Abstract:
There are provided a method for producing a transfer structure, in which detachment between a transfer-receiving material and a matrix can be easily achieved without destroying the fine pattern, the transfer pattern of the matrix is satisfactorily transferred to the transfer-receiving material, and the durability of the matrix is maintained for a long time during repeated transfer; and a matrix for use in the method. A film of a silane coupling agent represented by the following formula (I) is formed on a surface of a matrix having a transfer pattern formed on the surface thereof, a transfer-receiving material is applied thereon to transfer the pattern on the surface of the matrix, and the transfer-receiving material is detached from the matrix to obtain a transfer structure formed of the transfer-receiving material. In formula (I), n represents an integer of 8, 10, 12 or 14; m represents an integer of 3 or 4; and X, Y and Z each independently represent a hydrolyzable group that is a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, or a halogen atom.
Abstract:
This invention relates to an epoxy resin composition for an insulating film, an insulating film, and a printed circuit board including the same. Particularly in a printed circuit board using a build-up process, a skin layer and a roughness are formed on the surface of the insulating film using different curing starting temperatures, so that peel strength can be enhanced, thus enabling the formation of a fine pattern, and also, a coefficient of thermal expansion of the insulating film is low, thus preventing the deformation of the film.
Abstract:
Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.
Abstract:
The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.
Abstract:
There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.
Abstract:
A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.
Abstract:
The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.
Abstract:
An electroconductive ink made with metallic nanoparticles is disclosed. The ink contains an organophosphorus acid that increases adhesion between the deposited metallic layer and the substrate to which the metallic layer is applied.
Abstract:
There are provided a method for producing a transfer structure, in which detachment between a transfer-receiving material and a matrix can be easily achieved without destroying the fine pattern, the transfer pattern of the matrix is satisfactorily transferred to the transfer-receiving material, and the durability of the matrix is maintained for a long time during repeated transfer; and a matrix for use in the method. A film of a silane coupling agent represented by the following formula (I) is formed on a surface of a matrix having a transfer pattern formed on the surface thereof, a transfer-receiving material is applied thereon to transfer the pattern on the surface of the matrix, and the transfer-receiving material is detached from the matrix to obtain a transfer structure formed of the transfer-receiving material. In formula (I), n represents an integer of 8, 10, 12 or 14; m represents an integer of 3 or 4; and X, Y and Z each independently represent a hydrolyzable group that is a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, or a halogen atom.
Abstract:
An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.