Abstract:
An acceleration sensor includes a semiconductor substrate, a first layer formed on the substrate, a first aperture within the first layer, and a beam coupled at a first end to the substrate and suspended above the first layer for a portion of the length thereof. The beam includes a first boss coupled to a lower surface thereof and suspended within the first aperture, and a second boss coupled to an upper surface of the second end of the beam. A second layer is positioned on the first layer over the beam and includes a second aperture within which the second boss is suspended by the beam. Contact surfaces are positioned within the apertures such that acceleration of the substrate exceeding a selected threshold in either direction along a selected axis will cause the beam to flex counter to the direction of acceleration and make contact through one of the bosses with one of the contact surfaces.
Abstract:
An actuator element has a plate member, a piezoelectric/electrostrictive body disposed in facing, relation to the plate member, and a beam disposed between the plate member and the piezoelectric/electrostrictive body and fixing the piezoelectric/electrostrictive body to the plate member. The piezoelectric/electrostrictive body has a piezoelectric/electrostrictive layer, an upper electrode formed on a surface of the piezoelectric/electrostrictive layer which faces the plate member, and a lower electrode formed on a surface of the piezoelectric/electrostrictive layer which is opposite to the surface thereof facing the plate member. When an electric field is applied to the upper electrode and the lower electrode, a portion of the piezoelectric/electrostrictive body is displaced toward or away from the plate member.
Abstract:
A unilateral in-plane thermal buckle-beam microelectrical mechanical actuator is formed on a planar substrate of semiconductor material, for example. The actuator includes first and second anchors secured to the substrate and a floating shuttle positioned movably parallel to the substrate. Symmetric first and second sets of elongated thermal half-beams are secured between the floating shuttle and the respective first and second anchors. The first and second anchors and the first and second sets of thermal half-beams are positioned along one side of the floating shuttle. The half-beams are formed of semiconductor material, such as polysilicon. A current source directs electrical current through the thermal half beams via the anchors to impart thermal expansion of the thermal half-beams and hence linear motion of the floating center beam generally parallel to the substrate. A floating cold beam connected between the shuttle and the substrate constrains and amplifies the motion of the shuttle in a predefined direction.
Abstract:
A thermally actuated micro mirror includes a mirror surface, and a support structure section having a multilayer structure to support the mirror surface. The support structure section generates heat by the application of electricity thereto, and is deflected by a difference in coefficient of thermal expansion in the multilayer structure, thereby tilting the mirror surface at an arbitrary angle. The support structure section is disposed between the mirror surface and an electrode section for applying electricity. A longitudinal axis of the support structure section is perpendicular to the center axis of the mirror surface, and the longitudinal center of the support structure section is substantially placed on the center axis of the mirror surface. Therefore, the turning axis of the mirror surface is not displaced, and the light reflecting position does not move on the mirror surface.
Abstract:
A plurality of MEMS devices that can be easily configured to impart extended ranges of rotational and/or translational motion. The MEMS devices comprise a micro-electromechanical building block including a bendable member having a first end connectable to a support structure, and a straight rigid member having a first end connected to a second end of the bendable member. In the event the bendable member is in a straight condition, the rigid member extends from the second end of the bendable member toward the support structure. Further, the bendable member has a predetermined length, and the rigid member has a length at least within a range from one half to the full predetermined length of the bendable member to allow a free end of the rigid member to undergo extended rotational and/or translational motion in response to a displacement of the bendable member. The respective MEMS devices can be employed as actuators or sensors in a variety of micro-electromechanical and micro-opto-electromechanical applications.
Abstract:
An electrostatic bimorph actuator includes a cantilevered flexible bimorph arm that is secured and insulated at one end to a planar substrate. In an electrostatically activated state the bimorph arm is generally parallel to the planar substrate. In a relaxed state, residual stress in the bimorph arm causes its free end to extend out-of-plane from the planar substrate. The actuator includes a substrate electrode that is secured to and insulated from the substrate and positioned under and in alignment with the bimorph arm. An electrical potential difference applied between the bimorph arm and the substrate electrode imparts electrostatic attraction between the bimorph arm and the substrate electrode to activate the actuator. As an exemplary application in which such actuators could be used, a microelectrical mechanical optical display system is described.
Abstract:
The invention concerns a microsystem, in particular for producing microswitches or microvalves, constituted on a substrate (50) and used for producing a shift between a first operating state and a second operating state by means of a heat actuated device with bi-metal switch effect. The heat-actuated device comprises a deformable element (51) connected, by opposite ends, to the substrate (50) so as to present naturally a deflection without stress relative to the substrate surface which faces it, said natural deflection determining the first operating state, the second operating state being produced by the heat-actuated device which induces, by the effect of temperature variation, a deformation of the deformable element (51) tending to reduce its deflection and submitting it to a compressive stress by buckling effect in a direction opposite to its natural deflection.
Abstract:
A high-sensitive micro cantilever sensor and a method for fabricating the same which is able to reduce size of a system greatly using a functional thin film has a structure in which an upper substrate comprising one or two piezoelectric cells including a cantilever, a piezoelectric layer formed on lower or upper surface of the cantilever, and electrodes formed on upper and lower surfaces of the piezoelectric layer is attached to a lower substrate including a cavity of an even depth by contacting the lower surface of the piezoelectric cell on the upper substrate with the cavity surface of the lower substrate.
Abstract:
A bimorph structure is produced by depositing a first material on a first surface of a first substrate to form a first element structure. A second material is deposited onto a surface of a second substrate to form a second element structure. Electrodes are deposited on a surface of each of the first element structure and the second element structure. The first element structure is bonded to a first transfer substrate, and the second element structure is bonded to a second transfer substrate. The first substrate is removed from the first element structure, and the second substrate is removed from the second element structure. Second side electrodes are deposited on a second surface of each of the first element structures and the second element structure. The first element structure and the second element structure are directly bonded to each other. One of the first transfer substrate and the second transfer substrate is then removed, and the surface of the element structure from which one of the transfer substrates has been removed is bonded to a final target substrate. Thereafter, the other transfer substrate is removed, and electrical connections are made. In a further embodiment, a micro-electromechanical dimensioned bimorph structure includes a first element structure, and a second element structure. A bonding layer bonds the first element structure directly to the second element structure.
Abstract:
A high-sensitive micro cantilever sensor and a method for fabricating the same which is able to reduce size of a system greatly using a functional thin film has a structure in which an upper substrate comprising one or two piezoelectric cells including a cantilever, a piezoelectric layer formed on lower or upper surface of the cantilever, and electrodes formed on upper and lower surfaces of the piezoelectric layer is attached to a lower substrate including a cavity of an even depth by contacting the lower surface of the piezoelectric cell on the upper substrate with the cavity surface of the lower substrate.