansion coefficient in the direction along the first plane and the thermal expansion coefficient in the direction intersecting with the first plane is 30 × 10 -6 (/K) or less.
Abstract:
Prepregs (124), laminates (120, 122), printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins (132). In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
Abstract:
A polyolefin composite for a printed circuit board or an antenna base material. A base material (12) including the composite and electronic modules including the base material (12). The base material includes at least one dielectic layer including a polyolefin composite and at least one electroconductive layer (16) including an electroconductive material, the dielectric and electroconductive layers being intimately bonded to one another through an adhesive (14).
Abstract:
A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges, formed by laminating a conductive layer (56) to a flexible insulator layer (60), the conductor layer containing at least one conductive pathway (50) and the flexible insulator layer comprises fibers (48) dispersed in a matrix polymer. The fibers are oriented with respect to the conductive pathway so that the conductive pathway is substantially non-aligned with said fibers, substantially along an entirety of the conductive pathway in the flex section, so as to be flexible.
Abstract:
The invention relates to a method of manufacturing a composite laminate having a plurality of UD layers, i.e., layers of matrix material reinforced with unidirectionally oriented fibres, and at least one inner metal layer, i.e., a metal layer that does not form an outer surface of the laminate, the layers being arranged so as to give a balanced and symmetric laminate. The method comprises passing through a laminating zone, preferably a double-belt press, unidirectionally oriented (UD) fibres provided with not yet consolidated matrix material and consolidating the matrix material. In a first step a non-flowing sandwich laminate of at least three layers is formed, the at least three layers being UD and metal layers, the sandwich laminate being formed by passing UD fibres provided with not yet consolidated matrix material through the laminating zone together with metal foil, and in a second step the non-flowing sandwich laminate is provided on its outer surfaces with UD layers, with additional UD layers optionally being added in subsequent steps.
Abstract:
The present invention relates to a unidirectional glass fabric produced with continuous yarn (2, 3) which is twisted, plied or has zero twisting turns, with different gram weights and interlaced with thin glass yarns (3) as a stabilizing binding, use thereof in the manufacture of printed circuits and in numerous other industrial applications, and a method for the manufacture thereof.
Abstract:
The invention relates to a basic material for making a PWB laminate, which is a foiled UD-prepreg comprising a layer of a conductive metal foil bonded to a layer made up of parallel, unidirectionally oriented reinforcing fibres, having a diameter of below 30 νm, impregnated with not yet fully consolidated matrix resin. The foiled UD-prepreg can be used to manufacture UD-crossply PWB laminates by stacking and pressing them together with, in between, other UD-layers, which may be either non-foiled UD-prepreg layers, or non-flowing UD composite layers.