公开(公告)号：US09560757B2

公开(公告)日：2017-01-31

申请号：US14718367

申请日：2015-05-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiromi Murayama ,  Kazuaki Higashibata ,  Noboru Kato

IPC: H01L23/48 ,  H05K1/11 ,  G06K19/077 ,  H01Q1/22 ,  H01Q9/20 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/111 ,  G06K19/0772 ,  G06K19/07754 ,  G06K19/07756 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2924/15313 ,  H01Q1/2225 ,  H01Q9/20 ,  H05K1/0259 ,  H05K1/028 ,  H05K1/0295 ,  H05K1/03 ,  H05K2201/09427 ,  H05K2201/0979 ,  H05K2201/09954 ,  H05K2201/10628 ,  Y02P70/611

Abstract: A chip component includes external terminals on a mounting surface thereof at positions that are rotationally symmetric to each other by 180 degrees with respect to a center of the mounting surface. A substrate includes first and second mounting terminals on the mounting surface of the substrate at first diagonal positions of a square indicated by a two dot chain line, and third and fourth mounting terminals on the surface of the substrate at second diagonal positions of the square. The first and fourth mounting terminals are connected by a first terminal connecting portion, and the second and third mounting terminals are connected by a second terminal connecting portion. The chip component is configured to be mounted in any of four directions obtained by rotating the chip component every 90 degrees and achieves the same electrical characteristics.

Abstract translation: 芯片部件在其安装表面上包括相对于安装表面的中心相互旋转对称180度的位置的外部端子。 衬底包括在由两点划线表示的正方形的第一对角位置处的衬底的安装表面上的第一和第二安装端子，以及在正方形的第二对角线位置处的衬底的表面上的第三和第四安装端子。 第一和第四安装端子通过第一端子连接部分连接，第二和第三安装端子通过第二端子连接部分连接。 芯片部件被配置为安装在通过每90度旋转芯片部件而获得的四个方向中的任一个，并且实现相同的电特性。

公开(公告)号：US09549467B1

公开(公告)日：2017-01-17

申请号：US14041407

申请日：2013-09-30

Applicant: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration

Inventor： David J. Petrick ,  Luan Vo ,  Dennis Albaijes

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11

CPC classification number: G06F1/185 ,  G06F1/189 ,  H02H3/087 ,  H02J1/00 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10628 ,  Y02P70/611

Abstract: An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.

Abstract translation: 一种用于太空任务的电子组件，包括PCB和耦合到PCB的一个或多个多针CGA器件。 PCB具有一个或多个通孔在焊盘特征中，并且每个通孔内焊盘特征包括焊盘焊盘，其被配置为将一个或多个多引脚CGA器件的引脚耦合到通孔。 PCB还包括在PCB的中心平面上方和下方两个对称配置的多个层。

公开(公告)号：US20170006711A1

公开(公告)日：2017-01-05

申请号：US15106634

申请日：2014-11-10

Applicant: ROBERT BOSCH GMBH

Inventor： Uwe Liskow

IPC: H05K3/32 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K3/328 ,  H01R12/51 ,  H01R12/57 ,  H01R12/62 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/30 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/3421 ,  H05K5/0082 ,  H05K2201/09063 ,  H05K2201/10204 ,  H05K2201/1028 ,  H05K2201/10628 ,  H05K2201/10962 ,  H05K2203/107 ,  Y02P70/613

Abstract: An electronic control module includes a printed circuit board and an electrical component. The circuit board has a contact area arranged on a component side. The electrical component has an electrical connection element with a connection section running parallel to the component side and is electrically connected to the contact area. An adapter is arranged on the circuit board independently of the electrical component and has a holding body fastened to the circuit board outside the contact area and a metal web. The web is arranged on the holding body and has a contact section running parallel to the component side. The contact section and the connection section lie atop another and are welded to one another in a covering area. The web or the connection element makes electrical contact with the contact area by an electrically conductive material applied to the contact area.

Abstract translation: 电子控制模块包括印刷电路板和电气部件。 电路板具有布置在部件侧的接触区域。 电气部件具有电连接元件，其连接部分平行于部件侧延伸并且电连接到接触区域。 电路板上独立于电气部件设置适配器，并且具有在接触区域外部紧固到电路板的保持体和金属网。 卷筒纸布置在保持体上，并且具有平行于部件侧延伸的接触部分。 接触部分和连接部分位于另一个顶部并且在覆盖区域中彼此焊接。 网或连接元件通过施加到接触区域的导电材料与接触区域电接触。

公开(公告)号：US09508489B2

公开(公告)日：2016-11-29

申请号：US14442314

申请日：2013-11-11

Applicant: Kitagawa Industries Co., Ltd.

Inventor： Tatsuya Nakamura

IPC: H01G4/00 ,  H01G2/10 ,  H01G2/06

CPC classification number: H01G2/106 ,  H01G2/04 ,  H01G2/06 ,  H01G4/38 ,  H01G9/26 ,  H01G11/10 ,  H05K1/184 ,  H05K2201/10015 ,  H05K2201/10628

Abstract: A capacitor holder includes: a cylindrical portion made of a resin having a cylindrical shape and externally fitted to a capacitor; a pair of protrusions formed integrally with the cylindrical portion, the protrusions protruding in an outward direction of the cylindrical portion from positions opposed to each other with respect to an axis of the cylindrical portion; and a pair of metal pins protruding along the axis from axial end surfaces of the paired protrusions, the metal pins configured to solder the cylindrical portion and the protrusions to a printed circuit board. In the capacitor holder, a distance between the axis and outer circumferences of the protrusions is less than 0.76 times of an inner diameter of the cylindrical portion.

Abstract translation: 电容器保持器包括：圆柱形部分，其由具有圆柱形状的树脂制成并外部安装到电容器; 与所述圆筒部一体地形成的一对突起，所述突起从所述圆筒部的轴线相对的位置向所述圆筒部的向外方向突出; 以及一对金属销，其沿着轴线从所述成对突起的轴向端面突出，所述金属销被配置为将所述圆柱形部分和所述突起焊接到印刷电路板。 在电容器支架中，突起的轴线和外周之间的距离小于圆筒部的内径的0.76倍。

公开(公告)号：US20160284470A1

公开(公告)日：2016-09-29

申请号：US14442314

申请日：2013-11-11

Applicant: KITAGAWA INDUSTRIES CO., LTD.

Inventor： Tatsuya Nakamura

IPC: H01G2/10 ,  H01G2/06

CPC classification number: H01G2/106 ,  H01G2/04 ,  H01G2/06 ,  H01G4/38 ,  H01G9/26 ,  H01G11/10 ,  H05K1/184 ,  H05K2201/10015 ,  H05K2201/10628

Abstract: A capacitor holder includes: a cylindrical portion made of a resin having a cylindrical shape and externally fitted to a capacitor; a pair of protrusions formed integrally with the cylindrical portion, the protrusions protruding in an outward direction of the cylindrical portion from positions opposed to each other with respect to an axis of the cylindrical portion; and a pair of metal pins protruding along the axis from axial end surfaces of the paired protrusions, the metal pins configured to solder the cylindrical portion and the protrusions to a printed circuit board. In the capacitor holder, a distance between the axis and outer circumferences of the protrusions is less than 0.76 times of an inner diameter of the cylindrical portion.

Abstract translation: 电容器保持器包括：圆柱形部分，其由具有圆柱形状的树脂制成并外部安装到电容器; 与所述圆筒部一体地形成的一对突起，所述突起从所述圆筒部的轴线相对的位置向所述圆筒部的向外方向突出; 以及一对金属销，其沿着轴线从所述成对突起的轴向端面突出，所述金属销被配置为将所述圆柱形部分和所述突起焊接到印刷电路板。 在电容器支架中，突起的轴线和外周之间的距离小于圆筒部的内径的0.76倍。

公开(公告)号：US20130168146A1

公开(公告)日：2013-07-04

申请号：US13690853

申请日：2012-11-30

Applicant: JOINSET CO., LTD. ,  Jin-San KIM ,  Seo-Kyung KIM

Inventor： Jin-San KIM ,  Seo-Kyung KIM

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K3/3405 ,  H05K3/3421 ,  H05K2201/1031 ,  H05K2201/10356 ,  H05K2201/10628 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is a metal terminal block adapted for surface mounting, which includes a metal body having a three-dimensional shape, an outer surface of which includes at least one portion appropriate for vacuum pickup. The metal terminal block provided on a reel carrier through taping is picked up through the vacuum pickup on the portion of the outer surface of the metal body and is mounted on a conductive pattern of a circuit board through the surface mounting. A back surface of the metal terminal block is adhered to the conductive pattern through reflow soldering. The metal body has an insertion recess extending from a surface to an opposite surface thereto, or an insertion hole passing through a surface to an opposite surface thereto.

Abstract translation: 提供一种适用于表面安装的金属端子块，其包括具有三维形状的金属体，其外表面包括适于真空拾取的至少一个部分。 金属端子块通过真皮拾取器被拾取，该金属端子块通过胶带设置在卷轴托架上，并通过表面安装安装在电路板的导电图案上。 金属端子块的后表面通过回流焊接粘附到导电图案上。 金属体具有从表面延伸到相对表面的插入凹部，或者穿过表面到其相对表面的插入孔。

公开(公告)号：US20100085715A1

公开(公告)日：2010-04-08

申请号：US12247150

申请日：2008-10-07

Applicant: Steven M. Scheifers ,  Hope W. Chik ,  Andrew F. Skipor

Inventor： Steven M. Scheifers ,  Hope W. Chik ,  Andrew F. Skipor

IPC: H05K3/22 ,  H05K1/14

CPC classification number: H05K3/321 ,  H01L21/4867 ,  H01L23/498 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/225 ,  H05K3/3463 ,  H05K2201/0257 ,  H05K2201/0373 ,  H05K2201/10628 ,  H05K2203/176 ,  Y10T29/49004 ,  H01L2924/00

Abstract: A manufacturing method and manufacturing system for creating a modular electronic assembly are disclosed. The manufacturing system 300 may position a contact terminal 202 of a printed electronic component module 102 relative to a contact pad 204 of a printed electronic substrate 112. The manufacturing system 300 may connect the contact terminal 202 to the contact pad 204 using a conductive adhesive connection 116.

Abstract translation: 公开了一种用于创建模块化电子组件的制造方法和制造系统。 制造系统300可以相对于印刷电子基板112的接触垫204定位印刷电子部件模块102的接触端子202.制造系统300可以使用导电粘合剂连接将接触端子202连接到接触垫204 116。

公开(公告)号：US20060267719A1

公开(公告)日：2006-11-30

申请号：US11434845

申请日：2006-05-17

Applicant: Masatoshi Yasuda ,  Shin Kudo ,  Hiroshi Suzuki ,  Katsumi Kobayashi

Inventor： Masatoshi Yasuda ,  Shin Kudo ,  Hiroshi Suzuki ,  Katsumi Kobayashi

IPC: H01F27/28

CPC classification number: H01F17/045 ,  H01F27/027 ,  H01F27/292 ,  H01F27/38 ,  H01F2017/0093 ,  H05K3/321 ,  H05K2201/10628

Abstract: A coil component comprises a core element having a mounting portion, a coil conductor placed on the core element, and at least two terminal electrodes which are placed in the mounting portion. The mounting portion has at least two terminal placement areas for placing the terminal electrodes respectively. A hollow portion opening to the mounting side face of the mounting portion is formed in an area between the at least two terminal placement areas in the mounting portion. When mounting the coil component on a circuit board, conductive paste is intervened between an area from the terminal electrodes placed in the mounting portion of the core element to the base exposed area of the mounting portion, and the electrode patterns on the circuit board.

Abstract translation: 线圈部件包括具有安装部分的芯元件，放置在芯元件上的线圈导体和放置在安装部分中的至少两个端子电极。 安装部分具有用于分别放置端子电极的至少两个端子放置区域。 在安装部分的至少两个端子放置区域之间的区域中形成有通向安装部的安装侧面的中空部。 当将线圈部件安装在电路板上时，导电膏介于放置在芯元件的安装部分的端子电极的区域与安装部分的基底暴露区域之间以及电路板上的电极图案之间。

公开(公告)号：US06935867B1

公开(公告)日：2005-08-30

申请号：US10852911

申请日：2004-05-24

Applicant: Daisuke Takai ,  Kaoru Soeta

Inventor： Daisuke Takai ,  Kaoru Soeta

IPC: H01R33/76 ,  H01R12/00 ,  H01R13/24 ,  H05K1/18 ,  H05K3/32

CPC classification number: H01R13/2435 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10628

Abstract: A compact, simple connection unit for mounting an electronic component to a substrate includes connectors having one or more arm portions. The connectors are provided with internal stress, which allows the arm portions to grip the electronic component so that the electronic component can be firmly fixed to the substrate.

Abstract translation: 用于将电子部件安装到基板的紧凑且简单的连接单元包括具有一个或多个臂部分的连接器。 连接器设置有内部应力，这允许臂部分握住电子部件，使得电子部件能够牢固地固定到基板。

公开(公告)号：US06582100B1

公开(公告)日：2003-06-24

申请号：US09634909

申请日：2000-08-09

Applicant: Peter A. Hochstein ,  Gregg K. Reber

Inventor： Peter A. Hochstein ,  Gregg K. Reber

IPC: F21V2900

CPC classification number: F21V29/70 ,  F21V19/004 ,  F21V29/004 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/021 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/10598 ,  H05K2201/10628 ,  Y10S362/80 ,  H01L2924/00

Abstract: An electrically driven light emitting diode (LED) assembly and the method of assembling same. The assembly includes an electrically and thermally conductive heat dissipater (10) sandwiched under an electrically insulating layer (12) with circuit traces (14) disposed over the insulating layer (12) to prevent electrical conduction between the traces (14) and the heat dissipater (10). A plurality of light emitting diodes (20) have electrical leads (22) extending laterally from opposite extremities of each LED (20) to overlie the traces (14) for electrical contact with the traces (14) for powering the LEDs (20). An independent and generally U-shaped holding device (24, 26, 28, 30 and 32), as viewed in cross section, defines a base overlying the LED (20) and a pair of legs (36, 136) depending therefrom and transversely to the electrical leads (22) between the LED (20) and the heat dissipater (10). The base defines a hole (38) and the LED (20) protrudes (39) through the hole (38) to emit light. The insulating layer (12) includes a void (40) surrounding each LED (20) and the legs (36, 136) of each associated holding device (24, 26, 28, 30 and 32) and each holding device (24, 26, 28, 30 and 32) includes a tensioning portion (44 or 48) for applying a force urging the LED (20) through the void (40) and into thermal engagement with the heat dissipater (10) and the electrical leads (22) thereof into engagement with the traces (14). The tensioning portion may comprise barbs (44) on the legs (36, 136) and/or undulations (48) in the legs (36, 136).

Abstract translation: 电驱动发光二极管（LED）组件及其组装方法。 组件包括夹在电绝缘层（12）下面的导热散热器（10），电绝缘层（12）上布置有电路迹线（14），以防止迹线（14）和散热器 （10）。 多个发光二极管（20）具有从每个LED（20）的相对端部横向延伸的电引线（22）以覆盖迹线（14），用于与迹线（14）电接触以为LED（20）供电。 如横截面所示，独立且大致为U形的保持装置（24,26,28,30和32）限定了覆盖LED（20）的基部和从其垂直延伸的一对支腿（36,136） 到LED（20）和散热器（10）之间的电引线（22）。 底座限定孔（38），并且LED（20）穿过孔（38）突出（39）以发光。 绝缘层（12）包括围绕每个LED（20）的每个相关联的保持装置（24,26,28,30和32）和每个保持装置（24,26）的每个LED（20）和腿部（36,136）的空隙（40） ，28,30和32）包括用于施加推动所述LED（20）通过所述空隙（40）并与所述散热器（10）和所述电引线（22）热接合的力的张紧部分（44或48） 其与迹线（14）接合。 张紧部分可以包括腿部（36,136）上的倒钩（44）和/或腿部（36,136）中的起伏（48）。