公开(公告)号：EP4245886A1

公开(公告)日：2023-09-20

申请号：EP21891519.7

申请日：2021-09-30

Applicant: MEC COMPANY., LTD.

Inventor： FUKUI Yu ,  AKIYAMA Daisaku ,  NAKANE Dai ,  NISHIE Kenji

IPC: C23F1/14 ,  H01L21/308 ,  H05K3/06

Abstract: The present invention includes an etching agent that selectively etches a copper layer of a processing target in which a noble metal layer containing a metal nobler than copper and the copper layer coexist, the etching agent including: a copper ion; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in a ring and an amino group-containing compound having 8 or less carbon atoms; a polyalkylene glycol; and a halogen ion, in which the polyalkylene glycol is contained in an amount of 0.0005% by weight or more and 7% by weight or less, and the halogen ion is contained in an amount of 1 ppm or more and 250 ppm or less.

公开(公告)号：EP3892400A1

公开(公告)日：2021-10-13

申请号：EP19892899.6

申请日：2019-11-29

Applicant: MEC COMPANY., LTD. ,  Osaka Research Institute of Industrial Science and Technology

Inventor： KATAYAMA Daisuke ,  NAKAZAWA Masato ,  IGAMI Kaori ,  SUGAHARA Takahiro ,  NAKAMOTO Takayuki ,  MIKI Takao ,  UCHIDA Sohei

IPC: B22F1/00 ,  B22F1/02 ,  B22F3/105 ,  B22F3/16 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00

Abstract: The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 µm or more and 150 µm or less, containing copper oxide in an amount of 0.10 g/m 2 or more and 7.0 g/m 2 or less per unit surface area and 0.5 mass% or more and 9.4 mass% or less per unit mass.

公开(公告)号：EP3438220B1

公开(公告)日：2020-11-25

申请号：EP17795817.0

申请日：2017-03-13

Applicant: MEC Company Ltd.

Inventor： AKIYAMA, Daisaku ,  SENGOKU, Yoichi ,  TOMATSU, Itsuro ,  OKADA, Masao ,  MITANI, Ryoko ,  JOKO, Keisuke ,  AMITANI, Yasutaka ,  SATOMI, Tokuya ,  TAKAHASHI, Masaru

IPC: C09D177/00 ,  B32B15/08 ,  C09D5/00 ,  C09D183/04 ,  C09J11/04 ,  C09J11/06 ,  C23C26/00 ,  H05K3/38 ,  C09D7/61 ,  C09D7/63

公开(公告)号：EP3680363A1

公开(公告)日：2020-07-15

申请号：EP18859430.3

申请日：2018-08-20

Applicant: MEC Company Ltd.

Inventor： OGINO, Yuki ,  SAKAMOTO, Takahiro ,  URUSHIBATA, Kaoru

IPC: C23F1/18 ,  H05K3/38

Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 µm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.

公开(公告)号：EP3257969B1

公开(公告)日：2020-04-22

申请号：EP16748997.0

申请日：2016-01-21

Applicant: MEC COMPANY LTD.

Inventor： OGINO, Yuki ,  TOJIMA, Mami ,  HAYASHIZAKI, Masahiro ,  OTANI, Minoru

IPC: C23F1/44 ,  C23F1/26 ,  C23G5/032 ,  C23G5/036 ,  H05K3/06 ,  H01L21/3213

公开(公告)号：EP2878705A1

公开(公告)日：2015-06-03

申请号：EP13762721.2

申请日：2013-03-04

Applicant: MEC COMPANY LTD.

Inventor： KURII, Masayo ,  TAI, Kiyoto ,  NAKAMURA, Mami

IPC: C23F1/18 ,  H05K3/38

CPC classification number: C23F1/18 ,  C23F1/34 ,  H05K3/0085 ,  H05K3/022 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A% by weight and a concentration of the polymer is B% by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract translation: 公开了一种用于铜微蚀刻剂，其的补充溶液以及用于生产接线板的方法。 的水溶液含有铜离子的有机酸，卤化物离子的本发明besteht的微蚀刻剂，对氨基具有17至400和聚合物的分子量基团的化合物。 该聚合物是一种水溶性聚合物包含聚胺链和/或阳离子基团，并且具有1,000或更高的重均分子量。 重量当含氨基的化合物的浓度是按重量计，并且聚合物的浓度A％是B％，本发明的微蚀刻剂的A / B的值是50到6000。根据本 发明中，对铜和树脂或类似物之间的粘附性可以甚至具有低蚀刻量被维持。

公开(公告)号：EP2259665B1

公开(公告)日：2012-02-08

申请号：EP10008962.2

申请日：2002-04-25

Applicant: MEC COMPANY LTD.

Inventor： Kawaguchi, Mutsuyuki ,  Hisada, Jun ,  Nakagawa, Toshiko

IPC: H05K3/38 ,  B32B15/08 ,  C23C22/52 ,  C23F11/14 ,  B32B37/00

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B37/0038 ,  B32B38/0012 ,  B32B2311/12 ,  B32B2398/00 ,  B32B2457/08 ,  C23C22/52 ,  H05K3/389 ,  Y10S428/91 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/273 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/3154 ,  Y10T428/31681

公开(公告)号：EP1253813B1

公开(公告)日：2011-12-14

申请号：EP02009464.5

申请日：2002-04-25

Applicant: MEC COMPANY LTD.

Inventor： Kawaguchi, Mutsuyuki, c/oMEC Company Ltd. ,  Hisada, Jun, c/oMEC Company Ltd. ,  Nakagawa, Toshiko, c/oMEC Company Ltd.

IPC: H05K3/38 ,  B32B15/08 ,  C23C22/52 ,  C23F11/14

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B37/0038 ,  B32B38/0012 ,  B32B2311/12 ,  B32B2398/00 ,  B32B2457/08 ,  C23C22/52 ,  H05K3/389 ,  Y10S428/91 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/273 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/3154 ,  Y10T428/31681

公开(公告)号：EP2226410A1

公开(公告)日：2010-09-08

申请号：EP10006632.3

申请日：2004-07-21

Applicant: MEC COMPANY LTD.

Inventor： Toda, Kenji ,  Morinaga, Yukari ,  Teshima, Takahiro ,  Kuroda, Ai

IPC: C23F1/18 ,  H05K3/06

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K2203/124

Abstract: The present invention concerns an etchant for copper and copper alloys, comprising an aqueous solution comprising:
14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions;
7 to 180 g/liter of hydrochloric acid; and
0.1 to 50 g/liter of tetrazole based compound.

Abstract translation: 本发明涉及铜和铜合金的蚀刻剂，其包含水溶液，其包含以铜离子浓度计的14至155g /升的铜离子源; 7〜180g / l盐酸; 和0.1〜50g / l的四唑类化合物。

公开(公告)号：EP1496061B1

公开(公告)日：2008-12-03

申请号：EP04015238.1

申请日：2004-06-29

Applicant: MEC COMPANY LTD.

Inventor： Otani, Minoru ,  Hisada, Jun ,  Mawatari, Toyoki

IPC: C07F1/00 ,  C23C16/00

CPC classification number: C23C18/08