公开(公告)号：US08313819B2

公开(公告)日：2012-11-20

申请号：US12854298

申请日：2010-08-11

Applicant: Andreas Hogg ,  Herbert Keppner ,  Thierry Aellen ,  Juergen Burger

Inventor： Andreas Hogg ,  Herbert Keppner ,  Thierry Aellen ,  Juergen Burger

IPC: B32B3/00 ,  B05D3/00

CPC classification number: A61N1/375 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K3/284 ,  H05K2201/09872 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets, each set having first, second and third layers. At least one of the first, second and third layers consist essentially of a polymer such as parylene and at least one of the other two layers of the set consist essentially of inorganic material such that each layer differs in at least one diffusion barrier property from the other layers in the set and adds to an overall barrier effect of the coating.

Abstract translation: 一种可植入医疗装置，其包括在基底上的多个部件，以及通过气相沉积施加的生物相容性多层涂层以符合和密封地覆盖部件和/或基底的至少一部分。 涂层涂覆至少两组，每组具有第一层，第二层和第三层。 第一层，第二层和第三层中的至少一层基本上由聚合物如聚对二甲苯组成，并且该组的另外两个层中的至少一层基本上由无机材料组成，使得每个层在至少一个扩散阻挡性质与 该组中的其它层并且增加了涂层的整体屏障效应。

公开(公告)号：US20120257364A1

公开(公告)日：2012-10-11

申请号：US13527258

申请日：2012-06-19

Applicant: Andrew Simon Hall Brooks ,  Timothy Allan Von Werne

Inventor： Andrew Simon Hall Brooks ,  Timothy Allan Von Werne

IPC: B32B27/08 ,  B05D5/00 ,  H05K7/06 ,  B05D3/10

CPC classification number: H05K3/284 ,  H05K2201/09872 ,  H05K2203/095 ,  Y10T428/31504 ,  Y10T428/31544

Abstract: An electrical assembly which comprises a substrate and a conformal coating deposited on at least one surface of the substrate by plasma polymerization of a compound of formula (I) and deposition of a resulting polymer of the compound of formula (I), and plasma polymerization of a fluorohydrocarbon and deposition of a resulting polymer of the fluorohydrocarbon, such that the resulting polymer of the compound of formula (I) and the resulting polymer of the fluorohydrocarbon create discrete layers of the conformal coating; wherein the compound of formula (I) is an organic compound.

Abstract translation: 一种电气组件，其包括通过式（I）化合物的等离子体聚合和所得到的式（I）化合物的所得聚合物沉积在基材的至少一个表面上沉积的基材和保形涂层，以及等离子体聚合 氟化烃和所得到的氟代烃聚合物的沉积，使得所得到的式（I）化合物的聚合物和所得氟代烃的聚合物产生不连续的共形涂层; 其中式（I）化合物是有机化合物。

公开(公告)号：US08004860B2

公开(公告)日：2011-08-23

申请号：US11468104

申请日：2006-08-29

Applicant: James F. Salzman

Inventor： James F. Salzman

IPC: H05K9/00

CPC classification number: H05K9/0084 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2203/0191 ,  H05K2203/0582

Abstract: An electrical device comprising an electronic component mounted to a surface of a printed circuit board, a ground connection on said surface, and electromagnetic interference (EMI) shielding. The EMI shielding includes an electrical insulator coating the electronic component, the insulator contacting the surface, and a conductive layer covering the electrical insulator, and contacting the electrical insulator and the ground connection.

Abstract translation: 一种电气设备，包括安装到印刷电路板的表面上的电子部件，所述表面上的接地连接和电磁干扰（EMI）屏蔽。 EMI屏蔽包括涂覆电子部件的电绝缘体，与表面接触的绝缘体和覆盖电绝缘体的导电层，以及接触电绝缘体和接地连接。

公开(公告)号：US20100116431A1

公开(公告)日：2010-05-13

申请号：US12689383

申请日：2010-01-19

Applicant: Ivan Pawlenko ,  Larry Samson

Inventor： Ivan Pawlenko ,  Larry Samson

IPC: B32B37/00 ,  B05C11/00

CPC classification number: H05K9/0083 ,  B82Y30/00 ,  C08K3/041 ,  C08K7/06 ,  C08K2201/011 ,  H05K1/0218 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/09872 ,  H05K2203/0126 ,  Y10T428/25 ,  Y10T428/31678

Abstract: A thermally conductive polymer composition is applied to mounted components to provide both thermal control and RF radiation attenuation. In order to improve the RF attenuation performance, a plurality of discrete conductive elements may be incorporated into the polymer composition, with the sizing, spacing and configuration of the suppressed most efficiently by the particular composition. The discrete conductive elements are significantly larger, on the order of 1-5 mils (approximately 25-127 μm) than the filler materials utilized to render the base polymer conductive. Also disclosed is an apparatus and a method for preparing and applying such a polymer composition to an electronic component.

Abstract translation: 将导热聚合物组合物应用于安装的组件以提供热控制和RF辐射衰减。 为了提高RF衰减性能，可以将多个离散的导电元件结合到聚合物组合物中，具有通过特定组合最有效地抑制的尺寸，间距和构型。 离散导电元件显着地大于用于使基础聚合物导电的填充材料大约1-5密耳（约25-127μm）。 还公开了一种用于制备和应用这种聚合物组合物到电子部件的装置和方法。

公开(公告)号：US20100108370A1

公开(公告)日：2010-05-06

申请号：US12263874

申请日：2008-11-03

Applicant: Christopher James Kapusta ,  Donald Paul Cunningham

Inventor： Christopher James Kapusta ,  Donald Paul Cunningham

IPC: H05K1/16 ,  H05K3/30

CPC classification number: H05K1/0218 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/20 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.

Abstract translation: 公开了一种形成用于电气系统的图案化保形结构的系统和方法。 共形结​​构包括形成为符合电气系统的表面的电介质涂层，其中电介质涂层具有位于电气系统表面上的接触焊盘上的多个开口。 共形结​​构还包括层叠在电介质涂层上和接触焊盘上的图案化导电涂层，使得在图案化的导电涂层和接触焊盘之间形成电连接。 图案化导电涂层包括互连系统，屏蔽结构和热路径中的至少一个。

公开(公告)号：US20090279269A1

公开(公告)日：2009-11-12

申请号：US12419514

申请日：2009-04-07

Applicant: Jason SHIUE

Inventor： Jason SHIUE

IPC: H05K5/00 ,  H05K3/28 ,  B05D5/00

CPC classification number: H05K3/284 ,  H05K2201/09872 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: A waterproof method for an electronic device and a waterproof electronic device are provided. The electronic device comprises a printed circuit board, which comprises a board, a plurality of electrical elements and a button device. The waterproof method comprises the following steps: applying a first non-solid adhesive to cover the button device directly, curing the first non-solid adhesive to form a first waterproof layer, applying a second non-solid adhesive to at least cover the electrical elements directly and curing the second non-solid adhesive to form a second waterproof layer. In the end, assembling the printed circuit board, sealed with the waterproof layers, into a case to form the waterproof electronic device.

Abstract translation: 提供了一种电子设备和防水电子设备的防水方法。 电子设备包括印刷电路板，其包括板，多个电气元件和按钮装置。 防水方法包括以下步骤：施加第一非固体粘合剂以直接覆盖按钮装置，固化第一非固体粘合剂以形成第一防水层，施加第二非固体粘合剂以至少覆盖电气元件 直接固化第二非固体粘合剂以形成第二防水层。 最后，将用防水层密封的印刷电路板组装成壳体以形成防水电子装置。

公开(公告)号：US20090277662A1

公开(公告)日：2009-11-12

申请号：US12168609

申请日：2008-07-07

Applicant: Jason Shiue

Inventor： Jason Shiue

IPC: H05K5/06 ,  B32B37/06

CPC classification number: H05K5/06 ,  A63B33/002 ,  A63B2071/0625 ,  H05K3/284 ,  H05K5/0017 ,  H05K2201/0133 ,  H05K2201/09872 ,  H05K2203/1311

Abstract: An electrical device is provided. The electrical device comprises a circuit board and a waterproof layer. The waterproof layer substantially seals at least one portion of the circuit board to prevent the short circuit after water infiltrating. Thereby, this particular structure provides superior waterproof protection for the electrical device. This electrical device may be installed in a band structure which facilitates portability. Moreover, the present invention further provides methods for sealing at least one portion of the electrical device or the circuit board hermetically, while the electrical device or the circuit board would be sealed with the waterproof layer hermetically.

Abstract translation: 提供电气设备。 电气装置包括电路板和防水层。 防水层基本上密封电路板的至少一部分，以防止水渗入后的短路。 因此，该特定结构为电气设备提供优异的防水保护。 该电气设备可以安装在便于携带的带状结构中。 此外，本发明还提供了用于密封电气装置或电路板的至少一部分的方法，同时电气装置或电路板将密封有防水层。

公开(公告)号：US5703761A

公开(公告)日：1997-12-30

申请号：US699327

申请日：1996-08-19

Applicant: Reinhold Heiss

Inventor： Reinhold Heiss

IPC: H01L23/552 ,  H05K1/02 ,  H05K3/28 ,  H05K9/00 ,  H05K7/14

CPC classification number: H05K9/0045 ,  H01L23/552 ,  H05K1/0218 ,  H01L2924/16152 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/1311 ,  H05K3/28 ,  Y10S174/34

Abstract: For shielding of flat modules having high-frequency components in information technology equipment, a surface of the shielding extends only over a region of the components to be shielded. The shielding surface is connected in an electrically conductive manner with a contact surface on the circuit board that surrounds the components.

Abstract translation: 为了在信息技术设备中屏蔽具有高频分量的平板模块，屏蔽层的表面仅在待屏蔽部件的区域上延伸。 屏蔽表面以导电方式连接在电路板上的围绕部件的接触表面。

公开(公告)号：US5438480A

公开(公告)日：1995-08-01

申请号：US151103

申请日：1993-11-12

Applicant: Masayasu Yamashita

Inventor： Masayasu Yamashita

IPC: H05K3/28 ,  H05K3/34 ,  H05K7/02 ,  H01L23/28

CPC classification number: H05K3/284 ,  H05K2201/09872 ,  H05K2201/10977 ,  H05K2203/1322 ,  H05K3/3447

Abstract: Disclosed are a printed circuit board which buries the leads of electronic parts mounted on a printed board into a coating material to prevent the occurrence of a leak between the leads, and an electronic part designed to suppress the occurrence of cracks in a coating layer formed by coating a coating material on the electronic part and a printed board after the former is mounted on the latter. The printed circuit board comprises a printed board, a frame provided on the soldering-surface side of the printed board to surround all or a part of the soldering surface of the printed board in such a way that the amount of protrusion of the frame from the soldering surface of the printed board is made larger than that of protrusion of the leads of the electronic parts from the soldering surface side of the printed board, and a coating material injected inside the frame to bury the leads that protrude from the printed board. The electronic part comprises a case body having side walls nearly perpendicular to the mount surface of the electronic part. The electronic part has a mount surface at which the electronic part is to be attached to the printed board when mounted thereon. The mount-surface side outer peripheral portions of the side walls of the case body are each formed to have a curved surface so that as the outer peripheral portions approach the mount surface, the outer peripheral portions extend further outward.

Abstract translation: 公开了一种印刷电路板，其将安装在印刷电路板上的电子部件的引线埋入涂层材料中，以防止引线之间发生泄漏;以及电子部件，其被设计成抑制由涂覆层形成的涂层中的裂纹的发生 在将前者安装在其上之后，在电子部件上涂覆涂层材料和印刷板。 印刷电路板包括印刷电路板，设置在印刷电路板的焊接表面侧上的框架，以围绕印刷电路板的焊接表面的全部或一部分，使得框架的突出量从 使得印刷电路板的焊接表面比电子部件的引线从印刷电路板的焊接表面侧突出的焊接表面大，并且注入到框架内部以将从印刷电路板突出的引线埋入的涂层材料。 电子部件包括壳体，其具有与电子部件的安装表面几乎垂直的侧壁。 电子部件具有安装表面，电子部件将安装在印刷电路板上。 壳体的侧壁的安装面侧外周部分各自形成为具有弯曲表面，使得当外周部接近安装表面时，外周部分进一步向外延伸。

公开(公告)号：US5370745A

公开(公告)日：1994-12-06

申请号：US960637

申请日：1992-10-14

Applicant: Mary O. Litteral

Inventor： Mary O. Litteral

IPC: B05B13/02 ,  B05B5/00 ,  B05C9/12 ,  B05C13/02 ,  B23Q41/04 ,  C23F1/00 ,  C23F1/08 ,  G05B19/418 ,  H05K3/00 ,  H05K3/28 ,  H05K13/00

CPC classification number: H05K3/0091 ,  H05K13/0061 ,  H05K13/0469 ,  H05K3/00 ,  H05K2201/09872 ,  H05K2203/0165 ,  H05K2203/1366 ,  H05K2203/1509 ,  Y10T29/49126 ,  Y10T29/49829 ,  Y10T29/53404

Abstract: Related operations are performed on workpieces, e.g., coating and curing circuit boards, of different types in random order in assembly line fashion on a rotary table of an apparatus under programmed control. The table is rotated stepwise to move successive sections thereof from a load-unload station at which the respective workpieces are loaded and unloaded in random order, to a sensing station at which the type and orientation of the workpiece is sensed, next to an initial work station at which initial work, e.g., coating, is performed on the workpiece in dependence upon its type and orientation previously sensed at the sensing station, then to a subsequent work station at which related subsequent work is performed on the workpiece, e.g., curing of the coating, and in turn back to the load-unload station to complete a cycle. The workpiece is either changed in orientation on the table section for a repeat cycle to perform further work thereon or is replaced by another workpiece in random order.

Abstract translation: 在编程控制下的装置的旋转台上以组装线的方式在不同类型的工件（例如，涂覆和固化电路板）上进行相关操作。 工作台逐步旋转以将相应工件的相继部分以相应的工件以随机顺序装载和卸载到其上感测工件的类型和定向的感测站，在初始工作旁边 根据其在感测站处先前感测到的类型和取向，在工件上对工件进行初始工作（例如涂层）的工作站，然后再到工件上进行相关后续工作的后续工作站，例如固化 涂层，然后又返回到装载站完成一个循环。 工件在工作台部分上的方向上改变重复循环，以在其上执行进一步的工作，或者以其他工件以随机顺序替换。