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    Data serializer
    165.
    发明公开
    Data serializer 审中-公开
    数据串行器

    公开(公告)号：EP2515443A1

    公开(公告)日：2012-10-24

    申请号：EP11425112.7

    申请日：2011-04-21

    Applicant: STMicroelectronics SA ,  STMicroelectronics Srl ,  L'Université de Monastir

    Inventor： Zid, Mounir ,  Scandurra, Alberto ,  Pistritto, Carmelo ,  Tourki, Rached

    IPC: H03M9/00

    CPC classification number: H03M9/00

    Abstract: A data serializer comprising an input configured to receive a plurality of sets of parallel data, each set of data comprising n bits and at least one serializing stage configured to receive a set of n bits of parallel data and to convert said parallel data to a serial stream of data, said at least one serializing stage comprising a chain of flip flops each of which is arranged to selectively receive one of a bit of data and data output from a preceding flip flop, an output of a last flip flop of said chain of flip flops providing said serial stream of data.

    Abstract translation: 一种数据串行化器，包括被配置为接收多组并行数据的输入，每组数据包括n位，并且至少一个串行化级被配置为接收一组n位并行数据并将所述并行数据转换为串行 数据流，所述至少一个串行化级包括一串触发器，每一个触发器被安排为选择性地接收从前一个触发器输出的一位数据和数据中的一个，所述链的最后一个触发器的输出 提供所述串行数据流的触发器。

    Method and structures for indexing dice
    166.
    发明公开
    Method and structures for indexing dice 有权
    方法和结构索引芯片

    公开(公告)号：EP2282338A3

    公开(公告)日：2012-10-24

    申请号：EP10183726.8

    申请日：2004-04-19

    Applicant: STMicroelectronics Srl

    Inventor： Brambilla, Daniele Alfredo ,  Valtolina, Marco Natale

    IPC: H01L23/544

    CPC classification number: H01L23/544 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54466 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of indexing a plurality of dice (410;710;810) obtained from a material wafer (100) comprising a plurality of stacked material layers, each die being obtained in a respective die position (1-16) in the wafer, the method including providing a visible index (420;720;820) on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure (422,425,430;725,730;730,825, 826) adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker (435;745,775,780;775,780,845) associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.

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